ESS Rapid Temperature Change Stress Screening Machine
Environmental Stress Screening (ESS)
Stress screening is the use of acceleration techniques and environmental stress under the design strength limit, such as: burn in, temperature cycling, random vibration, power cycle... By accelerating the stress, the potential defects in the product emerge [potential parts material defects, design defects, process defects, process defects], and eliminate electronic or mechanical residual stress, as well as eliminate stray capacitors between multi-layer circuit boards, the early death stage of the product in the bath curve is removed and repaired in advance, so that the product through moderate screening, Save the normal period and decline period of the bathtub curve to avoid the product in the process of use, the test of environmental stress sometimes lead to failure, resulting in unnecessary losses. Although the use of ESS stress screening will increase the cost and time, for improving the product delivery yield and reduce the number of repairs, there is a significant effect, but for the total cost will be reduced. In addition, customer trust will also be improved, generally for electronic parts of the stress screening methods are pre-burning, temperature cycle, high temperature, low temperature, PCB printed circuit board stress screening method is temperature cycle, for the electronic cost of the stress screening is: Power pre-burning, temperature cycling, random vibration, in addition to the stress screen itself is a process stage, rather than a test, screening is 100% of the product procedure.
Product features of rapid temperature change stress screening machine:
1, It can set different stress screening temperature variation of 5°C/min, 10°C/min and 15°C/min.
2, It can perform rapid temperature change (stress screening), condensation test, high temperature and humidity, temperature and humidity cycle and other tests.
3, It meets the requirements of electronic equipment product stress screening test.
4, It can be switched between equal temperature and average temperature two test methods.
Specification requirements of rapid temperature change stress screening machine:
1, It can set a variety of stress screening (fast temperature variability) 5°C/min, 10°C/min and 15°C/min test conditions.
2, It meets the stress screening of electronic equipment products, lead free process, MIL-STD-2164, MIL-344A-4-16, MIL-2164A-19, NABMAT-9492, GJB-1032-90, GJB/Z34-5.1.6, IPC-9701 and other test requirement.
3, It can perform equal temperature and average temperature test mode.
4, It uses aluminum sheet to verify the load capacity of the machine (non-plastic load).
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