High and Low Temperature Test Chamber

• Laptop Test Conditions

  Oct 16, 2024

  Laptop Test Conditions Notebook computer from the early 12-inch screen evolution to the current LED backlit screen, its computing efficiency and 3D processing, will not be lost to the general desktop computer, and the weight is becoming less and less burden, the relative reliability test requirements for the entire notebook computer is becoming more and more stringent, from the early packaging to the current boot down, the traditional high temperature and high humidity to the current condensation test. From the temperature and humidity range of the general environment to the desert test as a common condition, these are the parts that need to be considered in the production of notebook computer related components and design, the test conditions of the relevant environmental tests collected so far are organized and shared with you. Keyboard tapping test: Test one: GB:1 million times Key pressure :0.3~0.8(N) Button stroke :0.3~1.5(mm) Test 2: Key pressure: 75g(±10g) Test 10 keys for 14 days, 240 times per minute, a total of about 4.83 million times, once every 1 million times Japanese manufacturers :2 to 5 million times Taiwan manufacturer 1: more than 8 million times Taiwan Manufacturer 2:10 million times Power switch and connector plug pull test: This test model simulates the lateral forces that each connector can withstand under abnormal usage. General laptop test items: USB, 1394, PS2, RJ45, Modem, VGA... Equal application force 5kg(50 times), up and down left and right pull and plug. Power switch and connector plug test: 4000 times (Power supply) Screen cover opening and closing test: Taiwanese manufacturers: open and close 20,000 times Japanese manufacturer 1: opening and closing test 85,000 times Japanese manufacturer 2: opening and closing 30,000 times System standby and recovery switch test: General note type: interval 10sec, 1000cycles Japanese manufacturer: System standby and recovery switch test 2000 times Common causes of laptop failure: ☆ Foreign objects fall on the notebook ☆ Falls off the table while in use ☆ Tuck the notebook in a handbag or trolley case ☆ Extremely high temperature or low temperature ☆ Normal use (overuse) ☆ Wrong use in tourist destinations ☆PCMCIA inserted incorrectly ☆ Place foreign objects on the keyboard Shutdown drop test: General notebook type :76 cm GB package drop: 100cm Us Army and Japanese notebook computers: The height of the computer is 90 cm from all sides, sides, corners, a total of 26 sides Platform :74 cm (packing required) Land: 90cm (packing required) TOSHIBA&BENQ 100 cm Boot drop test: Japanese :10 cm boot fall Taiwan :74 cm boot fall Laptop main board temperature shock: Slope 20℃/min Number of cycles 50cycles(no operation during impact) The U.S. military's technical standards and test conditions for laptop procurement are as follows: Impact test: Drop the computer 26 times from all sides, sides and corners at a height of 90 cm Earthquake resistance test :20Hz~1000Hz, 1000Hz~2000Hz frequency once an hour X, Y and Z axis continuous vibration Temperature test :0℃~60℃ 72 hours of aging oven Waterproof test: Spray water on the computer for 10 minutes in all directions, and the water spray rate is 1mm per minute Dust test: Spray the concentration of 60,000 mg/ per cubic meter of dust for 2 seconds (interval of 10 minutes, 10 consecutive times, time 1 hour) Meets MIL-STD-810 military specifications Waterproof test: Us Army notebook :protection class:IP54(dust & rain) Sprayed the computer with water in all directions for 10 minutes at a rate of 1mm per minute. Dust proof test: Us Army notebook: Spray a concentration of 60,000 mg/ m3 of dust for 2 seconds (10 minute intervals, 10 consecutive times, time 1 hour)  

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• Temperature Cyclic Stress Screening (2)

  Oct 14, 2024

  Temperature Cyclic Stress Screening (2) Introduction of stress parameters for temperature cyclic stress screening: The stress parameters of temperature cyclic stress screening mainly include the following: high and low temperature extremum range, dwell time, temperature variability, cycle number High and low temperature extremal range: the larger the range of high and low temperature extremal, the fewer cycles required, the lower the cost, but can not exceed the product can withstand the limit, do not cause new fault principle, the difference between the upper and lower limits of temperature change is not less than 88°C, the typical range of change is -54°C to 55°C. Dwell time: In addition, the dwell time can not be too short, otherwise it is too late to make the product under test produce thermal expansion and contraction stress changes, as for the dwell time, the dwell time of different products is different, you can refer to the relevant specification requirements. Number of cycles: As for the number of cycles of temperature cyclic stress screening, it is also determined by considering product characteristics, complexity, upper and lower limits of temperature and screening rate, and the screening number should not be exceeded, otherwise it will cause unnecessary harm to the product and cannot improve the screening rate. The number of temperature cycles ranges from 1 to 10 cycles [ordinary screening, primary screening] to 20 to 60 cycles [precision screening, secondary screening], for the removal of the most likely workmanship defects, about 6 to 10 cycles can be effectively removed, in addition to the effectiveness of the temperature cycle, Mainly depends on the temperature variation of the product surface, rather than the temperature variation inside the test box. There are seven main influencing parameters of temperature cycle: (1) Temperature Range (2) Number of Cycles (3) Temperature Rate of Chang (4) Dwell Time (5) Airflow Velocities (6) Uniformity of Stress (7) Function test or not (Product Operating Condition) Stress screening fatigue classification: The general classification of Fatigue research can be divided into High-cycle Fatigue, Low-cycle Fatigue and Fatigue Crack Growth. In the aspect of low cycle Fatigue, it can be subdivided into Thermal Fatigue and Isothermal Fatigue. Stress screening acronyms: ESS: Environmental stress screening FBT: Function board tester ICA: Circuit analyzer ICT: Circuit tester LBS: load board short-circuit tester MTBF: mean time between failures Time of temperature cycles: a.MIL-STD-2164(GJB 1302-90) : In the defect removal test, the number of temperature cycles is 10, 12 times, and in the trouble-free detection it is 10 ~ 20 times or 12 ~ 24 times. In order to remove the most likely workmanship defects, about 6 ~ 10 cycles are needed to effectively remove them. 1 ~ 10 cycles [general screening, primary screening], 20 ~ 60 cycles [precision screening, secondary screening]. B.od-hdbk-344 (GJB/DZ34) Initial screening equipment and unit level uses 10 to 20 loops (usually ≧10), component level uses 20 to 40 loops (usually ≧25). Temperature variability: a.MIL-STD-2164(GJB1032) clearly states: [Temperature change rate of temperature cycle 5℃/min] B.od-hdbk-344 (GJB/DZ34) Component level 15 ° C /min, system 5 ° C /min c. Temperature cyclic stress screening is generally not specified temperature variability, and its commonly used degree variation rate is usually 5°C/min

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• EC-35EXT, Superior constant temperature bath (306L)

