The Relationship Between the Altitude of the Standard Atmosphere and Air Temperature and Pressure
The standard atmosphere referred to here refers to the "1964, ICAO Standard atmosphere" adopted by the International Civil Aviation Organization. Below an altitude of 32 km, it is the same as "1976, U.S. standard atmosphere". Changes in air temperature near the surface (below 32 km) are:
Ground: The air temperature is 15.0℃, the air pressure P=1013.25mb= 0.101325MPa
Temperature change rate from ground to elevation 11 km: -6.5 ℃/ km
On the 11km interface:
The air temperature is -56.5 ℃ and the air pressure P=226.32mb
Temperature change rate at elevations of 11-20 km: 0.0℃/ km
Temperature change rate at altitude 20-32 km: +1.0/ km
The following table lists the temperature and pressure values of the standard atmosphere at different altitudes. In the table, "gpm" is the altitude meter, and its negative sign represents the altitude
Gpm
Temperature℃
Atmospheric pressure(mb)
Gpm
Temperature℃
Atmospheric pressure(mb)
Gpm
Temperature℃
Atmospheric pressure(mb)
-400
17.6
1062.2
4800
-16.2
554.8
10000
-50.0
264.4
-200
16.3
1037.5
5000
-17.5
540.2
10200
-51.3
256.4
0
15.0
1013.3
5200
-18.8
525.9
10400
-52.6
248.6
200
13.7
989.5
5400
-20.1
511.9
10600
-53.9
241.0
400
12.4
966.1
5600
-21.4
498.3
10800
-55.2
233.6
600
11.1
943.2
5800
-22.7
484.9
11000
-56.5
226.3
800
9.8
920.8
6000
-24.0
471.8
11500
-56.5
209.2
1000
8.5
898.7
6200
-25.3
459.0
12000
-56.5
193.3
1200
7.2
877.2
6400
-26.6
446.5
12500
-56.5
178.7
1400
5.9
856.0
6600
-27.9
434.3
13000
-56.5
165.1
1600
4.6
835.2
6800
-29.2
422.3
13500
-56.5
152.6
1800
3.3
814.9
7000
-30.5
410.6
14000
-56.5
141.0
2000
2.0
795.0
7200
-31.8
399.2
14500
-56.5
130.3
2200
0.7
775.4
7400
-33.1
388.0
15000
-56.5
120.5
2400
-0.6
756.3
7600
-34.4
377.1
15500
-56.5
111.3
2600
-1.9
737.5
7800
-35.7
366.4
16000
-56.5
102.9
2800
-3.2
719.1
8000
-37.0
356.0
17000
-56.5
87.9
3000
-4.5
701.1
8200
-38.3
345.8
18000
-56.5
75.0
3200
-5.8
683.4
8400
-39.6
335.9
19000
-56.5
64.1
3400
-7.1
666.2
8600
-40.9
326.2
20000
-56.5
54.7
3600
-8.4
649.2
8800
-42.2
316.7
22000
-54.5
40.0
3800
-9.7
632.6
9000
-43.5
307.4
24000
-52.5
29.3
4000
-11.0
616.4
9200
-44.8
298.4
26000
-50.5
21.5
4200
-12.3
600.5
9400
-46.1
289.6
28000
-48.5
15.9
4400
-13.6
584.9
9600
-47.4
281.0
30000
-46.5
11.7
4600
-14.9
569.7
9800
-48.7
272.6
32000
-44.5
8.7
Unit conversion relation
1mbar=100Pa=0.1KPa=0.0001 Mpa
1ft=0.3048m=304.8mm
55000ft*0.3048=16764m
Lab Companion focused on the production of reliability environmental test equipment for 19 years, successfully helped 18,000 enterprises to test the reliability and environmental performance of products and materials.
The main products are: high temperature test chamber, high and low temperature and humidity test chamber, walk-in environmental test chamber, rapid temperature cycling test chamber, thermal shock test chamber, high and low temperature low pressure test chamber, vibration of the comprehensive chamber and other test equipment manufacturing solutions to help enterprises R & D bigger and stronger!
If you need to know more about the products of the environmental test chamber, you can search the official website of "Lab Companion", feel free to contact us for consultation, we can provide you with one-on-one professional technical advice and guidance.
Hydrogen Fuel Cell Environmental Simulation Test Scheme
At present, the economic development model based on the consumption of non-renewable energy based on coal, oil and natural gas has led to increasingly prominent environmental pollution and greenhouse effect. In order to achieve sustainable development of human beings, a harmonious relationship between man and nature has been established. The development of sustainable green energy has become a subject of great concern in the world.
As a clean energy that can store waste energy and promote the transformation from traditional fossil energy to green energy, hydrogen energy has an energy density (140MJ/kg) that is 3 times that of oil and 4.5 times that of coal, and is regarded as a subversive technological direction of the future energy revolution. Hydrogen fuel cell is the key carrier to realize the conversion of hydrogen energy into electric energy utilization. After the goal of carbon neutrality and carbon peak "double carbon" was proposed, it has gained new attention in basic research and industrial application.
Hydrogen fuel cell environmental test chamber of Lab Companion meets: fuel cell stack and module: 1W~8KW, fuel cell engine :30KW~150KW Low temperature cold start test: -40~0℃ Low temperature storage test: -40~0℃ High temperature storage test: 0~100℃.
Introduction of hydrogen fuel cell environmental test chamber
The product adopts functional modular design, explosion-proof and anti-static, and meets the relevant test standards. The product has the characteristics of high reliability and comprehensive safety warning, which is suitable for the test of the reactor and fuel cell engine system. Applicable power up to 150KW fuel cell system, low temperature test (storage, starting, performance), high temperature test (storage, starting, performance), wet heat test (high temperature and humidity
Safety parts:
1. Explosion-proof camera: real-time record the complete test situation in the box, easy to optimize or adjust in time.
2. Uv flame detector: high-speed, accurate and intelligent fire detector, accurate identification of flame signals.
3. Emergency air exhaust outlet: exhaust the toxic combustible gas in the box to ensure the safety of the test.
4. Gas detection and alarm system: intelligent and rapid identification of combustible gas, automatically generate alarm signals.
5. Double parallel single-pole screw mechanism cold unit: It has the characteristics of classification function, large power, small footprint and so on.
