The Comprehensive Chamber of Temperature, Humidity, Height and Vibration
The comprehensive chamber of temperature, humidity, height and vibration is suitable for aviation, aerospace, weapons, ships, nuclear industry and other information electronic instruments, all kinds of electronic machines, parts and components, as well as materials, processes, etc. in temperature, humidity, height (≤30000 meters) and vibration and other climatic environment and mechanical environment simulation test and comprehensive environmental test of the combination of factors.
Main parameters of the comprehensive chamber of temperature, humidity, height and vibration:
Effective size of the studio: D1200×W1200×H1000mm (other sizes can be customized)
Temperature range: -70℃ ~ +150℃
Humidity range: 20% ~ 98%(atmospheric pressure condition, highly comprehensive test is adjusted)
Heating time: ≥10℃/min (-55℃ ~ +85℃, atmospheric pressure, 150kg aluminum)
Cooling time: ≥10℃/min (-55℃ ~ +85℃, atmospheric pressure, 150kg aluminum)
Air pressure range: normal pressure ~ 0.5kPa
Sinusoidal and random excitation force: 100kN
Maximum acceleration: 100g
Frequency range: 5 ~ 2500Hz
Working surface: φ640mm
Comprehensive test capacity:
► Temperature + humidity comprehensive test:
Temperature range: +20℃ ~ +85℃; Humidity range: 20% ~ 98%.
► Temperature + height comprehensive test:
Temperature range: -55℃ ~ +150℃; Height range: ground ~ 30000m.
► Temperature + humidity + height comprehensive test:
Temperature range: +20℃ ~ +85℃; Humidity range: 20% ~ 95%(the highest humidity is highly correlated); Height range: ground ~ 15200m. Some parameters can be further expanded according to the specific requirements of the comprehensive test.
►Temperature + humidity + height + vibration comprehensive test:
Temperature range: +20℃ ~ +85℃; Humidity range: 20% ~ 95%(the highest humidity is highly correlated); Height range: ground ~ 15200m, vibration parameters correspond to vibration table specifications. Some parameters can be further expanded according to the specific requirements of the comprehensive test.
The comprehensive chamber of temperature, humidity, height and vibration meets the standard:
►GB/T2423.1 Test A: Low temperature test method
►GB/T2423.2 Test B: High temperature test method
►GB/T2423.3 Constant temperature and humidity test
►GB/T2423.4 alternating temperature and humidity test
►GB/T2423.21 low pressure test method
►GB/T2423.27 Low temperature low pressure and humidity continuous comprehensive test
►GJB150.2A Low pressure (altitude) test
►GJB150.3A high temperature test
►GJB150.4A low temperature test
►GJB150.9A temperature and humidity test
►GJB150.24A temperature - humidity - vibration - height test
►GJB150.2 Military equipment environmental test method Low pressure test
►GJB150.6 military equipment environmental test method temperature-height test;
►GJB150.19 Military equipment environmental test method temperature - height - humidity test;
►RTCA-DO-160 related test requirements;
Vibration Of The Comprehensive Chamber
Vibration of the comprehensive chambers reproduce the use environment of electronic instruments, auto parts, ships, aerospace and other industry products, to achieve temperature, humidity, vibration comprehensive composite test.
● Functional Features of vibration of the comprehensive chamber
According to the purpose of the test, the setting place and the fixing method of the sample, a reasonable matching mode between the test chamber and the shaking table should be selected. The test chamber and shaking table can be combined to carry out compound test, or test separately.
● Product application of vibration of the comprehensive chamber
Vibration of the comprehensive chambers are mainly used in aviation, aerospace, ships, weapons, electrical, electronic, automobile and automobile parts, motorcycles, communications, scientific research institutes, metrology and other industries to determine electrical and electronic products, instruments or other equipment in the transport, storage, use of reliability test. It is mainly made of temperature and humidity test chamber with corresponding vibration table, which can independently complete the corresponding temperature, humidity, vibration test (vertical and horizontal direction) and the combination test of three factors.