  Nov 14, 2014

  EC-35EXT, Superior constant temperature bath (306L) Project Type Series ＥＸＴ Function Temperature occurs in a way Dry wet bulb method Temperature range -70 ～ +150 ℃ Range of temperature Below the + 100℃ ±0.3 ℃ Above the + 101℃ ±0.5 ℃ Temperature distribution Below the + 100℃ ±0. 7 ℃ Above the + 101℃ ±1.0 ℃ The temperature drops the time ＋125 ～－55 ℃ Within 18 points (10℃ / point average temperature change) Temperature rise time －55 ～＋125 ℃ Within 18 minutes (10℃ / minute) The internal volume of the uterus was tested 306L Test room inch method (width, depth and height) 630mm × 540mm × 900mm Product inch method (width, depth and height) 1100mm × 1960mm × 1900mm Make the material External outfit Test room control panel machine room Cold interductile steel plate is dark gray Inside Stainless steel plate (SUS304,2B polished) Broken heat material Test room Hard synthetic resin door Hard synthetic resin foam cotton, glass cotton Project Type Series ＥＸＴ Cooling dehumidifying device Cooling-down method Mechanical section shrinkage and freezing mode and binary freezing mode Cooling medium；coolant Single segment side R 404A Binary high temperature / low temperature side R 404A / R23 Cooling and dehumidifier Multi-channel mixed heat sink type The condenser (water-cooled) Calorifier Form Nickel-chromium heat-resistant alloy heater Blower Form Stir fan Controller The temperature is set -72.0 ～ + 152.0 ℃ Time setting Fanny 0 ~ 999 Time 59 minutes (formula) 0 ~ 20000 Time 59 minutes (formula formula) Set decomposition energy Temperature was 0.1℃ for 1 min Indicate accuracy Temperature ± 0.8℃ (typ.), time ± 100 PPM Vacation type Value or program Stage number 20-stage / 1 program The number of procedures The maximum number of incoming force (RAM) programs is 32 programs The maximum number of internal ROM programs is 13 programs式 Round-trip number Max. 98, or unlimited Number of round-trip repeats Maximum 3 times Displace the end Pt 100Ω ( at 0 ℃ )，grade ( JIS C 1604-1997 ) Control action When splitting the PID action Endovirus function Early delivery function, standby function, setting value maintenance function, power outage protection function, Power action selection function, maintenance function, transportation round-trip function, Time delivery function, time signal output function, overrising and overcooling prevention function, Abnormal representation function, external alarm output function, setting paradigm representation function, Transport type selection function, the calculation time represents the function, the slot lamp lamp function Project Type Series ＥＸＨ Control panel Equipment machine LCD operating panel (type contact panel), Represents lamp (power, transport, abnormal), test power supply terminal, external alarm terminal, Time signal output terminal, power cord connector  Protective device Refrigerating cycle Overload protection device, high blocking device Calorifier Temperature over-rise protection device, temperature fuse Blower Overload protection device Control panel Leakage breaker for power supply, fuse (heater,), Fuse (for operating loop), temperature rise protection device (for testing), Temperature rise overcooling prevention device (test material, in microcomputer) Pay belongs to the product Test material shed shed by * 8 Stainless steel Shshed (2), shed (4) Fuse Operating loop Protection Fuses (2) Operating specification ( 1 )  Else Bolus (Cable hole: 1) Equipment products Adventitia Heat-resistant glass: 270mm: 190mm 1   Cable hole Inner diameter of 50mm 1   The trough inside the lamp AC100V 15W White hot ball 1   Wheel   6   Horizontal adjustment   6   Electrovirus characteristics Power supply is * 5.1  AC　Three-phase　 380V　 50Hz Maximum load current 60A Capacity of the leakage breaker for the power supply 80A Sensory current　 30mA Power distribution thickness 60mm２ Rubber insulation hose Coarseness of grounding wire 14mm２ Cooling water at * 5.3 Water yield 5000 L /h (When the cooling water inlet temperature is 32℃) water pressure 0.1 ～ 0.5MPa Side pipe diameter of the device PT1 1/4  Tubing Drain-pipe 　＊ 5.4 PT1/2 Product weight 700kg

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• AEC-Q100- Failure Mechanism Based on Integrated Circuit Stress Test Certification

  Oct 12, 2024

  AEC-Q100- Failure Mechanism Based on Integrated Circuit Stress Test Certification With the progress of automotive electronic technology, there are many complicated data management control systems in today's cars, and through many independent circuits, to transmit the required signals between each module, the system inside the car is like the "master-slave architecture" of the computer network, in the main control unit and each peripheral module, automotive electronic parts are divided into three categories. Including IC, discrete semiconductor, passive components three categories, in order to ensure that these automotive electronic components meet the highest standards of automotive anquan, the American Automotive Electronics Association (AEC, The Automotive Electronics Council is a set of standards [AEC-Q100] designed for active parts [microcontrollers and integrated circuits...] and [[AEC-Q200] designed for passive components, which specifies the product quality and reliability that must be achieved for passive parts. Aec-q100 is the vehicle reliability test standard formulated by the AEC organization, which is an important entry for 3C and IC manufacturers into the international auto factory module, and also an important technology to improve the reliability quality of Taiwan IC. In addition, the international auto factory has passed the anquan standard (ISO-26262). AEC-Q100 is the basic requirement to pass this standard. List of automotive electronic parts required to pass AECQ-100: Automotive disposable memory, Power Supply step-down regulator, Automotive photocoupler, three-axis accelerometer sensor, video jiema device, rectifier, ambient light sensor, non-volatile ferroelectric memory, power management IC, embedded flash memory, DC/DC regulator, Vehicle gauge network communication device, LCD driver IC, Single power Supply differential Amplifier, Capacitive proximity switch Off, high brightness LED driver, asynchronous switcher, 600V IC, GPS IC, ADAS Advanced Driver Assistance System Chip, GNSS Receiver, GNSS front-end amplifier... Let's wait. AEC-Q100 Categories and Tests: Description: AEC-Q100 specification 7 major categories a total of 41 tests Group A- ACCELERATED ENVIRONMENT STRESS TESTS consists of 6 tests: PC, THB, HAST, AC, UHST, TH, TC, PTC, HTSL Group B- ACCELERATED LIFETIME SIMULATION TESTS consists of three tests: HTOL, ELFR, and EDR PACKAGE ASSEMBLY INTEGRITY TESTS consists of 6 tests: WBS, WBP, SD, PD, SBS, LI Group D- DIE FABRICATION RELIABILITY Test consists of 5 TESTS: EM, TDDB, HCI, NBTI, SM The group ELECTRICAL VERIFICATION TESTS consist of 11 tests, including TEST, FG, HBM/MM, CDM, LU, ED, CHAR, GL, EMC, SC and SER Cluster F-Defect SCREENING TESTS: 11 tests, including: PAT, SBA The CAVITY PACKAGE INTEGRITY TESTS consist of 8 tests, including: MS, VFV, CA, GFL, DROP, LT, DS, IWV Short description of test items: AC: Pressure cooker CA: constant acceleration CDM: electrostatic discharge charged device mode CHAR: indicates the feature description DROP: The package falls DS: chip shear test ED: Electrical distribution EDR: non-failure-prone storage durability, data retention, working life ELFR: Early life failure rate EM: electromigration EMC: Electromagnetic compatibility FG: fault level GFL: Coarse/fine air leakage test GL: Gate leakage caused by thermoelectric effect HBM: indicates the human mode of electrostatic discharge HTSL: High temperature storage life HTOL: High temperature working life HCL: hot carrier injection effect IWV: Internal hygroscopic test LI: Pin integrity LT: Cover plate torque test LU: Latching effect MM: indicates the mechanical mode of electrostatic discharge MS: Mechanical shock NBTI: rich bias temperature instability PAT: Process average test PC: Preprocessing PD: physical size PTC: power temperature cycle SBA: Statistical yield analysis SBS: tin ball shearing SC: Short circuit feature SD: weldability SER: Soft error rate SM: Stress migration TC: temperature cycle TDDB: Time through dielectric breakdown TEST: Function parameters before and after stress test TH: damp and heat without bias THB, HAST: Temperature, humidity or high accelerated stress tests with applied bias UHST: High acceleration stress test without bias VFV: random vibration WBS: welding wire cutting WBP: welding wire tension Temperature and humidity test conditions finishing: THB(temperature and humidity with applied bias, according to JESD22 A101) : 85℃/85%R.H./1000h/bias HAST(High Accelerated stress test according to JESD22 A110) : 130℃/85%R.H./96h/bias, 110℃/85%R.H./264h/bias AC pressure cooker, according to JEDS22-A102:121 ℃/100%R.H./96h UHST High acceleration stress test without bias, according to JEDS22-A118, equipment: HAST-S) : 110℃/85%R.H./264h TH no bias damp heat, according to JEDS22-A101, equipment: THS) : 85℃/85%R.H./1000h TC(temperature cycle, according to JEDS22-A104, equipment: TSK, TC) : Level 0: -50℃←→150℃/2000cycles Level 1: -50℃←→150℃/1000cycles Level 2: -50℃←→150℃/500cycles Level 3: -50℃←→125℃/500cycles Level 4: -10℃←→105℃/500cycles PTC(power temperature cycle, according to JEDS22-A105, equipment: TSK) : Level 0: -40℃←→150℃/1000cycles Level 1: -65℃←→125℃/1000cycles Level 2 to 4: -65℃←→105℃/500cycles HTSL(High temperature storage life, JEDS22-A103, device: OVEN) : Plastic package parts: Grade 0:150 ℃/2000h Grade 1:150 ℃/1000h Grade 2 to 4:125 ℃/1000h or 150℃/5000h Ceramic package parts: 200℃/72h HTOL(High temperature working life, JEDS22-A108, equipment: OVEN) : Grade 0:150 ℃/1000h Class 1:150℃/408h or 125℃/1000h Grade 2:125℃/408h or 105℃/1000h Grade 3:105℃/408h or 85℃/1000h Class 4:90℃/408h or 70℃/1000h   ELFR(Early Life failure Rate, AEC-Q100-008) : Devices that pass this stress test can be used for other stress tests, general data can be used, and tests before and after ELFR are performed under mild and high temperature conditions.

