Instructions:
Early temperature cycle tests only look at the air temperature of the test furnace. At present, according to the requirements of relevant international norms, the temperature variability of the temperature cycle test refers not to the air temperature but the surface temperature of the product to be tested (such as the air temperature variability of the test furnace is 15°C/min, but the actual temperature variability measured on the surface of the product to be tested may only be 10~11°C/min), and the temperature variability that will rise and cool down also needs symmetry, repeatability (the rise and cooling waveform of each cycle is the same), and linear (the temperature change and cooling speed of different loads is the same). In addition, lead-free solder joints and part life assessment in advanced semiconductor manufacturing processes also have many requirements for temperature cycle testing and temperature shock, so its importance can be seen (such as: JEDEC-22A-104F-2020, IPC9701A-2006, MIL-883K-2016). The relevant international specifications for electric vehicles and automotive electronics, their main test are also based on the temperature cycle test of the surface of the product (such as :S016750, AEC-0100, LV124, GMW3172).
Specification for the product to be tested surface temperature cycle control requirements:
1. The smaller the difference between the sample surface temperature and the air temperature, the better.
2. Temperature cycle rise and fall must be over temperature (exceed the set value, but not exceed the upper limit required by the specification).
3. The surface of the sample is immersed in the shortest time. Time (soaking time is different from residence time).
Thermal stress testing machine (TSC)of LAB COMPANION in the temperature cycle test of the product to be tested surface temperature control features:
1. You can choose [air temperature] or [temperature control of the product to be tested] to meet the requirements of different specifications.
2. The temperature change rate can be selected [equal temperature] or [average temperature], which meets the requirements of different specifications.
3. The deviation of temperature variability between heating and cooling can be set separately.
4. Overtemperature deviation can be set to meet the requirements of the specification.
5.[temperature cycle] and [temperature shock] can be selected table temperature control.
IPC requirements for temperature cycle test of products:
PCB requirements: The maximum temperature of the temperature cycle should be 25°C lower than the glass transfer point temperature (Tg) value of the PCB board.
PCBA requirements: The temperature variability is 15°C/min.
Requirements for solder:
1. When the temperature cycle is below -20 °C, above 110 °C, or contains the above two conditions at the same time, more than one damage mechanism may occur to the solder lead welding connection. These mechanisms tend to accelerate each other, leading to early failure.
2. In the process of slow temperature change, the difference between the sample temperature and the air temperature in the test area should be within a few degrees.
Requirements for vehicle regulations: According to AECQ-104, TC3(40°C←→+125°C) or TC4(-55°C←→+125°C) is used in accordance with the environment of the engine room of the car.
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