6. Gas precooling system: quickly control the gas temperature requirements to ensure cold start conditions.
7. Stack test rack: stainless steel stack test rack, equipped with water cooling auxiliary cooling system.
Fuel cell system test project
Fuel cell system test project
Fuel cell engine air tightness test
Power generation system quality
The volume of the battery stack
Insulation resistance detection
Starting characteristic test
Rated power starting test
Steady-state characteristic test
Rated power characteristic test
Peak power characteristic test
Dynamic response characteristic test
High temperature adaptability test
Fuel cell engine system performance test
Vibration resistance test
Low temperature adaptability test
Starting test (low temperature)
Power generation performance test
Shutdown test
Low temperature storage test
Low temperature start-up and operation procedures
/
/
Reactor and module test items
Reactor and module test items
Routine inspection
Gas leakage test
Normal operation test
Allow working pressure test
Pressure test of cooling system
Gas channeling test
Impact and vibration resistance tests
Electrical overload test
Dielectric strength test
Pressure difference test
Flammable gas concentration test
Overpressure test
Hydrogen leakage test
Freezing/thawing cycle test
High temperature storage test
Air tightness test
Fuel starvation test
Oxygen/oxidizer deficiency test
Short-circuit test
Lack of cooling/impaired cooling test
Penetration monitoring system test
Ground test
Starting test
Power generation performance test
Shutdown test
Low temperature storage test
Low temperature starting test
Product applicable standards:
GB/T 10592-2008 High and low temperature test chamber technical conditions
GB/T 10586-2006 Humidity test chamber technical conditions
GB/T31467.3-2015
GB/T31485-2015
GB/T2423.1-2208
GB/T2423.2-2008
GB/T2423.3-2006
GB/T2523.4-2008
Bicycle Lamp Reliability Test
Bicycles are in the social environment of high oil prices and environmental protection, with environmental protection, fitness, slow living... Such as multi-functional recreational sports equipment, and bicycle lights are an indispensable and important part of bicycle night riding, if the purchase of low-cost and not after reliability test of bicycle lights, riding at night or through the tunnel failure, not only for the rider has a serious threat to life safety, For driving, collision accidents can occur because the driver cannot see the cyclist, so it is important to have bicycle lights that pass the reliability test.
Reasons for bicycle lamp failure:
a. Deformation, embrittlement and fading of lamp shell caused by high temperature of lamp
b. yellowing and embrittlement of lamp shell caused by outdoor ultraviolet exposure
c. Riding up and down the hill due to high and low temperature changes in the environment caused by lamp failure
d. Abnormal power consumption of car lights
e. Lights fail after a long time of rain
f. Hot failure occurs when the lights are lit for a long time
g. During riding, the lamp fixture drags loose, causing the lamp to fall
h. Lamp circuit failure caused by road vibration and slope
Bicycle lamp test classification:
Environmental test, mechanical test, radiation test, electrical test
Initial characteristic test:
Take any 30, light the lamp with DC power supply according to the rated voltage, after the characteristics are stable, measure the distance between the current and the optical center, less than 10 defective products are qualified, more than 22 are unqualified, if the number of defective products is between 11 and 22, another 100 samples are collected for testing, and the number of defective products under the original inspection is qualified when the number is less than 22. If the number exceeds 22, it is disqualified.
Life test: 10 bulbs passed the initial characteristic test, and 8 of them met the requirements.
Bicycle test speed: simulated 15 km/h environment
High temperature test (temperature test) : 80℃, 85℃, 90℃
Low temperature test: -20℃
Temperature cycle: 50℃(60min)→ normal temperature (30min)→20(60min)→ normal temperature (30min), 2cycle
Wet heat test: 30℃/95%R.H/48 hours
Stress screening test: High temperature: 85℃←→ Low temperature: -25℃, dwell time: 30min, cycle: 5cycles, power on, time: ≧24h
Shell salt spray test: 20℃/15% salt concentration/spray for 6 hours, determination method: the surface of the shell should not occur obvious rust
Waterproof test:
Description: The IPX rating of rainproof lamps needs to be at least IPX3 or above
IPX3(Water resistance) : Drop 10 liters of water vertically from a height of 200CM at 60˚ (test time: 10 minutes)
IPX4(anti-water, anti-splash) : 10 liters of water drops from 30 ~ 50CM in any direction (test time: 10 minutes)
IPX5:3m 12.5L of water from any direction [weak water](test time: 3 minutes)
IPX6:3m Strong spray 30 liters from any direction [strong water, pressure: 100KPa](test time: 3 minutes)
IPX7(Life waterproof) : It can be used for 30 minutes under 1m in water
Vibration test: vibration number 11.7 ~ 20Hz/amplitude: 11 ~ 4mm/ time: up and down 2h, about 2h, 2h before and after 2h/acceleration 4 ~ 5g
Drop test: 1 meter (hand drop), 2 meters (bicycle fall, fall from the frame)/ concrete floor/four times/four sides
Impact test: 10mm flat wooden platform/Distance: 1 m/diameter 20mm mass 36g steel ball free fall/top surface and side once
Low temperature impact: When the sample is cold to -5℃, maintain this temperature for three hours and then carry out the impact test
Irradiation test: long time irradiation brightness test, low voltage irradiation test, light brightness, light color
Bicycle lamp noun sorting:
Laptop Test Conditions
Notebook computer from the early 12-inch screen evolution to the current LED backlit screen, its computing efficiency and 3D processing, will not be lost to the general desktop computer, and the weight is becoming less and less burden, the relative reliability test requirements for the entire notebook computer is becoming more and more stringent, from the early packaging to the current boot down, the traditional high temperature and high humidity to the current condensation test. From the temperature and humidity range of the general environment to the desert test as a common condition, these are the parts that need to be considered in the production of notebook computer related components and design, the test conditions of the relevant environmental tests collected so far are organized and shared with you.
Keyboard tapping test:
Test one:
GB:1 million times
Key pressure :0.3~0.8(N)
Button stroke :0.3~1.5(mm)
Test 2: Key pressure: 75g(±10g) Test 10 keys for 14 days, 240 times per minute, a total of about 4.83 million times, once every 1 million times
Japanese manufacturers :2 to 5 million times
Taiwan manufacturer 1: more than 8 million times
Taiwan Manufacturer 2:10 million times
Power switch and connector plug pull test:
This test model simulates the lateral forces that each connector can withstand under abnormal usage. General laptop test items: USB, 1394, PS2, RJ45, Modem, VGA... Equal application force 5kg(50 times), up and down left and right pull and plug.