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• Reliability Environmental Test Equipment Combined with Multi-track Temperature Control and Detection Applications

  Oct 12, 2024

  Reliability Environmental Test Equipment Combined with Multi-track Temperature Control and Detection Applications Environmental test equipment includes constant temperature and humidity test chamber, hot and cold shock test chamber, temperature cycle test chamber, no wind oven... These test equipment are all in the simulated environment of temperature, humidity impact on the product, to find out the design, production, storage, transportation, use process may appear product defects, previously only simulated test area air temperature, but in the new international standards and the new test conditions of the international factory, the beginning of the requirements based on the air temperature is not. It is the surface temperature of the test product. In addition, the surface temperature should also be measured and recorded synchronously during the test process for post-test analysis. The relevant environmental test equipment should be combined with surface temperature control and the application of surface temperature measurement is summarized as follows. Constant temperature and humidity test chamber test table temperature detection application: Description: Constant temperature and humidity test chamber in the test process, combined with multi-track temperature detection, high temperature and humidity, condensation (condensation), combined temperature and humidity, slow temperature cycle... During the test process, the sensor is affixed to the surface of the test product, which can be used to measure the surface temperature or internal temperature of the test product. Through this multi-track temperature detection module, the set conditions, actual temperature and humidity, the surface temperature of the test product, and the same measurement and record can be integrated into a synchronous curve file for subsequent storage and analysis. Thermal shock test chamber surface temperature control and detection applications: [dwell time based on surface temperature control], [temperature shock process surface temperature measurement record] Description: The 8-rail temperature sensor is attached to the surface of the test product and applied to the temperature shock process. The dwell time can be counted backward according to the arrival of the surface temperature. During the impact process, the setting conditions, the test temperature, the surface temperature of the test product, and the same measurement and record can be integrated into a synchronous curve. Temperature cycle test chamber surface temperature control and detection application: [Temperature cycle temperature variability and dwell time are controlled according to the test product surface temperature] Description: Temperature cycle test is different from temperature shock test. Temperature shock test uses the maximum energy of the system to carry out temperature changes between high and low temperatures, and its temperature change rate is as high as 30 ~ 40℃ /min. Temperature cycle test requires a process of high and low temperature changes, and its temperature variability can be set and controlled. However, the new specification and the test conditions of international manufacturers have begun to require that the temperature variability refers to the surface temperature of the test product, not the air temperature, and the current temperature cycle specification temperature variability control. According to the test product surface specifications are [JEDEC-22A-104F, IEC60749-25, IPC9701, ISO16750, AEC-Q100, LV124, GMW3172]... In addition, the residence time of high and low temperatures can also be based on the test surface, rather than the air temperature. Temperature cyclic stress screening test chamber surface temperature control and detection applications: Instructions: Temperature cycle stress screening testing machine, combined with multi-rail temperature measurement, in the temperature variability of stress screening, you can choose to use [air temperature] or [test product surface temperature] to control the temperature variability, in addition, in the high and low temperature resident process, the time reciprocal can also be controlled according to the surface of the test product. In accordance with the relevant specifications (GJB1032, IEST) and the requirements of international organizations, according to the definition of GJB1032 in the stress screening residence time and temperature measurement point, 1. The number of thermocouples fixed on the product shall not be less than 3, and the temperature measurement point of the cooling system shall not be less than 6, 2. Ensure that the temperature of 2/3 thermocouples on the product is set at ±10℃, in addition, according to the requirements of IEST(International Association for Environmental Science and Technology), the residence time should reach the temperature stabilization time plus 5min or performance test time. No air oven (natural convection test chamber) surface temperature detection application: Description: Through the combination of a windless oven (natural convection test chamber) and a multi-track temperature detection module, the temperature environment without fan (natural convection) is generated, and the relevant temperature detection test is integrated. This solution can be applied to the actual ambient temperature test of electronic products (such as: Cloud server, 5G, electric vehicle interior, indoor without air conditioning environment, solar inverter, large LCD TV, home Internet sharer, office 3C, laptop, desktop, game console....... Etc.).    

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• Inverter- Reliability Test

  Oct 11, 2024

  Inverter- Reliability Test Inverter- reliability test also known as voltage converter, its function is to convert DC low voltage into AC high voltage, some electronic equipment must be driven by AC power, but we provide is DC power, at this time you must use the Inverter, direct current into alternating current to drive the electronic parts. Inverter- reliability test also known as voltage converter, its function is to convert DC low voltage into AC high voltage, some electronic equipment must be driven by AC power, but we provide is DC power, at this time you must use the Inverter, direct current into alternating current to drive the electronic parts. Relevant test conditions: Item temperature time other Initial test at normal temperature 25 ℃ TIME≥2 hours - Low temperature initial test 0 ℃ or -5 °C TIME≥2 hours - High temperature initial test 60℃ TIME≥2 hours - High temperature and high humidity test 40℃/95%RH 240 hours - High temperature storage test 70℃ TIME≥96 hours or 240 hours - Low temperature storage test -1 -20°C TIME≥96 hours - Low temperature storage test -2 -40℃ 240 hours - High temperature and high humidity storage test 40℃/90%RH TIME≥96 hours - Temperature cycle test -20℃~ 70℃ 5 cycle Room temperature ↓-20 ℃(4 hours)↓ Room temperature (90%RH.4 hours)↓70°C(4 hours)↓ Room temperature (4 hours) High temperature load test 55 ℃ equivalent load, 1,000 hours - Life test 40°C MTBF≥40000 hours - on/off test (power cycle) - - 1min:on, 1min:off, 5,000 cycles using equivalent load Vibration test - - Acceleration 3q, frequency 10~55HZ, X, Y, Z three directions 10 minutes each, a total of 30 minutes Impact test - - Acceleration of 80g, 10 ms each time, Three times in X, Y, Z directions Note 1: The tested module should be placed at normal (15~35° C,45~65%RH) for one hour before testing Applicable equipment: 1. High and low temperature test chamber 2. High temperature and high humidity test chamber 3. Rapid temperature cycle test chamber                

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• IEC 61646 Test Standard for Thin-film Solar Photoelectric Modules

  Oct 07, 2024

  IEC 61646 Test Standard for Thin-film Solar Photoelectric Modules Through the diagnostic measurement, electrical measurement, irradiation test, environmental test, mechanical test five types of test and inspection mode, confirm the design confirmation and form approval requirements of thin film solar energy, and confirm that the module can operate in the general climate environment required by the specification for a long time. IEC 61646-10.1 Visual inspection procedure Objective: To check for any visual defects in the module. Performance at STC under IEC 61646-10.2 Standard test conditions Objective: Using natural light or A class simulator, under standard test conditions (battery temperature: 25±2℃, irradiance: 1000wm^-2, standard solar spectrum irradiation distribution in accordance with IEC891), test the electrical performance of the module with load change. IEC 61646-10.3 Insulation test Objective: To test whether there is good insulation between the current carrying parts and the frame of the module IEC 61646-10.4 Measurement of temperature coefficients Objective: To test the current temperature coefficient and voltage temperature coefficient in the module test. The temperature coefficient measured is valid only for the irradiation used in the test. For linear modules, it is valid within ±30% of this irradiation. This procedure is in addition to IEC891, which specifies the measurement of these coefficients from individual cells in a representative batch. The temperature coefficient of the thin-film solar cell module depends on the heat treatment process of the module involved. When the temperature coefficient is involved, the conditions of the thermal test and the irradiation results of the process should be indicated. IEC 61646-10.5 Measurement of nominal operating cell temperature (NOCT) Objective: To test the NOCT of the module IEC 61646-10.6 Performance at NOCT Objective: When the nominal operating battery temperature and irradiance are 800Wm^-2, under the standard solar spectrum irradiance distribution condition, the electrical performance of the module varies with the load. IEC 61646-10.7 Performance at low irradiance Objective: To determine the electrical performance of modules under load under natural light or A class A simulator at 25℃ and 200Wm^-2(measured with appropriate reference cell). IEC 61646-10.8 Outdoor exposure Testing Objective: To make an unknown assessment of the resistance of the module to exposure to outdoor conditions and to show any effects of degradation that could not be detected by the experiment or test. IEC 61646-10.9 Hot spot test Objective: To determine the ability of the module to withstand thermal effects, such as packaging material aging, battery cracking, internal connection failure, local shading or stained edges can cause such defects. IEC 61646-10.10 UV test (UV test) Objective: To confirm the ability of the module to withstand ultraviolet (UV) radiation, the new UV test is described in IEC1345, and if necessary, the module should be exposed to light before performing this test. IEC61646-10.11 Thermal cycling Test (Thermal cycling) Objective: To confirm the ability of the module to resist thermal inhomogeneity, fatigue and other stresses due to repeated temperature changes. The module should be annealed before receiving this test. [Pre-I-V test] refers to the test after annealing, be careful not to expose the module to light before the final I-V test. Test requirements: a. Instruments to monitor the electrical continuity within each module throughout the test process b. Monitor the insulation integrity between one of the recessed ends of each module and the frame or support frame c. Record module temperature throughout the test and monitor any open circuit or ground failure that may occur (no intermittent open circuit or ground failure during the test). d.The insulation resistance shall meet the same requirements as the initial measurement IEC 61646-10.12 Humidity freeze cycle test Purpose: To test the module's resistance to the influence of the subsequent sub-zero temperature under high temperature and humidity, this is not a thermal shock test, before receiving the test, the module should be annealed and subjected to a thermal cycle test, [[Pre-I-V test] refers to the thermal cycle after the test, be careful not to expose the module to light before the final I-V test. Test requirements: a. Instruments to monitor the electrical continuity within each module throughout the test process b. Monitor the insulation integrity between one of the recessed ends of each module and the frame or support frame c. Record module temperature throughout the test and monitor any open circuit or ground failure that may occur (no intermittent open circuit or ground failure during the test). d. The insulation resistance shall meet the same requirements as the initial measurement IEC 61646-10.13 Damp heat Test (Damp heat) Objective: To test the ability of the module to resist long-term infiltration of moisture Test requirements: The insulation resistance shall meet the same requirements as the initial measurement IEC 61646-10.14 Robustness of terminations Objective: To determine whether the attachment between the lead end and the lead end to the module body can withstand the force during normal installation and operation. IEC 61646-10.15 Twist Test Objective: To detect possible problems caused by module installation on an imperfect structure IEC 61646-10.16 Mechanical load test Purpose: The purpose of this test is to determine the ability of the module to withstand wind, snow, ice, or static loads IEC 61646-10.17 Hail test Objective: To verify the impact resistance of the module to hail IEC 61646-10.18 Light soaking Test Objective: To stabilize the electrical properties of thin film modules by simulating solar irradiation IEC 61646-10.19 Annealing Tests (Annealing) Objective: The film module is annealed before the verification test. If not annealed, the heating during the subsequent test procedure may mask the attenuation caused by other causes. IEC 61646-10.20 Wet leakage current Test Purpose: To evaluate the insulation of the module under wet operating conditions and to verify that moisture from rain, fog, dew or melting snow does not enter the live parts of the module circuit, which may cause corrosion, ground failure or safety hazards.

