Reliability Test for Light-emitting Diodes for Communication

Reliability Test for Light-emitting Diodes for Communication

Communication light-emitting diode failure determination:

Provide a fixed current to compare the optical output power, and determine failure if the error is greater than 10%

Mechanical stability test:

Impact test: 5tims/axis, 1500G, 0.5ms

Vibration test: 20G, 20 ~ 2000Hz, 4min/cycle, 4cycle/axis

Liquid thermal shock test: 100℃(15sec)←→0℃(5sec)/5cycle

Solder heat resistance: 260℃/10 seconds /1 time

Solder adhesion: 250℃/5 seconds

Durability test:

Accelerated aging test: 85℃/ power (maximum rated power)/5000 hours, 10000 hours

High temperature storage: maximum rated storage temperature /2000 hours

Low temperature storage test: maximum rated storage temperature /2000 hours

Temperature cycle test: -40℃(30min)←85℃(30min), RAMP: 10/min, 500cycle

Moisture resistance test: 40℃/95%/56 days, 85℃/85%/2000 hours, sealing time

Communication diode element screening test:

Temperature screening test: 85℃/ power (maximum rated power)/96 hours screening failure determination: Compare the optical output power with the fixed current, and determine failure if the error is larger than 10%

Communication diode module screening test:

Step 1: Temperature cycle screening: -40℃(30min)←→85℃(30min), RAMP: 10/min, 20cycle, no power supply

Step 2: Temperature screening test: 85℃/ power (maximum rated power)/96 hours