Burn-in Testing
Burn-in testing is the process by which a system detects early failures in semiconductor components (infant mortality), thereby increasing a semiconductor component reliability. Normally burn-in tests are performed on electronic devices such as laser diodes with an Automatic Test Equipment laser diode burn-in system that runs the component for an extended period of time to detect problems.
A burn-in system will use cutting-edge technology to test the component and provide precision temperature control, power and optical (if required) measurements to ensure the precision and reliability required for manufacturing, engineering evaluation, and R&D applications.
Burn-in testing may be conducted to ensure that a device or system functions properly before it leaves the manufacturing plant or to confirm new semiconductors from the R&D lab are meeting designed operating requirements.
It is best to burn-in at the component level when the cost of testing and replacing parts is lowest. Burn-in of a board or an assembly is difficult because different components have different limits.
It is important to note that burn-in test is usually used to filter out devices that fail during the “infant mortality stage” (beginning of bathtub curve) and does not take into count the “lifetime” or wearout (end of the bath tub curve) – this is where reliability testing comes into play.
Wearout is the natural end-of-life of a component or system related to continuous use as a result of materials interaction with the environment. This regime of failure is of particular concern in denoting the lifetime of the product. It is possible to describe wearout mathematically allowing the concept of reliability and, hence, lifetime prediction.
What Causes Components to Fail During Burn-in?
The root cause of fails detected during burn-in testing can be identified as dielectric failures, conductor failures, metallization failures, electromigration, etc. These faults are dormant and randomly manifest into device failures during device life-cycle. With burn-in testing, an Automatic Test Equipment (ATE) will stress the device, accelerating these dormant faults to manifest as failures and screen out failures during the infant mortality stage.
Burn-in testing detects faults that are generally due to imperfections in manufacturing and packaging processes, which are becoming more common with the increasing circuit complexity and aggressive technology scaling.
Burn-in Testing Parameters
A burn-in test specification varies depending on the device and testing standard (military or telecom standards). It usually requires the electrical and thermal testing of a product, using an expected operating electrical cycle (extreme of operating condition), typically over a time period of 48-168 hours. The thermal temperature of the burn-in test chamber can range from 25°C to 140°C .
Burn-in is applied to products as they are made, to detect early failures caused by faults in manufacturing practice.
Burn In Fundamentally performs the following:
Stress + Extreme Conditions + Prolong Time = Acceleration of “Normal/Useful life”
Types of Burn-in Tests
Dynamic Burn-in : the device is exposed to high voltage and temperature extremes while being subjected to various input stimuli .
A burn-in system applies various electrical stimuli to each device while the device is exposed to extreme temperature and voltage. The advantage of dynamic burn-in is its ability to stress more internal circuits, causing additional failure mechanisms to occur. However, dynamic burn-in is limited because it cannot completely simulate what the device would experience during actual use, so all the circuit nodes may not get stressed.
Static Burn-in : Device under test (DUT) is stressed at elevated constant temperature for an extended period of time.
A burn-in system applies extreme voltage or currents and temperatures to each device without operating or exercising the device. The advantages of static burn-in are its low cost and simplicity.
How is a Burn-In Test Performed?
The semiconductor device is placed onto special Burn-in Boards (BiB) while the test is executed inside special Burn-in Chamber (BIC).
Know more about Burn-in Chamber（Click here）
Burn-in Chamber
A burn-in chamber is an environmental oven used to evaluates the reliability of multiple semiconductor devices and performs large capacity screenings for premature failure (infant mortality). These environmental chambers are designed for static and dynamic burn-in of integrated circuits (ICs) and other electronic devices such as laser diodes.
Selecting Chamber Size
The chamber size depends on the size of the burn-in board, the number of products in each burn-in board, and the number of batches required per day to meet production requirements. If the interior space is too small, insufficient space between parts results in poor performance. If it is too large, space, time and energy are wasted.
Companies that are purchasing a new burn-in set-up should work with the vendor to ensure the heat source has enough steady-state and maximum capacity to match the load for the DUT.
When using forced recirculating airflow, parts benefit from spacing, but the oven can be loaded more densely vertically because airflow is distributed along the entire side wall. Parts should be kept 2-3 inches (5.1 – 7.6cm) from the oven walls.