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• IEEE1513 Temperature Cycle Test , Humidity Freezing Test and Thermal-humidity Test 1

  Oct 07, 2024

  IEEE1513 Temperature Cycle Test , Humidity Freezing Test and Thermal-humidity Test 1 Among the environmental reliability test requirements of Cells, Receiver, and Module of concentrated solar cells have their own test methods and test conditions in temperature cycle test, humidity freezing test, and thermal-humidity test, and there are also differences in the quality confirmation after the test. Therefore, IEEE1513 has three tests on temperature cycle test, humidity freezing test and thermal-humidity test in the specification, and its differences and test methods are sorted out for everyone's reference. Reference source: IEEE Std 1513-2001 IEEE1513-5.7 Thermal cycle test IEEE1513-5.7 thermal cycle test Objective: To determine whether the receiving end can properly withstand the failure caused by the thermal expansion difference between the parts and the joint material, especially the solder joint and package quality. Background: Temperature cycling tests of concentrated solar cells reveal welding fatigue of copper heat sinks and require complete ultrasonic transmission to detect crack growth in the cells (SAND92-0958 [B5]). Crack propagation is a function of the temperature cycle number, the initial complete solder joint, solder joint type, between the battery and the radiator due to the thermal expansion coefficient and temperature cycle parameters, after the thermal cycle test to check the receiver structure of the packaging and insulation material quality. There are two test plans for the program, tested as follows: Program A and Program B Procedure A: Test receiver resistance at thermal stress caused by thermal expansion difference Procedure B: Temperature cycle before humidity freezing test Before pretreatment, it is emphasized that the initial defects of the receiving material are caused by actual wet freezing. In order to adapt to different concentrated solar energy designs, temperature cycle tests of program A and Program B can be checked, which are listed in Table 1 and Table 2. 1. These receivers are designed with solar cells directly connected to copper radiators, and the conditions required are listed in the first row table 2. This will ensure that potential failure mechanisms, which may lead to defects occurring during the development process, are discovered. These designs adopt different methods and can use alternative conditions as shown in the table to debond the radiator of the battery. Table 3 shows that the receiving portion performs a program B temperature cycle prior to the alternative. Since program B mainly tests other materials on the receiving end, alternatives are offered to all designs Table 1 - Temperature cycle procedure test for receivers Program A- Thermal cycle Option Maximum temperature Total number of cycles Application current Required design TCR-A 110℃ 250 No The battery is welded directly to the copper radiator TCR-B 90℃ 500 No Other design records TCR-C 90℃ 250 I(applied) = Isc Other design records Table 2 - Temperature cycle procedure test of the receiver Procedure B- Temperature cycle before wet freezing test Option Maximum temperature Total number of cycles Application current Required design HFR-A   110℃ 100 No Documentation of all designs   HFR-B   90℃ 200 No Documentation of all designs   HFR-C   90℃ 100 I(applied) = Isc Documentation of all designs   Procedure: The receiving end will be subjected to a temperature cycle between -40 °C and the maximum temperature (following the test procedure in Table 1 and Table 2), the cycle test can be put into a single or two boxes of gas temperature shock test chamber, the liquid shock cycle should not be used, the dwell time is at least 10 minutes, and the high and low temperature should be within the requirement of ±5 °C. The cycle frequency should not be greater than 24 cycles a day and not less than 4 cycles a day, the recommended frequency is 18 times a day. The number of thermal cycles and the maximum temperature required for the two samples, refer to Table 3 (Procedure B of Figure 1), after which a visual inspection and electrical characteristics test will be carried out (refer to 5.1 and 5.2). These samples will be subjected to a wet freezing test, according to 5.8, and a larger receiver will refer to 4.1.1(this procedure is illustrated in Figure 2). Background: The purpose of the temperature cycle test is to accelerate the test that will appear in the short term failure mechanism, prior to the detection of concentrating solar hardware failure, therefore, the test includes the possibility of seeing a wide temperature difference beyond the module range, the upper limit of the temperature cycle of 60 ° C is based on the softening temperature of many module acrylic lenses, for other designs, the temperature of the module. The upper limit of the temperature cycle is 90 ° C (see Table 3) Table 3- List of test conditions for module temperature cycles Procedure B Temperature cycle pretreatment before wet freezing test Option Maximum temperature Total number of cycles Application current Required design TCM-A   90℃ 50 No Documentation of all designs   TEM-B   60℃ 200 No Plastic lens module design may be required    

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• IEEE1513 Temperature Cycle Test and Humidity Freezing Test, Thermal-humidity Test 2