Power switch and connector plug test:
4000 times (Power supply)
Screen cover opening and closing test:
Taiwanese manufacturers: open and close 20,000 times
Japanese manufacturer 1: opening and closing test 85,000 times
Japanese manufacturer 2: opening and closing 30,000 times
System standby and recovery switch test:
General note type: interval 10sec, 1000cycles
Japanese manufacturer: System standby and recovery switch test 2000 times
Common causes of laptop failure:
☆ Foreign objects fall on the notebook
☆ Falls off the table while in use
☆ Tuck the notebook in a handbag or trolley case
☆ Extremely high temperature or low temperature ☆ Normal use (overuse)
☆ Wrong use in tourist destinations
☆PCMCIA inserted incorrectly
☆ Place foreign objects on the keyboard
Shutdown drop test:
General notebook type :76 cm
GB package drop: 100cm
Us Army and Japanese notebook computers: The height of the computer is 90 cm from all sides, sides, corners, a total of 26 sides
Platform :74 cm (packing required)
Land: 90cm (packing required)
TOSHIBA&BENQ 100 cm
Boot drop test:
Japanese :10 cm boot fall
Taiwan :74 cm boot fall
Laptop main board temperature shock:
Slope 20℃/min
Number of cycles 50cycles(no operation during impact)
The U.S. military's technical standards and test conditions for laptop procurement are as follows:
Impact test: Drop the computer 26 times from all sides, sides and corners at a height of 90 cm
Earthquake resistance test :20Hz~1000Hz, 1000Hz~2000Hz frequency once an hour X, Y and Z axis continuous vibration
Temperature test :0℃~60℃ 72 hours of aging oven
Waterproof test: Spray water on the computer for 10 minutes in all directions, and the water spray rate is 1mm per minute
Dust test: Spray the concentration of 60,000 mg/ per cubic meter of dust for 2 seconds (interval of 10 minutes, 10 consecutive times, time 1 hour)
Meets MIL-STD-810 military specifications
Waterproof test:
Us Army notebook :protection class:IP54(dust & rain) Sprayed the computer with water in all directions for 10 minutes at a rate of 1mm per minute.
Dust proof test:
Us Army notebook: Spray a concentration of 60,000 mg/ m3 of dust for 2 seconds (10 minute intervals, 10 consecutive times, time 1 hour)
Temperature Cyclic Stress Screening (2)
Introduction of stress parameters for temperature cyclic stress screening:
The stress parameters of temperature cyclic stress screening mainly include the following: high and low temperature extremum range, dwell time, temperature variability, cycle number
High and low temperature extremal range: the larger the range of high and low temperature extremal, the fewer cycles required, the lower the cost, but can not exceed the product can withstand the limit, do not cause new fault principle, the difference between the upper and lower limits of temperature change is not less than 88°C, the typical range of change is -54°C to 55°C.
Dwell time: In addition, the dwell time can not be too short, otherwise it is too late to make the product under test produce thermal expansion and contraction stress changes, as for the dwell time, the dwell time of different products is different, you can refer to the relevant specification requirements.
Number of cycles: As for the number of cycles of temperature cyclic stress screening, it is also determined by considering product characteristics, complexity, upper and lower limits of temperature and screening rate, and the screening number should not be exceeded, otherwise it will cause unnecessary harm to the product and cannot improve the screening rate. The number of temperature cycles ranges from 1 to 10 cycles [ordinary screening, primary screening] to 20 to 60 cycles [precision screening, secondary screening], for the removal of the most likely workmanship defects, about 6 to 10 cycles can be effectively removed, in addition to the effectiveness of the temperature cycle, Mainly depends on the temperature variation of the product surface, rather than the temperature variation inside the test box.
There are seven main influencing parameters of temperature cycle:
(1) Temperature Range
(2) Number of Cycles
(3) Temperature Rate of Chang
(4) Dwell Time
(5) Airflow Velocities
(6) Uniformity of Stress
(7) Function test or not (Product Operating Condition)
Stress screening fatigue classification:
The general classification of Fatigue research can be divided into High-cycle Fatigue, Low-cycle Fatigue and Fatigue Crack Growth. In the aspect of low cycle Fatigue, it can be subdivided into Thermal Fatigue and Isothermal Fatigue.
Stress screening acronyms:
ESS: Environmental stress screening
FBT: Function board tester
ICA: Circuit analyzer
ICT: Circuit tester
LBS: load board short-circuit tester
MTBF: mean time between failures
Time of temperature cycles:
a.MIL-STD-2164(GJB 1302-90) : In the defect removal test, the number of temperature cycles is 10, 12 times, and in the trouble-free detection it is 10 ~ 20 times or 12 ~ 24 times. In order to remove the most likely workmanship defects, about 6 ~ 10 cycles are needed to effectively remove them. 1 ~ 10 cycles [general screening, primary screening], 20 ~ 60 cycles [precision screening, secondary screening].
B.od-hdbk-344 (GJB/DZ34) Initial screening equipment and unit level uses 10 to 20 loops (usually ≧10), component level uses 20 to 40 loops (usually ≧25).
