High and Low Temperature Test Standard for PC Plastic Material

High and Low Temperature Test Standard for PC Plastic Material 

First, high temperature test

After being placed at 80±2°C for 4 hours and at normal temperature for 2 hours, the dimensions, insulation resistance, voltage resistance, key function, and loop resistance should meet normal requirements, and the appearance should not be deformed, warped, or degumming. Key bumps collapsing at high temperatures and reduced pressing force are not evaluated.

Second, low temperature test

After being placed at -30±2℃ for 4 hours and at normal temperature for 2 hours, the dimensions, insulation resistance, voltage resistance, key function, and loop resistance should meet normal requirements, and the appearance should not be deformed, warped, or degumming. 

Third, temperature cycling test

After being placed in 70±2℃ for 30 minutes, remove at room temperature for 5 minutes; then after being placed in -20±2℃ for 30 minutes, remove at room temperature for 5 minutes. After such 5 cycles, the dimensions, insulation resistance, voltage resistance, key function, and loop resistance should meet normal requirements, and the appearance should not be deformed, warped, or degumming. Key bumps collapsing at high temperatures and reduced pressing force are not evaluated.

Fourth, heat resistance

After being placed in an environment with a temperature of 40±2℃ and a relative humidity of 93±2%RH for 48 hours, the dimensions, insulation resistance, voltage resistance, key function, and loop resistance should meet normal requirements, and the appearance should not be deformed, warped, or degumming. Key bumps collapsing at high temperatures and reduced pressing force are not evaluated.