  Sep 29, 2024

  IEEE1513 Temperature Cycle Test and Humidity Freezing Test, Thermal-humidity Test 2 Steps: Both modules will perform 200 cycle temperature cycles between -40 °C and 60 °C or 50 cycle temperature cycles between -40 °C and 90 °C, as specified in ASTM E1171-99. Note: ASTM E1171-01: Test method for photoelectric modulus at Loop Temperature and humidity Relative humidity does not need to be controlled. The temperature variation should not exceed 100℃/ hour. The residence time should be at least 10 minutes and the high and low temperature should be within the requirement of ±5℃ Requirements: a. The module will be inspected for any obvious damage or degradation after the cycle test. b. The module should not show any cracks or warps, and the sealing material should not delaminate. c. If there is a selective electrical function test, the output power should be 90% or more under the same conditions of many original basic parameters Added: IEEE1513-4.1.1 Module representative or receiver test sample, if a complete module or receiver size is too large to fit into an existing environmental test chamber, the module representative or receiver test sample may be substituted for a full-size module or receiver. These test samples should be specially assembled with a replacement receiver, as if containing a string of cells connected to a full-size receiver, the battery string should be long and include at least two bypass diodes, but in any case three cells are relatively few, which summarizes the inclusion of links with the replacement receiver terminal should be the same as the full module. The replacement receiver shall include components representative of the other modules, including lens/lens housing, receiver/receiver housing, rear segment/rear segment lens, case and receiver connector, procedures A, B, and C will be tested. Two full-size modules should be used for outdoor exposure test procedure D. IEEE1513-5.8 Humidity freeze cycle test Humidity freeze cycle test Receiver Purpose: To determine whether the receiving part is sufficient to resist corrosion damage and the ability of moisture expansion to expand the material molecules. In addition, frozen water vapor is the stress for determining the cause of failure Procedure: The samples after temperature cycling will be tested according to Table 3, and will be subjected to wet freezing test at 85 ℃ and -40 ℃, humidity 85%, and 20 cycles. According to ASTM E1171-99, the receiving end with large volume shall refer to 4.1.1 Requirements: The receiving part shall meet the requirements of 5.7. Move out of the environment tank within 2 to 4 hours, and the receiving part should meet the requirements of the high-voltage insulation leakage test (see 5.4). module Purpose: Determine whether the module has sufficient capacity to resist harmful corrosion or widening of material bonding differences Procedure: Both modules will be subjected to wet freezing tests for 20 cycles, 4 or 10 cycles to 85 ° C as shown in ASTM E1171-99. Please note that the maximum temperature of 60 ° C is lower than the wet freezing test section at the receiving end. A complete high voltage insulation test (see 5.4) will be completed after a two to four hour cycle. Following the high voltage insulation test, the electrical performance test as described in 5.2 will be carried out. In large modules may also be completed, see 4.1.1. Requirements: a. The module will check for any obvious damage or degradation after the test, and record any. b. The module should exhibit no cracking, warping, or severe corrosion. There should be no layers of sealing material. c. The module shall pass the high voltage insulation test as described in IEEE1513-5.4. If there is a selective electrical function test, the output power can reach 90% or more under the same conditions of many original basic parameters IEEE1513-5.10 Damp heat test IEEE1513-5.10 Damp heat test Objective: To evaluate the effect and ability of receiving end to withstand long-term moisture infiltration. Procedure: The test receiver is tested in an environmental test chamber with 85%±5% relative humidity and 85 ° C ±2 ° C as described in ASTM E1171-99. This test should be completed in 1000 hours, but an additional 60 hours can be added to perform a high voltage insulation leakage test. The receiving part can be used for testing. Requirements: The receiving end needs to leave the damp heat test chamber for 2 ~ 4 hours to pass the high voltage insulation leakage test (see 5.4) and pass the visual inspection (see 5.1). If there is a selective electrical function test, the output power should be 90% or more under the same conditions of many original basic parameters. IEEE1513 Module test and inspection procedures IEEE1513-5.1 Visual inspection procedure Purpose: To establish the current visual status so that the receiving end can compare whether they pass each test and guarantee that they meet the requirements for further testing. IEEE1513-5.2 Electrical performance test Objective: To describe the electrical characteristics of the test module and the receiver and to determine their peak output power. IEEE1513-5.3 Ground continuity test Purpose: To verify electrical continuity between all exposed conductive components and the grounding module. IEEE1513-5.4 Electrical isolation test (dry hi-po) Purpose: To ensure that the electrical insulation between the circuit module and any external contact conductive part is sufficient to prevent corrosion and safeguard the safety of workers. IEEE1513-5.5 Wet insulation resistance test Purpose: To verify that moisture cannot penetrate the electronically active part of the receiving end, where it could cause corrosion, ground failure, or identify hazards for human safety. IEEE1513-5.6 Water spray test Objective: The field wet resistance test (FWRT) evaluates the electrical insulation of solar cell modules based on humidity operating conditions. This test simulates heavy rain or dew on its configuration and wiring to verify that moisture does not enter the array circuit used, which can increase corrosiveness, cause ground failures, and create electrical safety hazards for personnel or equipment. IEEE1513-5.7 Thermal cycle test (Thermal cycle test) Objective: To determine whether the receiving end can properly withstand the failure caused by the difference in thermal expansion of parts and joint materials. IEEE1513-5.8 Humidity freeze cycle test Objective: To determine whether the receiving part is sufficiently resistant to corrosion damage and the ability of moisture expansion to expand the material molecules. In addition, frozen water vapor is the stress for determining the cause of failure. IEEE1513-5.9 Robustness of terminations test Purpose: To ensure the wires and connectors, apply external forces on each part to confirm that they are strong enough to maintain normal handling procedures. IEEE1513-5.10 Damp heat test (Damp heat test) Objective: To evaluate the effect and ability of receiving end to withstand long-term moisture infiltration. I EEE1513-5.11 Hail impact test Objective: To determine whether any component, especially the condenser, can survive hail. IE EE1513-5.12 Bypass diode thermal test (Bypass diode thermal test) Objective: To evaluate the availability of sufficient thermal design and use of bypass diodes with relative long-term reliability to limit the adverse effects of module thermal shift diffusion. IEEE1513-5.13 Hot-spot endurance test (Hot-Spot endurance test) Objective: To assess the ability of modules to withstand periodic heat shifts over time, commonly associated with failure scenarios such as severely cracked or mismatched cell chips, single point open circuit failures, or uneven shadows (shaded portions). I EEE1513-5.14 Outdoor exposure test (Outdoor exposure test) Purpose: In order to preliminarily assess the capability of the module to withstand exposure to outdoor environments (including ultraviolet radiation), the reduced effectiveness of the product may not be detected by laboratory testing. IEEE1513-5.15 Off-axis beam damage test Purpose: To ensure that any part of the module is destroyed due to module deviation of the concentrated solar radiation beam.  

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• Application of TCT Temperature Cycle Chamber in Optical Communication Industry