Temperature variability:
a.MIL-STD-2164(GJB1032) clearly states: [Temperature change rate of temperature cycle 5℃/min]
B.od-hdbk-344 (GJB/DZ34) Component level 15 ° C /min, system 5 ° C /min
c. Temperature cyclic stress screening is generally not specified temperature variability, and its commonly used degree variation rate is usually 5°C/min
EC-35EXT, Superior constant temperature bath (306L)
Project
Type
Series
ＥＸＴ
Function
Temperature occurs in a way
Dry wet bulb method
Temperature range
-70 ～ +150 ℃
Range of temperature
Below the + 100℃
±0.3 ℃
Above the + 101℃
±0.5 ℃
Temperature distribution
Below the + 100℃
±0. 7 ℃
Above the + 101℃
±1.0 ℃
The temperature drops the time
＋125 ～－55 ℃
Within 18 points (10℃ / point average temperature change)
Temperature rise time
－55 ～＋125 ℃
Within 18 minutes (10℃ / minute)
The internal volume of the uterus was tested
306L
Test room inch method (width, depth and height)
630mm × 540mm × 900mm
Product inch method (width, depth and height)
1100mm × 1960mm × 1900mm
Make the material
External outfit
Test room control panel
machine room
Cold interductile steel plate is dark gray
Inside
Stainless steel plate (SUS304,2B polished)
Broken heat material
Test room
Hard synthetic resin
door
Hard synthetic resin foam cotton, glass cotton
Project
Type
Series
ＥＸＴ
Cooling dehumidifying device
Cooling-down method
Mechanical section shrinkage and freezing mode and binary freezing mode
Cooling medium；coolant
Single segment side
R 404A
Binary high temperature / low temperature side
R 404A / R23
Cooling and dehumidifier
Multi-channel mixed heat sink type
The condenser
(water-cooled)
Calorifier
Form
Nickel-chromium heat-resistant alloy heater
Blower
Form
Stir fan
Controller
The temperature is set
-72.0 ～ + 152.0 ℃
Time setting Fanny
0 ~ 999 Time 59 minutes (formula) 0 ~ 20000 Time 59 minutes (formula formula)
Set decomposition energy
Temperature was 0.1℃ for 1 min
Indicate accuracy
Temperature ± 0.8℃ (typ.), time ± 100 PPM
Vacation type
Value or program
Stage number
20-stage / 1 program
The number of procedures
The maximum number of incoming force (RAM) programs is 32 programs
The maximum number of internal ROM programs is 13 programs式
Round-trip number
Max. 98, or unlimited
Number of round-trip repeats
Maximum 3 times
Displace the end
Pt 100Ω ( at 0 ℃ )，grade ( JIS C 1604-1997 )
Control action
When splitting the PID action
Endovirus function
Early delivery function, standby function, setting value maintenance function, power outage protection function,
Power action selection function, maintenance function, transportation round-trip function,
Time delivery function, time signal output function, overrising and overcooling prevention function,
Abnormal representation function, external alarm output function, setting paradigm representation function,
Transport type selection function, the calculation time represents the function, the slot lamp lamp function
Project
Type
Series
ＥＸＨ
Control panel
Equipment machine
LCD operating panel (type contact panel),
Represents lamp (power, transport, abnormal), test power supply terminal, external alarm terminal,
Time signal output terminal, power cord connector
Protective device
Refrigerating cycle
Overload protection device, high blocking device
Calorifier
Temperature over-rise protection device, temperature fuse
Blower
Overload protection device
Control panel
Leakage breaker for power supply, fuse (heater,),
Fuse (for operating loop), temperature rise protection device (for testing),
Temperature rise overcooling prevention device (test material, in microcomputer)
Pay belongs to the product
Test material shed shed by * 8
Stainless steel Shshed (2), shed (4)
Fuse
Operating loop Protection Fuses (2)
Operating specification
( 1 )
Else
Bolus (Cable hole: 1)
Equipment products
Adventitia
Heat-resistant glass: 270mm: 190mm
1
Cable hole
Inner diameter of 50mm
1
The trough inside the lamp
AC100V 15W White hot ball
1
Wheel
6
Horizontal adjustment
6
Electrovirus characteristics
Power supply is * 5.1
AC Three-phase 380V 50Hz
Maximum load current
60A
Capacity of the leakage breaker for the power supply
80A
Sensory current 30mA
Power distribution thickness
60mm２
Rubber insulation hose
Coarseness of grounding wire
14mm２
Cooling water at * 5.3
Water yield
5000 L /h (When the cooling water inlet temperature is 32℃)
water pressure
0.1 ～ 0.5MPa
Side pipe diameter of the device
PT1 1/4
Tubing
Drain-pipe ＊ 5.4
PT1/2
Product weight
700kg
AEC-Q100- Failure Mechanism Based on Integrated Circuit Stress Test Certification
With the progress of automotive electronic technology, there are many complicated data management control systems in today's cars, and through many independent circuits, to transmit the required signals between each module, the system inside the car is like the "master-slave architecture" of the computer network, in the main control unit and each peripheral module, automotive electronic parts are divided into three categories. Including IC, discrete semiconductor, passive components three categories, in order to ensure that these automotive electronic components meet the highest standards of automotive anquan, the American Automotive Electronics Association (AEC, The Automotive Electronics Council is a set of standards [AEC-Q100] designed for active parts [microcontrollers and integrated circuits...] and [[AEC-Q200] designed for passive components, which specifies the product quality and reliability that must be achieved for passive parts. Aec-q100 is the vehicle reliability test standard formulated by the AEC organization, which is an important entry for 3C and IC manufacturers into the international auto factory module, and also an important technology to improve the reliability quality of Taiwan IC. In addition, the international auto factory has passed the anquan standard (ISO-26262). AEC-Q100 is the basic requirement to pass this standard.
List of automotive electronic parts required to pass AECQ-100:
Automotive disposable memory, Power Supply step-down regulator, Automotive photocoupler, three-axis accelerometer sensor, video jiema device, rectifier, ambient light sensor, non-volatile ferroelectric memory, power management IC, embedded flash memory, DC/DC regulator, Vehicle gauge network communication device, LCD driver IC, Single power Supply differential Amplifier, Capacitive proximity switch Off, high brightness LED driver, asynchronous switcher, 600V IC, GPS IC, ADAS Advanced Driver Assistance System Chip, GNSS Receiver, GNSS front-end amplifier... Let's wait.