Burn-in Chamber Design Specs
Temperature Range
Depending on the requirements of the Device Under Test (DUT) select a chamber that has a dynamic range such as 15°C above ambient to 300°C (572°F)
Temperature Accuracy
It is important that the temperature does not fluctuate. Uniformity is the maximum difference between the highest and lowest temperatures in a chamber at a specified setting. A specification of at least 1% setpoint for uniformity and 1.0°C control accuracy is acceptable in most semiconductor burn-in applications.
Resolution
A high-temperature resolution of 0.1°C will provide the best control to meet burn-in requirements
Environmental Savings
Consider a burn-in chamber that has a refrigerant that has a zero ozone layer depletion coefficient. Burn-in chambers with refrigeration are related to chambers operating in temperatures below 0 degrees Celsius down to – 55°C.
Chamber configuration
The chamber can be designed with card cages, card-slots, and access doors to simplify connecting DUT boards and driver boards with ATE stations.
Chamber Air Flow
In most cases a forced convection oven with recirculating airflow will provide the best distribution of heat and significantly speeds the time-to-temperature and heat transfer to parts. Temperature uniformity and performance depends on a fan design that directs air to all areas of the chamber.
The chamber can be design with a horizontal or vertical airflow. It is important to know the direction of inserting the DUT based on the airflow of the chamber.
Custom ATE Wiring
When it comes to measuring over hundreds of devices, inserting wires through an aperture or test hole may not be practical. Custom wiring connectors can be mounted directly to the oven to facilitate the electrical monitoring of the device with an ATE.
How A Burn-in Oven Controls Temperature
The burn-in oven uses a temperature controller executing a standard PID (proportional, integral, derivative) algorithm. The controller senses the actual temperature value versus the desired setpoint value, and issues corrective signals to the heater calling for application ranging anywhere from no heat to full heat. A fan is also used to equalize the temperature through the chamber.
The most common sensor used for accurate temperature control of the environmental oven is a Resistance Temperature Detector (RTD) which a platinum-based unit typically referred to as a PT100.
Sizing The Chamber
If you are using an existing oven, basic thermal modelling based on factors such as the oven’s thermal capacity and losses, heat-source output, and DUT mass will allow you to verify that the oven and heat source are sufficient to reach desired temperature with a thermal time constant short enough for tight loop response under the controller’s direction.
High and Low Temperature Low Pressure Test Equipment & Rapid Decompression Device
High and low temperature low pressure test chamber：
(1). Main technical indicators
1. Studio size: 1000D×1000W×1000H mm, the internal size is about 1000L
2. External size: about 3400D×1400W×2010H mm, excluding the controller, test hole and other prominent parts.
3. Temperature range: -70℃ ~ +150℃
4. Temperature fluctuation: ≤±0.5℃, normal pressure, no load
5. Temperature deviation: ±2℃, normal pressure, no load
6. Temperature uniformity: ≤2℃, atmospheric pressure, no-load
7. Heating rate: +20℃→+150℃≤60min
8. Cooling rate: +20℃→-65℃≤60min
9. Humidity range: Humidity 20% ~ 98%RH (temperature +20℃ ~ +85℃ range)
10. Humidity deviation: ≤+ 2-3%RH (> 75%RH), ≤±5%RH(≤75%RH), under normal pressure and no-load conditions.
11. Pressure range: normal pressure ~ 0.5kPa
12. Pressure reduction rate: normal pressure ~ 1.0kPa≤30min
13. Pressure recovery rate: ≤10.0kPa/min
14. Pressure deviation: normal pressure ~ 40kPa:≤±2kPa, 40KPa ~ 4kPa:≤±5%kPa, below 4kPa:≤± 0.1kPa
15. Wind speed: frequency conversion adjustment
16. Power: about 50kW
17. Noise: ≤75dB (A), 1 meter away from the front of the chamber and 1.2 meters above the ground.
18. Weight: 1900Kg
(2). Rapid decompression device (optional)
In order to meet the requirements of rapid depressurization, an independent rapid depressurization chamber is processed. The rapid depressurization chamber is composed of a shell assembly, a pressure assembly, a door assembly, an interface and a moving frame. Before rapid decompression, the user needs to connect an external pipeline.