  Sep 27, 2024

  Application of TCT Temperature Cycle Chamber in Optical Communication Industry The arrival of 5G makes people feel the rapid development of mobile Internet, and optical communication technology as an important basis has also been developed. At present, China has built the world's longest optical fiber network, and with the continuous advancement of 5G technology, optical communication technology will be more widely used. The development of optical communication technology not only allows people to enjoy faster network speed, but also brings more opportunities and challenges. For example, new applications such as cloud gaming, VR, and AR require more stable and high-speed networks, and optical communication technology can meet these needs. At the same time, optical communication technology has also brought more innovation opportunities, such as intelligent medical care, intelligent manufacturing and other fields, will use optical communication technology to achieve more efficient and accurate operation. But you know what? This amazing technology cannot be achieved without the credit of macro environmental test equipment, especially the TC temperature cycle test chamber, which is a rapid temperature change test chamber. This article introduces you to the optical communication product reliability test quality manager - rapid temperature change laboratory. First, let's talk briefly about optical communication. Some people also say that it is called optical communication, so they are two in the end is not a concept. In fact, they are two of the same concept. Optical communication is the use of optical signals for communication technology, and optical communication is based on optical communication, through optical devices such as optical fibers, optical cables to achieve data transmission. Optical communication technology is widely used, such as our daily use of fiber optic broadband, mobile phone optical sensors, optical measurement in aerospace and so on. It can be said that optical communication has become an important part of modern communication field. So why is optical communication so popular? In fact, it has many advantages, such as high-speed transmission, large bandwidth, low loss and so on. Common optical communication products include: optical cable, fiber switch, fiber modem, etc., used to transmit and receive optical signals of optical fiber communication equipment; Temperature sensor, strain sensor, displacement sensor, etc., can measure various physical quantities in real time and other optical fiber sensors; Erbium-doped optical amplifier, erbium-doped ytterbium-doped optical amplifier, Raman amplifier, etc., used to expand the intensity of optical signals and other optical amplifiers; Helium-neon laser, diode laser, fiber laser, etc., are light sources in optical communication, used to produce high brightness, directional and coherent laser light and other lasers; Photodetectors, optical limiter, photodiodes, etc., for receiving optical signals and converting them into electrical signals and other optical receivers; Optical switches, optical modulators, programmable optical arrays, etc. are used to control and adjust optical signal transmission and routing and other optical controllers. Let's take mobile phones as an example and talk about the application of optical communication products on mobile phones: 1. Optical fiber: Optical fiber is generally used as a part of the communication line, due to its fast transmission speed, communication signals are not easily affected by external interference and other characteristics, has become an important part of mobile phone communication. 2. Photoelectric converter/optical module: photoelectric converter and optical module are devices that convert optical signals into electrical signals, and are also a very important part of mobile phone communication. In the era of high-speed communication such as 4G and 5G, the speed and performance of such equipment need to be continuously improved to meet the needs of fast and stable communication. 3. Camera module: In the mobile phone, the camera module generally includes CCD, CMOS, optical lens and other parts, and its quality and performance also have a significant impact on the quality of optical communication of the mobile phone. 4. Display: Mobile phone displays generally use OLED, AMOLED and other technologies, the principle of these technologies are related to optics, but also an important part of mobile phone optical communication. 5. Light sensor: Light sensor is mainly used in mobile phones for environmental light sensing, proximity sensing and gesture sensing, and is also an important mobile phone optical communication product. It can be said that optical communication products fill all aspects of our life and work. However, the production and use environment of optical communication products is often changeable, such as high or low temperature weather environment when working outdoors, or the use of a long time will also encounter changes in thermal expansion and contraction. So how is the reliable use of these products achieved? That has to mention our protagonist today - rapid temperature change test chamber, also known as TC box in the optical communication industry. In order to ensure that optical communication products still work normally under various environmental conditions, it is necessary to carry out rapid temperature change tests on optical communication products. The rapid temperature change test chamber can simulate a variety of different temperature and humidity environments, and simulate instantaneous extreme environmental changes in the real world within a rapid range. So how is the rapid temperature change test chamber applied in the optical communication industry? 1. Optical module performance test: Optical module is a key component of optical communication, such as optical transceiver, optical amplifier, optical switch, etc. The rapid temperature change test chamber can simulate different temperature environments and test the performance of the optical module at different temperatures to evaluate its adaptability and reliability. 2. Reliability test of optical devices: optical devices include optical fibers, optical sensors, grating, photonic crystals, photodiodes, etc. The rapid temperature change test chamber can test the temperature change of these optical devices and evaluate their reliability and life based on the test results. 3. Optical communication system simulation test: The rapid temperature change test chamber can simulate various environmental conditions in the optical communication system, such as temperature, humidity, vibration, etc., to test the performance, reliability and stability of the entire system. 4. Technology research and development: The optical communication industry is a technology-intensive industry, which needs to constantly develop new technologies and new products. The rapid temperature change test chamber can be used to test the performance and reliability of new products, helping to accelerate the development and market of new products. In summary, it can be seen that in the optical communication industry, the rapid temperature change test chamber is usually used to test the performance and reliability of optical modules and optical devices. Then when we use the rapid temperature change test chamber for testing, different optical communication products may require different standards. The following are rapid temperature change test standards for some common optical communication products: 1. Optical fiber: Common test standards There are common optical fiber rapid temperature change test standards are the following: IEC 61300-2-22: The standard defines the stability and durability test method of optical fiber components, section 4.3 of which specifies the thermal stability test method of optical fiber components, in the case of rapid temperature changes to the optical fiber components for measurement and evaluation. GR-326-CORE: This standard specifies reliability test requirements for fiber optic connectors and adapters, including thermal stability tests to assess the reliability of fiber optic connectors and adapters in temperature changing environments. GR-468-CORE: This standard defines the performance specifications and test methods for fiber optic connectors, including temperature cycle testing, accelerated aging testing, etc., to verify the reliability and stability of fiber optic connectors under various environmental conditions. ASTM F2181: This standard defines a method for fiber failure testing under high temperature and high humidity environmental conditions to evaluate the long-term durability of the fiber. And the above standards such as GB/T 2423.22-2012 are tested and evaluated for the reliability of optical fiber in rapid temperature changes or long-term high temperature and high humidity environments, which can help the majority of manufacturers to ensure the quality and reliability of optical fiber products. 2. Photoelectric converter/optical module: The common rapid temperature change test standards are GB/T 2423.22-2012, GR-468-CORE, EIA/TIA-455-14 and IEEE 802.3. These standards mainly cover the test methods and specific implementation steps of photoelectric converters/optical modules, which can ensure the performance and reliability of products in different temperature environments. Among them, the GR-468-CORE standard is specifically for the reliability requirements of optical converters and optical modules, including temperature cycle test, wet heat test and other environmental tests, requiring optical converters and optical modules to maintain stable and reliable performance in long-term use. 3. Optical sensor: The common rapid temperature change test standards are GB/T 27726-2011, IEC 61300-2-43 and IEC 61300-2-6. These standards mainly cover the test methods and specific implementation steps of the temperature change test of the optical sensor, which can ensure the performance and reliability of the product in different temperature environments. Among them, the GB/T 27726-2011 standard is the standard for the performance test method of optical sensors in China, including the environmental test method of optical fiber sensors, which requires the optical sensor to maintain stable performance in a variety of working environments. IEC 60749-15 standard is the international standard for the temperature cycle test of electronic components, and it also has reference value for the rapid temperature change test of optical sensors. 4. Laser: Common rapid temperature change test standards are GB/T 2423.22-2012 "Electrical and electronic products environmental test Part 2: Test Nb: temperature cycle test", GB/T 2423.38-2002 "Basic test methods for electrical components Part 38: Temperature resistance test (IEC 60068-2-2), GB/T 13979-2009 "Laser product Performance test method", IEC 60825-1, IEC/TR 61282-10 and other standards mainly cover the laser temperature change test method and specific implementation steps. It can ensure the performance and reliability of products in different temperature environments. Among them, the GB/T 13979-2009 standard is the standard for the performance test method of laser products in China, including the environmental test method of the laser under temperature changes, requiring the laser to maintain stable performance in a variety of working environments. The IEC 60825-1 standard is a specification for the integrity of laser products, and there are also relevant provisions for the rapid temperature change test of lasers. In addition, the IEC/TR 61282-10 standard is one of the guidelines for the design of optical fiber communication systems, which includes methods for the environmental protection of lasers. 5. Optical controller: The common fast temperature change test standards are GR-1209-CORE and GR-1221-CORE. GR-1209-CORE is a reliability standard for optical fiber equipment, mainly for the reliability test of optical connections, and specifies the reliability experiment of optical connection systems. Among them, the rapid temperature cycle (FTC) is one of the test projects, which is to test the reliability of optical fiber modules under rapidly changing temperature conditions. During the test, the optical controller needs to perform temperature cycling in the range of -40 ° C to 85 ° C. During the temperature cycle, the module should maintain normal function and not produce abnormal output, and the test time is 100 temperature cycles. GR-1221-CORE is a reliability standard for fiber optic passive devices and is suitable for the testing of passive devices. Among them, the temperature cycle test is one of the test items, which also requires the optical controller to be tested in the range of -40 ° C to 85 ° C, and the test time is 100 cycles. Both of these standards specify the reliability test of the optical controller in the environment of temperature change, which can determine the stability and reliability of the optical controller under harsh environmental conditions. In general, different rapid temperature change test standards may focus on different test parameters and test methods, it is recommended to choose the corresponding test standards according to the use of specific products. Recently, when we discuss the reliability verification of optical modules, there is a contradictory indicator, the number of temperature cycles of optical module verification, there are 10 times, and 20 times, 100 times, or even 500 times. Frequency definitions in two industry standards:   The references to these standards have clear sources and are correct. For the 5G forward optical module, our opinion is that the number of cycles is 500, and the temperature is set at -40 °C ~85 °C The following is the description of the 10/20/100/500 above in the original text of GR-468(2004) Because of the limited space, this article introduces the use of rapid temperature change test chamber in the optical communication industry. If you have any questions when using rapid temperature change test chamber and other environmental test equipment, welcome to discuss with us and learn together.