AEC-Q100 Categories and Tests:
Description: AEC-Q100 specification 7 major categories a total of 41 tests
Group A- ACCELERATED ENVIRONMENT STRESS TESTS consists of 6 tests: PC, THB, HAST, AC, UHST, TH, TC, PTC, HTSL
Group B- ACCELERATED LIFETIME SIMULATION TESTS consists of three tests: HTOL, ELFR, and EDR
PACKAGE ASSEMBLY INTEGRITY TESTS consists of 6 tests: WBS, WBP, SD, PD, SBS, LI
Group D- DIE FABRICATION RELIABILITY Test consists of 5 TESTS: EM, TDDB, HCI, NBTI, SM
The group ELECTRICAL VERIFICATION TESTS consist of 11 tests, including TEST, FG, HBM/MM, CDM, LU, ED, CHAR, GL, EMC, SC and SER
Cluster F-Defect SCREENING TESTS: 11 tests, including: PAT, SBA
The CAVITY PACKAGE INTEGRITY TESTS consist of 8 tests, including: MS, VFV, CA, GFL, DROP, LT, DS, IWV
Short description of test items:
AC: Pressure cooker
CA: constant acceleration
CDM: electrostatic discharge charged device mode
CHAR: indicates the feature description
DROP: The package falls
DS: chip shear test
ED: Electrical distribution
EDR: non-failure-prone storage durability, data retention, working life
ELFR: Early life failure rate
EM: electromigration
EMC: Electromagnetic compatibility
FG: fault level
GFL: Coarse/fine air leakage test
GL: Gate leakage caused by thermoelectric effect
HBM: indicates the human mode of electrostatic discharge
HTSL: High temperature storage life
HTOL: High temperature working life
HCL: hot carrier injection effect
IWV: Internal hygroscopic test
LI: Pin integrity
LT: Cover plate torque test
LU: Latching effect
MM: indicates the mechanical mode of electrostatic discharge
MS: Mechanical shock
NBTI: rich bias temperature instability
PAT: Process average test
PC: Preprocessing
PD: physical size
PTC: power temperature cycle
SBA: Statistical yield analysis
SBS: tin ball shearing
SC: Short circuit feature
SD: weldability
SER: Soft error rate
SM: Stress migration
TC: temperature cycle
TDDB: Time through dielectric breakdown
TEST: Function parameters before and after stress test
TH: damp and heat without bias
THB, HAST: Temperature, humidity or high accelerated stress tests with applied bias
UHST: High acceleration stress test without bias
VFV: random vibration
WBS: welding wire cutting
WBP: welding wire tension
Temperature and humidity test conditions finishing:
THB(temperature and humidity with applied bias, according to JESD22 A101) : 85℃/85%R.H./1000h/bias
HAST(High Accelerated stress test according to JESD22 A110) : 130℃/85%R.H./96h/bias, 110℃/85%R.H./264h/bias
AC pressure cooker, according to JEDS22-A102:121 ℃/100%R.H./96h
UHST High acceleration stress test without bias, according to JEDS22-A118, equipment: HAST-S) : 110℃/85%R.H./264h
TH no bias damp heat, according to JEDS22-A101, equipment: THS) : 85℃/85%R.H./1000h
TC(temperature cycle, according to JEDS22-A104, equipment: TSK, TC) :
Level 0: -50℃←→150℃/2000cycles
Level 1: -50℃←→150℃/1000cycles
Level 2: -50℃←→150℃/500cycles
Level 3: -50℃←→125℃/500cycles
Level 4: -10℃←→105℃/500cycles
PTC(power temperature cycle, according to JEDS22-A105, equipment: TSK) :
Level 0: -40℃←→150℃/1000cycles
Level 1: -65℃←→125℃/1000cycles
Level 2 to 4: -65℃←→105℃/500cycles
HTSL(High temperature storage life, JEDS22-A103, device: OVEN) :
Plastic package parts: Grade 0:150 ℃/2000h
Grade 1:150 ℃/1000h
Grade 2 to 4:125 ℃/1000h or 150℃/5000h
Ceramic package parts: 200℃/72h
HTOL(High temperature working life, JEDS22-A108, equipment: OVEN) :
Grade 0:150 ℃/1000h
Class 1:150℃/408h or 125℃/1000h
Grade 2:125℃/408h or 105℃/1000h
Grade 3:105℃/408h or 85℃/1000h
Class 4:90℃/408h or 70℃/1000h
ELFR(Early Life failure Rate, AEC-Q100-008) : Devices that pass this stress test can be used for other stress tests, general data can be used, and tests before and after ELFR are performed under mild and high temperature conditions.
Reliability Environmental Test Equipment Combined with Multi-track Temperature Control and Detection Applications
Environmental test equipment includes constant temperature and humidity test chamber, hot and cold shock test chamber, temperature cycle test chamber, no wind oven... These test equipment are all in the simulated environment of temperature, humidity impact on the product, to find out the design, production, storage, transportation, use process may appear product defects, previously only simulated test area air temperature, but in the new international standards and the new test conditions of the international factory, the beginning of the requirements based on the air temperature is not. It is the surface temperature of the test product. In addition, the surface temperature should also be measured and recorded synchronously during the test process for post-test analysis. The relevant environmental test equipment should be combined with surface temperature control and the application of surface temperature measurement is summarized as follows.
Constant temperature and humidity test chamber test table temperature detection application:
Description: Constant temperature and humidity test chamber in the test process, combined with multi-track temperature detection, high temperature and humidity, condensation (condensation), combined temperature and humidity, slow temperature cycle... During the test process, the sensor is affixed to the surface of the test product, which can be used to measure the surface temperature or internal temperature of the test product. Through this multi-track temperature detection module, the set conditions, actual temperature and humidity, the surface temperature of the test product, and the same measurement and record can be integrated into a synchronous curve file for subsequent storage and analysis.
Thermal shock test chamber surface temperature control and detection applications: [dwell time based on surface temperature control], [temperature shock process surface temperature measurement record]
Description: The 8-rail temperature sensor is attached to the surface of the test product and applied to the temperature shock process. The dwell time can be counted backward according to the arrival of the surface temperature. During the impact process, the setting conditions, the test temperature, the surface temperature of the test product, and the same measurement and record can be integrated into a synchronous curve.
Temperature cycle test chamber surface temperature control and detection application: [Temperature cycle temperature variability and dwell time are controlled according to the test product surface temperature]
Description: Temperature cycle test is different from temperature shock test. Temperature shock test uses the maximum energy of the system to carry out temperature changes between high and low temperatures, and its temperature change rate is as high as 30 ~ 40℃ /min. Temperature cycle test requires a process of high and low temperature changes, and its temperature variability can be set and controlled. However, the new specification and the test conditions of international manufacturers have begun to require that the temperature variability refers to the surface temperature of the test product, not the air temperature, and the current temperature cycle specification temperature variability control. According to the test product surface specifications are [JEDEC-22A-104F, IEC60749-25, IPC9701, ISO16750, AEC-Q100, LV124, GMW3172]... In addition, the residence time of high and low temperatures can also be based on the test surface, rather than the air temperature.