1. Studio size: 400mm deep x 500mm wide x 600mm long; The internal wall material is processed with 3.0 SUS304/2B, and 5mm square pipe is used as the pressure reinforcement.
2. External dimension: 530mm deep ×700mm wide ×880mm long, the external wall material is made of 1.2mm cold-rolled steel plate, the surface is sprayed white (consistent with the color of the chamber);
3. A pressure sensor port is reserved at the top of the container. The control sensor port is located at the rear of the container to facilitate the quick buck device to be routed.
4. For the convenience of moving fast buck device. Install four lifting casters under the frame; The moving frame is welded by ordinary steel and sprayed on the surface.
5. Rapid decompression process: In order to improve the pumping speed of rapid depressurization chamber, the test chamber is first pumped to about 1kPa, and the electric valve connecting the test chamber equipment and the fast reducing device is opened to realize the fast reducing function, and the valve is closed when it reaches 18.8kPa. The constant pressure in the fast relief chamber can be achieved by auxiliary pumping (intake valve).
(3). Product implementation standards
1. GB/T2423.1-2008 Test A: Low temperature test
2. GB/T2423.2-2008 Test B: Low temperature test
3. GB/T 2423.3-2006 test Cab: constant temperature and humidity test
4. GB/T 2423.4-2008 test Db: alternating temperature and humidity test
5. GB/T2423.21-2008 Test M: Low pressure test method
6. GB/T2423.25-2008 test Z/AM: Low temperature/low pressure comprehensive test
7. GB/T2423.26-2008 Test Z/BM: high temperature/low pressure comprehensive test
8. General requirements for GJB150.1-2009
9. GJB150.2A-2009 Low pressure (altitude) test
10. GJB150.3A-2009 high temperature test
11. GJB150.4A-2009 low temperature test
12. GJB150.6-86 temperature-height test
13. GJB150.19-86 Temperature - humidity - height test
14. DO16F rapid decompression test
15. GB/T 10586-2006 temperature and humidity test chamber technical conditions
16. GB/T 10590-2006 high temperature low pressure test chamber technical conditions
17. GB/T 10592-2008 high and low temperature test chamber technical standard
18. GB/T 5170.1-2008 General Rules for inspection methods of environmental test equipment for electrical and electronic industry
19. GB/T 5170.2-2008 Electrical and electronic products environmental test equipment test method temperature and humidity test equipment
20. GB/T 5170.5-2008 Electrical and electronic products environmental test equipment test method temperature and humidity test equipment
GB/T 5170.10-2008 Electrical and electronic products environmental test equipment test method high temperature low pressure test equipment
Burn-in Board for Reliability Testing
Semiconductor equipment that test and screen out early failures during the “infant mortality” stage are put on a board known as “Burn-in Board”. On a burn-in board, there are multiple sockets to place the semiconductor device (ie. laser diode or photodiode). The number of devices which are placed on a board can consist of low batches of 64 to over 1000 devices at the same time.
These burn-in boards are then inserted into the burn-in oven which can be controlled by an ATE (Automatic Test Equipment) that supplies the mandatory voltages towards the samples while maintaining the desired oven temperature. The electrical bias applied may either be static or dynamic.
Usually the semiconductor components (ie. Laser Diodes) are pushed beyond what they will have to go through in normal use. This ensures that the manufacturer can be confident that they have a robust laser diode or photo diode device and that the component can meet reliability and qualification standards.
Burn-in Board material options:
IS410
IS410 is a high-performance FR-4 epoxy laminate and prepreg system designed to support the printed circuit board industry’s requirements for higher levels of reliability and the trend to use lead free solder.
370HR
370HR laminates and prepregs are made using a patented high performance 180°C Tg FR-4 multifunctional epoxy resin system that is designed for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.
BT Epoxy
BT epoxy is widely chosen for its outstanding thermal, mechanical, and electrical properties. This laminate is suitable for lead-free PCB assembly. It is primarily used for multilayer board applications. It features excellent electro migration, insulation resistance, and high thermal resistance. It also maintains bond strength at high temperature.