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• IEC 60068-2

  Sep 26, 2024

  IEC 60068-2   Instructions: IEC(International Electrotechnical Association) is the world's oldest non-governmental international electrical standardization organization, for the people's livelihood of the electronic products to develop relevant test specifications and methods, such as: mainframe board, notebook computers, tablets, smartphones, LCD screens, game consoles... The main spirit of its test is extended from IEC, the main representative of which is IEC60068-2, environmental test conditions its [environmental test] refers to the sample exposed to natural and artificial environments, but the performance of its actual use, transportation and storage conditions are evaluated. The environmental test of the sample can be uniform and linear through the use of standardized standards. Environmental testing can simulate whether the product can adapt to environmental changes (temperature, humidity, vibration, temperature change, temperature shock, salt spray, dust) at different stages (storage, transport, use). And verify that the characteristics and quality of the product itself will not be affected by it, low temperature, high temperature, temperature impact can produce mechanical stress, this stress makes the test sample more sensitive to the subsequent test, impact, vibration can produce mechanical stress, this stress can make the sample immediately damaged, air pressure, alternating humid heat, constant humid heat, corrosion application of these tests and can be continued thermal and mechanical stress test effects. Important IEC specification sharing: IEC69968-2-1- Cold Test purpose: To test the ability of automotive components, equipment or other component products to operate and store at low temperatures. Test methods are divided into: 1.Aa: Temperature sudden change method for non-thermal specimens 2.Ab: Temperature gradient method for non-thermal specimens 3.Ad: Temperature gradient method of thermogenic specimen Note: Aa: 1. Static test (without power supply). 2. First cool down to the specified temperature of the specification before placing the test part. 3. After stability, the temperature difference of each point on the specimen does not exceed ±3℃. 4. After the test is completed, the specimen is placed under standard atmospheric pressure until the fog is completely removed: no voltage is added to the specimen during the transfer process. 5. Measure after returning to the original condition (at least 1hr). Ab: 1. Static test (without power supply). 2. The specimen is placed in the cabinet at room temperature, and the temperature change of the cabinet temperature does not exceed 1℃ per minute. 3. The specimen shall be kept in the cabinet after the test, and the temperature change of the cabinet temperature shall not exceed 1℃ per minute to return to the standard atmospheric pressure; The specimen should not be charged during temperature change. 4. Measure after returning to the original condition (at least 1hr). (The difference between the temperature and the air temperature is more than 5℃). Ac: 1. Dynamic test (plus power supply) when the temperature of the specimen is stable after charging, the temperature of the specimen surface is the most hot spot. 2. The specimen is placed in the cabinet at room temperature, and the temperature change of the cabinet temperature does not exceed 1℃ per minute. 3. The specimen should be kept in the cabinet after the test, and the temperature change of the cabinet temperature should not exceed 1℃ per minute, and return to the standard atmospheric pressure; The specimen should not be charged during temperature change. 4. Measure after returning to the original condition (at least 1hr). Test conditions: 1. Temperature :-65,-55,-40,-25,-10,-5,+5°C 2. Resident time :2/16/72/96 hours. 3. Temperature variation rate: no more than 1℃ per minute. 4. Tolerance error :+3°C. Test setup: 1. Heat generating specimens should be placed in the center of the test cabinet and the wall of the cabinet > 15cm Sample to specimen > 15cm test cabinet to test volume ratio > 5:1. 2. For heat-generating specimens, if air convection is used, the flow rate should be kept to a minimum. 3. The specimen should be unpacked, and the fixture should have the characteristics of high heat conduction.   IEC 60068-2-2- Dry heat Test purpose: To test the ability of components, equipment or other component products to operate and store in high temperature environments. The test method is: 1. Ba: Temperature sudden change method for non-thermal specimens 2.Bb: Temperature gradient method for non-thermal specimens 3.Bc: Temperature sudden change method for thermogenic specimens 4.Bd: Temperature gradient method for thermogenic specimens Note: Ba: 1. Static test (without power supply). 2. First cool down to the specified temperature of the specification before placing the test part. 3. After stability, the temperature difference of each point on the specimen does not exceed +5℃. 4. After the test is completed, place the specimen under standard atmospheric pressure and return to the original condition (at least 1hr). Bb: 1. Static test (without power supply). 2. The specimen is placed in the cabinet at room temperature, and the temperature change of the cabinet temperature does not exceed 1℃ per minute, and the temperature is reduced to the temperature value specified in the specification. 3. The specimen shall be kept in the cabinet after the test, and the temperature change of the cabinet temperature shall not exceed 1℃ per minute to return to the standard atmospheric pressure; The specimen should not be charged during temperature change. 4. Measure after returning to the original condition (at least 1hr). Bc: 1. Dynamic test (external power supply) When the temperature of the specimen is stable after charging, the difference between the temperature of the hottest spot on the surface of the specimen and the air temperature is more than 5℃. 2. Heat up to the specified temperature of the specification before placing the test part. 3. After stability, the temperature difference of each point on the specimen does not exceed +5℃. 4. After the test is completed, the specimen will be placed under the standard atmospheric pressure, and the measurement will be carried out after the original condition is returned (at least 1hr). 5. The average temperature of the decimal point on the plane of 0~50mm on the bottom surface of the specimen. Bd: 1. Dynamic test (external power supply) when the temperature of the specimen is stable after charging, the temperature of the most hot spot on the surface of the specimen is more than 5°C different from the air temperature. 2. The specimen is placed in the cabinet at room temperature, and the temperature change of the cabinet temperature does not exceed 1℃ per minute, and rises to the specified temperature value. 3. Return to standard atmospheric pressure; The specimen should not be charged during temperature change. 4. Measure after returning to the original condition (at least 1hr). Test conditions: 1. The temperature 1000,800,630,500,400,315,250,200,175,155,125,100,85,70,55,40,30 ℃. 1. Resident time: 2/16/72/96 hours. 2. Temperature variation rate: no more than 1℃ per minute. (Average in 5 minutes) 3. Tolerance error: tolerance of ±2℃ below 200℃. (200~1000℃ tolerance ±2%)   IEC 60068-2-2- Test method Ca: Steady damp heat 1. Test purpose: The purpose of this test method is to determine the adaptability of components, equipment or other products to operation and storage at constant temperature and high relative humidity. Step 2: Scope This test method can be applied to both heat-dissipating and non-heat-dissipating specimens. 3. No limits 4. Test steps: 4.1 Specimens shall be inspected visually, electrically and mechanically in accordance with relevant specifications before testing. 4.2 The test specimen must be placed in the test cabinet in accordance with the relevant specifications. In order to avoid the formation of water droplets on the test specimen after it is placed in the cabinet, it is best to preheat the temperature of the test specimen to the temperature condition in the test cabinet in advance. 4.3 The specimen shall be insulated in accordance with the specified residence. 4.4 If specified in the relevant specifications, functional tests and measurements shall be performed during or after the test, and the functional tests shall be performed in accordance with the cycle required in the specifications, and the test pieces shall not be moved out of the test cabinet. 4.5 After the test, the specimen must be placed under standard atmospheric conditions for at least one hour and at most two hours to return to its original condition. Depending on the characteristics of the specimen or the different laboratory energy, the specimen can be removed or retained in the test cabinet to wait for recovery, if you want to remove the time to be as short as possible, preferably not more than five minutes, if maintained in the cabinet the humidity must be reduced to 73% to 77% R.H. within 30 minutes, while the temperature must also reach the laboratory temperature within 30 minutes +1℃ range. 5. Test conditions 5.1 Test temperature: The temperature in the test cabinet should be controlled within the range of 40+2°C. 5.2 Relative humidity: The humidity in the test cabinet should be controlled at 93(+2/-3)% R.H. Within the range. 5.3 Resident time: The resident time can be 4 days, 10 days, 21 days or 56 days. 5.4 Test tolerance: temperature tolerance is +2℃, error of packet content measurement, slow change of temperature and temperature difference in the temperature cabinet. However, in order to facilitate the maintenance of humidity within a certain range, the temperature of any two points in the test cabinet should be maintained within the minimum range as far as possible at any time. If the temperature difference exceeds 1 ° C, the humidity changes beyond the permissible range. Therefore, even short-term temperature changes may need to be controlled within 1 ° C. 6. Test setup 6.1 Temperature and humidity sensing devices must be installed in the test cabinet to monitor the temperature and humidity in the cabinet. 6.2 There shall be no condensation water droplets on the test specimen at the top or wall of the test cabinet. 6.3 The condensed water in the test cabinet must be discharged continuously and shall not be used again unless it is purified (re-purifed). 6.4 When the humidity in the test cabinet is achieved by spraying water into the test cabinet, the moisture resistance coefficient shall not be less than 500Ω. 7. Other 7.1 The temperature and humidity conditions in the test cabinet must be uniform and similar to those in the vicinity of the temperature and humidity sensor. 7.2 The temperature and humidity conditions in the test cabinet shall not be changed during the power-on or functional test of the specimen. 7.3 Precautions to be taken when removing moisture from the specimen surface shall be detailed in the relevant specifications.   IEC 68-2-14 Test method N: Temperature variation 1. Test purpose The purpose of this test method is to determine the effect of the specimen on the environment of temperature change or continuous temperature change. Step 2: Scope This test method can be divided into: Test method Na: Rapid temperature change within a specified time Test method Nb: Temperature change at specified temperature variability Test method Nc: Rapid temperature change by double liquid immersion method. The first two items apply to components, equipment or other products, and the third item applies to glass-metal seals and similar products. Step 3 Limit This test method does not validate high or low temperature environmental effects, and if such conditions are to be validated, "IEC68-2-1 test Method A:" cold "or "IEC 60068-2-2 Test Method B: dry heat" should be used. 4. Test procedure 4.1 Test method Na: Rapid temperature change in a specific time 4.1.1 Specimens shall be inspected visually, electrically and mechanically in accordance with relevant specifications before testing. 4.1.2 The specimen type shall be unpacked, unpowered and ready for use or other conditions specified in relevant specifications. The initial condition of the specimen was room temperature in the laboratory. 4.1.3 Adjust the temperature of the two temperature cabinets respectively to the specified high and low temperature conditions. 4.1.4 Place the specimen in the low-temperature cabinet and keep it warm according to the specified residence time. 4.1.5 Move the specimen into the high-temperature cabinet and keep it warm according to the specified residence time. 4.1.6 The transfer time of high and low temperature shall be subject to the test conditions. 4.1.7 Repeat the procedure of Steps 4.1.4 and 4.1.5 four times 4.1.8 After the test, the specimen should be placed under standard atmospheric conditions and kept for a certain time to make the specimen reach temperature stability. The response time shall refer to the relevant regulations. 4.1.9 After the test, the specimens shall be inspected visually, electrically and mechanically in accordance with relevant specifications. 4.2 Test method Nb: Temperature change at a specific temperature variability 4.2.1 The specimens shall be inspected visually, electrically and mechanically in accordance with relevant specifications before testing. 4.2.2 Place the test piece in the temperature cabinet. The shape of the test piece should be unpacked, unpowered and ready for use or other conditions specified in relevant specifications. The initial condition of the specimen was room temperature in the laboratory. The specimen can be made operational if required by the relevant specification. 4.2.3 The temperature of the cabinet shall be lowered to the prescribed low temperature condition, and the insulation shall be carried out according to the prescribed residence time 4.2.4 The temperature of the cabinet shall be raised to the specified high temperature condition, and heat preservation shall be carried out according to the specified residence time 4.2.5 The temperature variability of high and low temperature shall be subject to the test conditions. 4.2.6 Repeat the procedure in Steps 4.2.3 and 4.2.4: Electrical and mechanical tests shall be performed during the test. Record the time used for electrical and mechanical testing. After the test, the specimen should be placed under standard atmospheric conditions and kept for a certain time to make the specimen reach the temperature stability recovery time referred to the relevant specifications. After the test, the specimens shall be inspected visually, electrically and mechanically in accordance with the relevant specifications 5. Test conditions Test conditions can be selected by the following appropriate temperature conditions and test time or in accordance with the relevant specifications, 5.1 Test method Na: Rapid temperature change in a specific time High temperature: 1000800630500400315250200175155125100,85,70,55,4030 ° C Low temperature :-65,-55,-40,-25.-10.-5 °C Humidity: Vapor content per cubic meter of air should be less than 20 grams (equivalent to 50% relative humidity at 35 ° C). Residence time: The temperature adjustment time of the temperature cabinet can be 3 hours, 2 hours, 1 hour, 30 minutes or 10 minutes, if there is no provision, it is set to 3 hours. After the test piece is placed in the temperature cabinet, the temperature adjustment time cannot exceed one-tenth of the residence time. Transfer time: manual 2~3 minutes, automatic less than 30 seconds, small specimen less than 10 seconds. Number of cycles :5 cycles. Test tolerance: The tolerance of temperature below 200℃ is +2℃ The tolerance of the temperature between 250 and 1000C is +2% of the test temperature. If the size of the temperature cabinet cannot meet the above tolerance requirements, the tolerance can be relaxed: the tolerance of the temperature below 100 ° C is ±3 ° C, and the tolerance of the temperature between 100 and 200 ° C is ±5 ° C (the tolerance relaxation should be indicated in the report). 5.2 Test method Nb: Temperature change at a specific temperature variability High temperature: 1000800630500400315250200175155125100,85,70 55403 0 'C Low temperature :-65,-55,-40,-25,-10,-5,5℃ Humidity: Vapor per cubic meter of air should be less than 20 grams (equivalent to 50% relative humidity at 35 ° C) Residence time: including rising and cooling time can be 3 hours, 2 hours, 1 hour, 30 minutes or 10 minutes, if there is no provision, set to 3 hours. Temperature variability: The average temperature fluctuation of the temperature cabinet within 5 minutes is 1+0.2 ° C /min, 3+0.6 ° C /min, or 5+1 ° C /min. Number of cycles :2 cycles. Test tolerance: The tolerance of temperature below 200℃ is +2℃. The tolerance of the temperature between 250 and 1000℃C is +2% of the test temperature. If the size of the temperature cabinet cannot meet the above tolerance requirements, the tolerance can be relaxed. The tolerance of the temperature below 100 ° C is +3 ° C. The temperature between 100 ° C and 200 ° C is +5 ° C. (The tolerance relaxation should be indicated in the report). 6. Test setup 6.1 Test method Na: Rapid temperature change in a specific time The difference between the inner wall temperature of the high and low temperature cabinets and the temperature test specifications shall not exceed 3% and 8%(shown in °K) respectively to avoid thermal radiation problems. The thermogenic specimen should be placed in the center of the test cabinet as far as possible, and the distance between the specimen and the cabinet wall, the specimen and the specimen should be greater than 10 cm, and the ratio of the volume of the temperature cabinet and the specimen should be greater than 5:1. 6.2 Test method Nb: Temperature change at a specific temperature variability Specimens shall be inspected visually, electrically and mechanically in accordance with relevant specifications before testing. The specimen shall be in unpacked, unpowered and ready for use condition or other conditions specified in relevant specifications. The initial condition of the specimen was room temperature in the laboratory. Adjust the temperature of the two temperature cabinets respectively to the specified high and low temperature conditions The specimen is placed in a low-temperature cabinet and kept warm according to the specified residence time The specimen is placed in a high temperature cabinet and insulated according to the specified residence time. The transfer time of high and low temperature shall be performed according to the test conditions. Repeat the procedure of steps d and e four times. After the test, the specimen should be placed under standard atmospheric conditions and kept for a certain time to make the specimen reach the temperature stability recovery time referred to the relevant specifications. After the test, the specimens shall be inspected visually, electrically and mechanically in accordance with the relevant specifications 6.3 Test method NC: Rapid temperature change of double liquid soaking method The liquid used in the test shall be compatible with the specimen and shall not harm the specimen. 7. Others 7.1 Test method Na: Rapid temperature change in a specific time When the specimen is placed in the temperature cabinet, the temperature and air flow rate in the cabinet must reach the specified temperature specification and tolerance within one-tenth of the holding time. The air in the cabinet must be maintained in a circle, and the air flow rate near the specimen must not be less than 2 meters per second (2m/s). If the specimen is transferred from the high or low temperature cabinet, the holding time cannot be completed for some reason, it will stay in the previous holding state (preferably at low temperature). 7.2 Test method Nb: The air in the cabinet must be maintained in a circle at a specific temperature variability, and the air flow rate near the specimen must not be less than 2 meters per second (2m/s). 7.3 Test method NC: Rapid temperature change of double liquid soaking method When the specimen is immersed in the liquid, it can be quickly transferred between the two containers, and the liquid cannot be stirred.  