Temperature cyclic stress screening test chamber surface temperature control and detection applications:
Instructions: Temperature cycle stress screening testing machine, combined with multi-rail temperature measurement, in the temperature variability of stress screening, you can choose to use [air temperature] or [test product surface temperature] to control the temperature variability, in addition, in the high and low temperature resident process, the time reciprocal can also be controlled according to the surface of the test product. In accordance with the relevant specifications (GJB1032, IEST) and the requirements of international organizations, according to the definition of GJB1032 in the stress screening residence time and temperature measurement point, 1. The number of thermocouples fixed on the product shall not be less than 3, and the temperature measurement point of the cooling system shall not be less than 6, 2. Ensure that the temperature of 2/3 thermocouples on the product is set at ±10℃, in addition, according to the requirements of IEST(International Association for Environmental Science and Technology), the residence time should reach the temperature stabilization time plus 5min or performance test time.
No air oven (natural convection test chamber) surface temperature detection application:
Description: Through the combination of a windless oven (natural convection test chamber) and a multi-track temperature detection module, the temperature environment without fan (natural convection) is generated, and the relevant temperature detection test is integrated. This solution can be applied to the actual ambient temperature test of electronic products (such as: Cloud server, 5G, electric vehicle interior, indoor without air conditioning environment, solar inverter, large LCD TV, home Internet sharer, office 3C, laptop, desktop, game console....... Etc.).
Inverter- Reliability Test
Inverter- reliability test also known as voltage converter, its function is to convert DC low voltage into AC high voltage, some electronic equipment must be driven by AC power, but we provide is DC power, at this time you must use the Inverter, direct current into alternating current to drive the electronic parts. Inverter- reliability test also known as voltage converter, its function is to convert DC low voltage into AC high voltage, some electronic equipment must be driven by AC power, but we provide is DC power, at this time you must use the Inverter, direct current into alternating current to drive the electronic parts.
Relevant test conditions:
Item
temperature
time
other
Initial test at normal temperature
25 ℃
TIME≥2 hours
-
Low temperature initial test
0 ℃ or -5 °C
TIME≥2 hours
-
High temperature initial test
60℃
TIME≥2 hours
-
High temperature and high humidity test
40℃/95%RH
240 hours
-
High temperature storage test
70℃
TIME≥96 hours or 240 hours
-
Low temperature storage test -1
-20°C
TIME≥96 hours
-
Low temperature storage test -2
-40℃
240 hours
-
High temperature and high humidity storage test
40℃/90%RH
TIME≥96 hours
-
Temperature cycle test
-20℃~ 70℃
5 cycle
Room temperature ↓-20 ℃(4 hours)↓ Room temperature (90%RH.4 hours)↓70°C(4 hours)↓ Room temperature (4 hours)
High temperature load test
55 ℃
equivalent load, 1,000 hours
-
Life test
40°C
MTBF≥40000 hours
-
on/off test (power cycle)
-
-
1min:on, 1min:off, 5,000 cycles using equivalent load
Vibration test
-
-
Acceleration 3q, frequency 10~55HZ, X, Y, Z three directions 10 minutes each, a total of 30 minutes
Impact test
-
-
Acceleration of 80g, 10 ms each time, Three times in X, Y, Z directions
Note 1: The tested module should be placed at normal (15~35° C,45~65%RH) for one hour before testing
Applicable equipment:
1. High and low temperature test chamber
2. High temperature and high humidity test chamber
3. Rapid temperature cycle test chamber
IEC 61646 Test Standard for Thin-film Solar Photoelectric Modules
Through the diagnostic measurement, electrical measurement, irradiation test, environmental test, mechanical test five types of test and inspection mode, confirm the design confirmation and form approval requirements of thin film solar energy, and confirm that the module can operate in the general climate environment required by the specification for a long time.
IEC 61646-10.1 Visual inspection procedure
Objective: To check for any visual defects in the module.
Performance at STC under IEC 61646-10.2 Standard test conditions
Objective: Using natural light or A class simulator, under standard test conditions (battery temperature: 25±2℃, irradiance: 1000wm^-2, standard solar spectrum irradiation distribution in accordance with IEC891), test the electrical performance of the module with load change.
IEC 61646-10.3 Insulation test
Objective: To test whether there is good insulation between the current carrying parts and the frame of the module
IEC 61646-10.4 Measurement of temperature coefficients
Objective: To test the current temperature coefficient and voltage temperature coefficient in the module test. The temperature coefficient measured is valid only for the irradiation used in the test. For linear modules, it is valid within ±30% of this irradiation. This procedure is in addition to IEC891, which specifies the measurement of these coefficients from individual cells in a representative batch. The temperature coefficient of the thin-film solar cell module depends on the heat treatment process of the module involved. When the temperature coefficient is involved, the conditions of the thermal test and the irradiation results of the process should be indicated.
IEC 61646-10.5 Measurement of nominal operating cell temperature (NOCT)
Objective: To test the NOCT of the module
IEC 61646-10.6 Performance at NOCT
Objective: When the nominal operating battery temperature and irradiance are 800Wm^-2, under the standard solar spectrum irradiance distribution condition, the electrical performance of the module varies with the load.
IEC 61646-10.7 Performance at low irradiance
Objective: To determine the electrical performance of modules under load under natural light or A class A simulator at 25℃ and 200Wm^-2(measured with appropriate reference cell).
IEC 61646-10.8 Outdoor exposure Testing
Objective: To make an unknown assessment of the resistance of the module to exposure to outdoor conditions and to show any effects of degradation that could not be detected by the experiment or test.
IEC 61646-10.9 Hot spot test
Objective: To determine the ability of the module to withstand thermal effects, such as packaging material aging, battery cracking, internal connection failure, local shading or stained edges can cause such defects.
IEC 61646-10.10 UV test (UV test)
Objective: To confirm the ability of the module to withstand ultraviolet (UV) radiation, the new UV test is described in IEC1345, and if necessary, the module should be exposed to light before performing this test.
IEC61646-10.11 Thermal cycling Test (Thermal cycling)
Objective: To confirm the ability of the module to resist thermal inhomogeneity, fatigue and other stresses due to repeated temperature changes. The module should be annealed before receiving this test. [Pre-I-V test] refers to the test after annealing, be careful not to expose the module to light before the final I-V test.
Test requirements:
a. Instruments to monitor the electrical continuity within each module throughout the test process
b. Monitor the insulation integrity between one of the recessed ends of each module and the frame or support frame
c. Record module temperature throughout the test and monitor any open circuit or ground failure that may occur (no intermittent open circuit or ground failure during the test).
d.The insulation resistance shall meet the same requirements as the initial measurement
IEC 61646-10.12 Humidity freeze cycle test
Purpose: To test the module's resistance to the influence of the subsequent sub-zero temperature under high temperature and humidity, this is not a thermal shock test, before receiving the test, the module should be annealed and subjected to a thermal cycle test, [[Pre-I-V test] refers to the thermal cycle after the test, be careful not to expose the module to light before the final I-V test.