Polymide
BT epoxy is widely chosen for its outstanding thermal, mechanical, and electrical properties. This laminate is suitable for lead-free PCB assembly. It is primarily used for multilayer board applications. It features excellent electro migration, insulation resistance, and high thermal resistance. It also maintains bond strength at high temperature.
Nelco 4000-13
Nelco® N4000-13 series is an enhanced epoxy resin system engineered to provide both outstanding thermal and high signal speed / low signal loss properties. N4000-13 SI® is excellent for applications that require optimum signal integrity and precise impedance control, while maintaining high reliability through CAF 2 and thermal resistance.
Burn-in Board Thickness:
0.062” – 0.125” (1.57 mm – 3.17 mm)
Burn-in Board Applications:
During the burn-in process extreme temperatures often ranging from 125°C – 250°C or even 300°C are applied so the materials used need to be extremely durable. IS410 is used for burn-in board applications up to 155°C and typically a polyimide for applications up to 250°C.
Burn-in boards can be used in environmental testing conditions such as:
HAST (Highly Accelerated Temperature and Humidity Stress)
LTOL (Low Temperature Operating Life)
HTOL (High Temperature Operating Life)
Burn-in Board Design Requirements:
One of the most important considerations is selecting the highest possible reliability and quality for the Burn in Board and the test socket. You don’t want your Burn in board or socket to fail before the device under test. Therefore, all active/passive components and connectors should comply with high-temperature requirements, and all materials and components should meet high-temperature and aging requirements.
What is Environmental Testing?
The electronic devices and industrial products we rely on every day are affected by the environment in many ways, including temperature, humidity, pressure, light, electromagnetic waves and vibration. Environmental testing analyzes and evaluates the impact of these environmental factors on the product to determine its durability and reliability.
Guangdong Lab Companion LTD., has 10 million yuan registered capital and 3 R & D manufacturing plants in Dongguan, Kunshan and Chongqing. Lab Companion has been specialized in high and low temperature test equipment technology for 19 years, operating according to ISO9001, ISO14001, ISO 45001, ISO27001 four systems, setting sales and maintenance service centers in Shanghai, Wuhan, Chengdu, Chongqing, Xi 'an and Hong Kong. We work closely with International Organization of Leg al Metrology, Chinese Academy of Sciences, State Grid, China Southern Power Grid, Tsinghua University, Peking University, Hong Kong University of Science and Technology and other research institutions.
Main products of Lab Companion includes high and low temperature test chamber, constant temperature and humidity test chamber, rapid temperature cycling test chamber, thermal shock test chamber, high and low temperature and low pressure test chamber, vibration of the comprehensive chamber, industrial oven, vacuum oven, nitrogen oven, etc, providing high quality experimental equipment for universities, research institutes, medical health, inspection and quarantine, environmental monitoring, food and drugs, automobile manufacturing, petrochemical, rubber and plastic products, IC semiconductor, IT manufacturing and other fields.
Is the Future of Semiconductors Bright?
Thanks to the rise of the concept of "5G+ Internet of everything" and the rapid development of new energy vehicles, the demand for chips has increased comprehensively. And because of the impact of the epidemic and Sino-US trade friction, the supply of chips has been affected, so the domestic market will flourish under these factors.
The following is a conceptual diagram of the semiconductor industry chain:
It can be intuitively seen that the semiconductor industry is a very large industrial chain, and the terminal of the final use is inseparable from our lives. They are essentially chips made of silicon wafers.
The following is the flow chart of the chip production:
As can be seen in the figure above, the aging test of the chip is an essential part, and the aging test of the chip needs to use a professional industrial oven for aging test and high temperature baking.
The aging test not only led to the development of industrial ovens, but also led to the development of wafer boxes, automatic plying machines, tape braiding machines and other equipment. This process alone has such a large industry, which shows that the future of semiconductors is still relatively optimistic.
High Temperature Aging Cabinet
High temperature aging cabinet is a type of aging equipment used to remove early failure of non-conforming product parts.
Use of temperature aging cabinet, aging oven:
This test equipment is a test equipment for aviation, automobile, home appliances, scientific research and other fields, which is used to test and determine the parameters and performance of electrical, electronic and other products and materials after temperature environment changes in high temperature, low temperature, alternating between temperature and humidity or constant temperature and humidity.
