Stable Temperature Test Chamber

• Reliability Test for Light-emitting Diodes for Communication

  Oct 09, 2024

  Reliability Test for Light-emitting Diodes for Communication Communication light-emitting diode failure determination: Provide a fixed current to compare the optical output power, and determine failure if the error is greater than 10% Mechanical stability test: Impact test: 5tims/axis, 1500G, 0.5ms Vibration test: 20G, 20 ~ 2000Hz, 4min/cycle, 4cycle/axis Liquid thermal shock test: 100℃(15sec)←→0℃(5sec)/5cycle Solder heat resistance: 260℃/10 seconds /1 time Solder adhesion: 250℃/5 seconds Durability test: Accelerated aging test: 85℃/ power (maximum rated power)/5000 hours, 10000 hours High temperature storage: maximum rated storage temperature /2000 hours Low temperature storage test: maximum rated storage temperature /2000 hours Temperature cycle test: -40℃(30min)←85℃(30min), RAMP: 10/min, 500cycle Moisture resistance test: 40℃/95%/56 days, 85℃/85%/2000 hours, sealing time Communication diode element screening test: Temperature screening test: 85℃/ power (maximum rated power)/96 hours screening failure determination: Compare the optical output power with the fixed current, and determine failure if the error is larger than 10% Communication diode module screening test: Step 1: Temperature cycle screening: -40℃(30min)←→85℃(30min), RAMP: 10/min, 20cycle, no power supply Step 2: Temperature screening test: 85℃/ power (maximum rated power)/96 hours      

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