Test requirements:
a. Instruments to monitor the electrical continuity within each module throughout the test process
b. Monitor the insulation integrity between one of the recessed ends of each module and the frame or support frame
c. Record module temperature throughout the test and monitor any open circuit or ground failure that may occur (no intermittent open circuit or ground failure during the test).
d. The insulation resistance shall meet the same requirements as the initial measurement
IEC 61646-10.13 Damp heat Test (Damp heat)
Objective: To test the ability of the module to resist long-term infiltration of moisture
Test requirements: The insulation resistance shall meet the same requirements as the initial measurement
IEC 61646-10.14 Robustness of terminations
Objective: To determine whether the attachment between the lead end and the lead end to the module body can withstand the force during normal installation and operation.
IEC 61646-10.15 Twist Test
Objective: To detect possible problems caused by module installation on an imperfect structure
IEC 61646-10.16 Mechanical load test
Purpose: The purpose of this test is to determine the ability of the module to withstand wind, snow, ice, or static loads
IEC 61646-10.17 Hail test
Objective: To verify the impact resistance of the module to hail
IEC 61646-10.18 Light soaking Test
Objective: To stabilize the electrical properties of thin film modules by simulating solar irradiation
IEC 61646-10.19 Annealing Tests (Annealing)
Objective: The film module is annealed before the verification test. If not annealed, the heating during the subsequent test procedure may mask the attenuation caused by other causes.
IEC 61646-10.20 Wet leakage current Test
Purpose: To evaluate the insulation of the module under wet operating conditions and to verify that moisture from rain, fog, dew or melting snow does not enter the live parts of the module circuit, which may cause corrosion, ground failure or safety hazards.
IEEE1513 Temperature Cycle Test , Humidity Freezing Test and Thermal-humidity Test 1
Among the environmental reliability test requirements of Cells, Receiver, and Module of concentrated solar cells have their own test methods and test conditions in temperature cycle test, humidity freezing test, and thermal-humidity test, and there are also differences in the quality confirmation after the test. Therefore, IEEE1513 has three tests on temperature cycle test, humidity freezing test and thermal-humidity test in the specification, and its differences and test methods are sorted out for everyone's reference.
Reference source: IEEE Std 1513-2001
IEEE1513-5.7 Thermal cycle test IEEE1513-5.7 thermal cycle test
Objective: To determine whether the receiving end can properly withstand the failure caused by the thermal expansion difference between the parts and the joint material, especially the solder joint and package quality. Background: Temperature cycling tests of concentrated solar cells reveal welding fatigue of copper heat sinks and require complete ultrasonic transmission to detect crack growth in the cells (SAND92-0958 [B5]).
Crack propagation is a function of the temperature cycle number, the initial complete solder joint, solder joint type, between the battery and the radiator due to the thermal expansion coefficient and temperature cycle parameters, after the thermal cycle test to check the receiver structure of the packaging and insulation material quality. There are two test plans for the program, tested as follows:
Program A and Program B
Procedure A: Test receiver resistance at thermal stress caused by thermal expansion difference
Procedure B: Temperature cycle before humidity freezing test
Before pretreatment, it is emphasized that the initial defects of the receiving material are caused by actual wet freezing. In order to adapt to different concentrated solar energy designs, temperature cycle tests of program A and Program B can be checked, which are listed in Table 1 and Table 2.
1. These receivers are designed with solar cells directly connected to copper radiators, and the conditions required are listed in the first row table
2. This will ensure that potential failure mechanisms, which may lead to defects occurring during the development process, are discovered. These designs adopt different methods and can use alternative conditions as shown in the table to debond the radiator of the battery.
Table 3 shows that the receiving portion performs a program B temperature cycle prior to the alternative.
Since program B mainly tests other materials on the receiving end, alternatives are offered to all designs
Table 1 - Temperature cycle procedure test for receivers
Program A- Thermal cycle
Option
Maximum temperature
Total number of cycles
Application current
Required design
TCR-A
110℃
250
No
The battery is welded directly to the copper radiator
TCR-B
90℃
500
No
Other design records
TCR-C
90℃
250
I(applied) = Isc
Other design records
Table 2 - Temperature cycle procedure test of the receiver
Procedure B- Temperature cycle before wet freezing test
Option
Maximum temperature
Total number of cycles
Application current
Required design
HFR-A
110℃
100
No
Documentation of all designs
HFR-B
90℃
200
No
Documentation of all designs
HFR-C
90℃
100
I(applied) = Isc
Documentation of all designs
Procedure: The receiving end will be subjected to a temperature cycle between -40 °C and the maximum temperature (following the test procedure in Table 1 and Table 2), the cycle test can be put into a single or two boxes of gas temperature shock test chamber, the liquid shock cycle should not be used, the dwell time is at least 10 minutes, and the high and low temperature should be within the requirement of ±5 °C. The cycle frequency should not be greater than 24 cycles a day and not less than 4 cycles a day, the recommended frequency is 18 times a day.
The number of thermal cycles and the maximum temperature required for the two samples, refer to Table 3 (Procedure B of Figure 1), after which a visual inspection and electrical characteristics test will be carried out (refer to 5.1 and 5.2). These samples will be subjected to a wet freezing test, according to 5.8, and a larger receiver will refer to 4.1.1(this procedure is illustrated in Figure 2).
Background: The purpose of the temperature cycle test is to accelerate the test that will appear in the short term failure mechanism, prior to the detection of concentrating solar hardware failure, therefore, the test includes the possibility of seeing a wide temperature difference beyond the module range, the upper limit of the temperature cycle of 60 ° C is based on the softening temperature of many module acrylic lenses, for other designs, the temperature of the module. The upper limit of the temperature cycle is 90 ° C (see Table 3)
Table 3- List of test conditions for module temperature cycles
Procedure B Temperature cycle pretreatment before wet freezing test
Option
Maximum temperature
Total number of cycles
Application current
Required design
TCM-A
90℃
50
No
Documentation of all designs
TEM-B
60℃
200
No
Plastic lens module design may be required
IEEE1513 Temperature Cycle Test and Humidity Freezing Test, Thermal-humidity Test 2
Steps:
Both modules will perform 200 cycle temperature cycles between -40 °C and 60 °C or 50 cycle temperature cycles between -40 °C and 90 °C, as specified in ASTM E1171-99.