The chamber of the test equipment is sprayed with steel plate after treatment, and the spray color is optional, generally beige. SUS304 mirror stainless steel is used in the inner room, with a large window tempered glass, real-time observation of internal aging products.
Features of temperature aging cabinet, aging oven:
1. PLC processing industry touch screen programming combination control, balanced temperature control system: aging specimen room temperature rise start the ventilation fan, balance the sample heat, aging cabinet is divided into product area and load area
2. PID+SSR temperature control system: according to the temperature change in the specimen box, the heat of the heating tube is automatically adjusted to achieve the temperature balance, so that the heating heat of the system is equal to its heat loss and achieve the temperature balance control, so it can run stably for a long time; The fluctuation of temperature control is less than ±0.5℃
3. The air transport system is composed of three-phase asynchronous electronic multi-wing wind wheel and wind drum. The wind pressure is large, the wind speed is uniform, and the uniformity of each temperature point is met
4. High precision PT100 platinum resistance for temperature acquisition, high accuracy for temperature acquisition
5. Load control, the load control system provides ON/OFF control and timing control two functional options to meet the different test requirements of the product
(1)ON/OFF function introduction: The switch time, stop time, and cycle times can be set, the test product can be switched according to the setting requirements of the system, the stop cycle control, the aging cycle number reaches the set value, the system will automatically sound and light prompt
(2) Timing control function: the system can set the running time of the test product. When the load starts, the product power supply starts timing. When the actual timing time reaches the time set by the system, the power supply to the product is stopped
6. System operation safety and stability: The use of PLC industrial touch screen control system, stable operation, strong anti-interference, convenient program change, simple line. Perfect alarm protection device (see protection mode), real-time monitoring of the operating status of the system, with the function of automatic maintenance of temperature data during operation, in order to query the temperature historical data when the product is aging, the data can be copied to the computer through the USB interface for analysis (format is EXCEL), with historical data curve display function, It intuitively reflects the temperature change in the product area during the product test, and its curve can be copied to the computer in BMP format through the USB interface, so as to facilitate the operator to make the test product report. The system has the function of fault query, the system will automatically record the alarm situation, when the equipment fails, the software will automatically pop up the alarm screen to remind the cause of the fault and its solution; Stop the power supply to the test product to ensure the safety of the test product and the equipment itself, and record the fault situation and occurrence time for future maintenance.
Thermal Cycling Test(TC) & Thermal Shock Test(TS)
Thermal Cycling Test(TC):
In the life cycle of the product, it may face various environmental conditions, which makes the product appear in the vulnerable part, resulting in product damage or failure, and then affect the reliability of the product.
A series of high and low temperature cycling tests are done on the temperature change at the temperature variation rate of 5~15 degrees per minute, which is not a real simulation of the actual situation. Its purpose is to apply stress to the test piece, accelerate the aging factor of the test piece, so that the test piece may cause damage to the system equipment and components under environmental factors, in order to determine whether the test piece is correctly designed or manufactured.
Common ones are:
Electrical function of the product
The lubricant deteriorates and loses lubrication
Loss of mechanical strength, resulting in cracks and cracks
The deterioration of the material causes chemical action
Scope of application:
Module/system product environment simulation test
Module/System Product Strife test
PCB/PCBA/ Solder Joint Accelerated Stress Test (ALT/AST)...
Thermal Shock Test(TS):
In the life cycle of the product, it may face various environmental conditions, which makes the product appear in the vulnerable part, resulting in product damage or failure, and then affect the reliability of the product.
High and low temperature shock tests under extremely harsh conditions on rapid temperature changes at a temperature variability of 40 degrees per minute are not truly simulated. Its purpose is to apply severe stress to the test piece to accelerate the aging factor of the test piece, so that the test piece may cause potential damage to the system equipment and components under environmental factors, in order to determine whether the test piece is correctly designed or manufactured.
Common ones are:
Electrical function of the product
The product structure is damaged or the strength is reduced
Tin cracking of components
The deterioration of the material causes chemical action
Seal damage
Machine specifications:
Temperature range: -60 ° C to +150 ° C
Recovery time: < 5 minutes
Inside dimension: 370*350*330mm (D×W×H)
Scope of application:
PCB reliability acceleration test
Accelerated life test of vehicle electric module
LED parts accelerated test...