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• What are the High and Low Temperature Explosion-proof Devices?

  Sep 26, 2024

  What are the High and Low Temperature Explosion-proof Devices? Due to the particularity of the test product, during the test process, the test product may produce a large amount of gas in the high temperature or high pressure state, which may catch fire and explode. In order to ensure production safety, preventive safety protection devices can be used as optional equipment. Therefore, the high and low temperature test chamber needs to add special devices - explosion-proof devices when testing these special products. Today, let's talk about what are the high and low temperature explosion-proof devices. 1. Pressure relief port When the air generated in the test chamber increases and the gas pressure in the chamber reaches a threshold, the pressure relief port automatically opens and releases the pressure outwards. This design ensures that when the system overpressure, the pressure can be released, thereby preventing the system from collapsing or exploding. The location and number of pressure relief ports are determined according to the specific fire extinguishing system design and application requirements. 2. Smoke detector The smoke detector mainly realizes fire prevention by monitoring the concentration of smoke. The ionic smoke sensor is used inside the smoke detector. The ionic smoke sensor is a kind of sensor with advanced technology and stable and reliable operation. When the concentration of smoke particles in the chamber is greater than the threshold, it will sense and alarm to remind the production to stop operation and achieve the effect of preventing fire. 3. Gas detector A gas detector is an instrument that detects the concentration of a gas. The instrument is suitable for dangerous places where combustible or toxic gases exist, and can continuously detect the content of the measured gas in the air within the lower explosive limit for a long time. The gas diffuses into the working electrode of the sensor through the back of the porous film, where the gas is oxidized or reduced. This electrochemical reaction causes a change in the current flowing through the external circuit, and the gas concentration can be measured by measuring the size of the current. 4. Smoke exhaust system The air inlet of the pressurized fan is directly connected with the outdoor air. In order to prevent the outdoor air from being polluted by smoke, the air inlet of the supply fan should not be located at the same level as the air outlet of the exhaust machine. A one-way air valve should be installed on the outlet or inlet air pipe of the fan. Mechanical smoke exhaust system adopts smoke exhaust fan for mechanical exhaust air. According to relevant information, a well-designed mechanical smoke exhaust system can discharge 80% of the heat in the fire, so that the temperature of the fire scene is greatly reduced, and it has an important role in the safety of personnel evacuation and fire fighting. 5. Electromagnetic lock and mechanical door buckle The electromagnetic lock uses the electromagnetic principle to achieve the fixing of the lock body, without the need to use a mechanical lock tongue, so the electromagnetic lock does not exist the possibility of mechanical lock tongue damage or forced destruction. The electromagnetic lock has a high anti-impact strength, when the external impact force acts on the lock body, the lock body will not be easily destroyed, and there will be certain protective measures when the explosion occurs. 6. Automatic fire extinguishing device The automatic fire extinguishing device is mainly composed of four parts: detector (thermal energy detector, flame detector, smoke detector), fire extinguisher (carbon dioxide extinguisher), digital temperature control alarm and communication module. Through the digital communication module in the device, the real-time temperature changes, alarm status and fire extinguisher information in the fire area can be remotely monitored and controlled, which can not only remotely monitor the various states of the automatic fire extinguishing device, but also master the real-time changes in the fire area, which can minimize the loss of life and property when the fire occurs. 7. Indicator and warning light Communicate equipment status or transmission status by visual and acoustic signals to machine operators, technicians, production managers and plant personnel.  

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