Effects of temperature changes on products:
The coating layer of components falls off, the potting materials and sealing compounds crack, even the sealing shell cracks, and the filling materials leak, which causes the electrical performance of components to decline.
Products composed of different materials, when the temperature changes, the product is not evenly heated, resulting in product deformation, sealing products cracking, glass or glassware and optics broken;
The large temperature difference makes the surface of the product condense or frost at low temperature, evaporates or melts at high temperature, and the result of such repeated action leads to and accelerates the corrosion of the product.
Environmental effects of temperature change:
Broken glass and optical equipment.
The movable part is stuck or loose.
Structure creates separation.
Electrical changes.
Electrical or mechanical failure due to rapid condensation or freezing.
Fracture in a granular or striated manner.
Different shrinkage or expansion characteristics of different materials.
The component is deformed or broken.
Cracks in surface coatings.
Air leak in the containment compartment.
Semiconductor Chip-Car Gauge Chip
A new energy vehicle is divided into several systems, MCU belongs to the body control and vehicle system, is one of the most important systems.
MCU chips are divided into 5 levels: consumer, industrial, vehicle gauge, QJ, GJ. Among them, the car gauge chip is the current vane product. So what does the car gauge chip mean? From the name, it can be seen that the car gauge chip is the chip used in the car. Different from ordinary consumer and industrial chips, the reliability and stability of the car gauge chip is extremely important, so as to ensure the safety of the car at work.
The certification standard of the car gauge level chip is AEC-Q100, which contains four temperature levels, the smaller the number, the higher the level, the higher the requirements for the chip.
It is precisely because the requirements of the car gauge chip are so high, it is necessary to carry out a strict Burn In test before the factory, BI test requires the use of professional BI oven, our BI oven can meet the BI test of today's car gauge chip.
Connect the EMS system, so that each batch of baked chips can be traced at any time. High temperature and low temperature vacuum anaerobic environment, real-time monitoring of baking curve to ensure baking safety and effect.
Vibrational Verification for Functionality(VVF)
In the vibration generated during transportation, freight boxes are susceptible to complex dynamic pressures, and the resonant response generated is violent, which may cause packaging or product failure. Identifying the critical frequency and the type of pressure on the package will minimize this failure. Vibration testing is the assessment of the vibration resistance of components, components and complete machines in the expected transport, installation and use environment.
Common vibration modes can be divided into sinusoidal vibration and random vibration. Sinusoidal vibration is a test method often used in the laboratory, which mainly simulates the vibration generated by rotation, pulsation and oscillation, as well as the resonance frequency analysis and resonance point residence verification of the product structure. It is divided into sweep frequency vibration and fixed frequency vibration, and its severity depends on the frequency range, amplitude value and test duration. Random vibration is used to simulate the overall structural seismic strength assessment of the product and the shipping environment in the packaged state, with the severity depending on the frequency range, GRMS, test duration and axial orientation.
Vibration can not only loosen the lamp components, so that the internal relative displacement, resulting in de-welding, poor contact, poor working performance, but also make the components produce noise, wear, physical failure and even component fatigue.
To this end, Lab Companion launched a professional "LED lamp vibration test" business to simulate the vibration or mechanical shock that may occur in the actual transportation, installation and use environment of the lamp, evaluate the vibration resistance of the LED lamp and the stability of its related performance indicators, and find the weak link that may cause damage or failure. Improve the overall reliability of LED products and improve the failure status of the industry due to transportation or other mechanical shocks.
Service customers: LED lighting factory, lighting agents, lighting dealers, decoration companies
Test method:
1, the LED lamp sample packaging placed on the vibration test bench;
2, the vibration speed of the vibration tester is set to 300 RPM, the amplitude is set to 2.54 cm, start the vibration meter;
3, the lamp according to the above method in the upper and lower, left and right, front and back three directions respectively test for 30 minutes.
Results evaluation: After the vibration test, the lamp can not occur parts falling off, structural damage, lighting and other abnormal phenomena.
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