Note:
ASTM E1171-01: Test method for photoelectric modulus at Loop Temperature and humidity
Relative humidity does not need to be controlled.
The temperature variation should not exceed 100℃/ hour.
The residence time should be at least 10 minutes and the high and low temperature should be within the requirement of ±5℃
Requirements:
a. The module will be inspected for any obvious damage or degradation after the cycle test.
b. The module should not show any cracks or warps, and the sealing material should not delaminate.
c. If there is a selective electrical function test, the output power should be 90% or more under the same conditions of many original basic parameters
Added:
IEEE1513-4.1.1 Module representative or receiver test sample, if a complete module or receiver size is too large to fit into an existing environmental test chamber, the module representative or receiver test sample may be substituted for a full-size module or receiver.
These test samples should be specially assembled with a replacement receiver, as if containing a string of cells connected to a full-size receiver, the battery string should be long and include at least two bypass diodes, but in any case three cells are relatively few, which summarizes the inclusion of links with the replacement receiver terminal should be the same as the full module.
The replacement receiver shall include components representative of the other modules, including lens/lens housing, receiver/receiver housing, rear segment/rear segment lens, case and receiver connector, procedures A, B, and C will be tested.
Two full-size modules should be used for outdoor exposure test procedure D.
IEEE1513-5.8 Humidity freeze cycle test Humidity freeze cycle test
Receiver
Purpose:
To determine whether the receiving part is sufficient to resist corrosion damage and the ability of moisture expansion to expand the material molecules. In addition, frozen water vapor is the stress for determining the cause of failure
Procedure:
The samples after temperature cycling will be tested according to Table 3, and will be subjected to wet freezing test at 85 ℃ and -40 ℃, humidity 85%, and 20 cycles. According to ASTM E1171-99, the receiving end with large volume shall refer to 4.1.1
Requirements:
The receiving part shall meet the requirements of 5.7. Move out of the environment tank within 2 to 4 hours, and the receiving part should meet the requirements of the high-voltage insulation leakage test (see 5.4).
module
Purpose:
Determine whether the module has sufficient capacity to resist harmful corrosion or widening of material bonding differences
Procedure: Both modules will be subjected to wet freezing tests for 20 cycles, 4 or 10 cycles to 85 ° C as shown in ASTM E1171-99.
Please note that the maximum temperature of 60 ° C is lower than the wet freezing test section at the receiving end.
A complete high voltage insulation test (see 5.4) will be completed after a two to four hour cycle. Following the high voltage insulation test, the electrical performance test as described in 5.2 will be carried out. In large modules may also be completed, see 4.1.1.
Requirements:
a. The module will check for any obvious damage or degradation after the test, and record any.
b. The module should exhibit no cracking, warping, or severe corrosion. There should be no layers of sealing material.
c. The module shall pass the high voltage insulation test as described in IEEE1513-5.4.
If there is a selective electrical function test, the output power can reach 90% or more under the same conditions of many original basic parameters
IEEE1513-5.10 Damp heat test IEEE1513-5.10 Damp heat test
Objective: To evaluate the effect and ability of receiving end to withstand long-term moisture infiltration.
Procedure: The test receiver is tested in an environmental test chamber with 85%±5% relative humidity and 85 ° C ±2 ° C as described in ASTM E1171-99. This test should be completed in 1000 hours, but an additional 60 hours can be added to perform a high voltage insulation leakage test. The receiving part can be used for testing.
Requirements: The receiving end needs to leave the damp heat test chamber for 2 ~ 4 hours to pass the high voltage insulation leakage test (see 5.4) and pass the visual inspection (see 5.1). If there is a selective electrical function test, the output power should be 90% or more under the same conditions of many original basic parameters.
IEEE1513 Module test and inspection procedures
IEEE1513-5.1 Visual inspection procedure
Purpose: To establish the current visual status so that the receiving end can compare whether they pass each test and guarantee that they meet the requirements for further testing.
IEEE1513-5.2 Electrical performance test
Objective: To describe the electrical characteristics of the test module and the receiver and to determine their peak output power.
IEEE1513-5.3 Ground continuity test
Purpose: To verify electrical continuity between all exposed conductive components and the grounding module.
IEEE1513-5.4 Electrical isolation test (dry hi-po)
Purpose: To ensure that the electrical insulation between the circuit module and any external contact conductive part is sufficient to prevent corrosion and safeguard the safety of workers.
IEEE1513-5.5 Wet insulation resistance test
Purpose: To verify that moisture cannot penetrate the electronically active part of the receiving end, where it could cause corrosion, ground failure, or identify hazards for human safety.
IEEE1513-5.6 Water spray test
Objective: The field wet resistance test (FWRT) evaluates the electrical insulation of solar cell modules based on humidity operating conditions. This test simulates heavy rain or dew on its configuration and wiring to verify that moisture does not enter the array circuit used, which can increase corrosiveness, cause ground failures, and create electrical safety hazards for personnel or equipment.
IEEE1513-5.7 Thermal cycle test (Thermal cycle test)
Objective: To determine whether the receiving end can properly withstand the failure caused by the difference in thermal expansion of parts and joint materials.
IEEE1513-5.8 Humidity freeze cycle test
Objective: To determine whether the receiving part is sufficiently resistant to corrosion damage and the ability of moisture expansion to expand the material molecules. In addition, frozen water vapor is the stress for determining the cause of failure.
IEEE1513-5.9 Robustness of terminations test
Purpose: To ensure the wires and connectors, apply external forces on each part to confirm that they are strong enough to maintain normal handling procedures.
IEEE1513-5.10 Damp heat test (Damp heat test)
Objective: To evaluate the effect and ability of receiving end to withstand long-term moisture infiltration. I
EEE1513-5.11 Hail impact test
Objective: To determine whether any component, especially the condenser, can survive hail. IE
EE1513-5.12 Bypass diode thermal test (Bypass diode thermal test)
Objective: To evaluate the availability of sufficient thermal design and use of bypass diodes with relative long-term reliability to limit the adverse effects of module thermal shift diffusion.
IEEE1513-5.13 Hot-spot endurance test (Hot-Spot endurance test)
Objective: To assess the ability of modules to withstand periodic heat shifts over time, commonly associated with failure scenarios such as severely cracked or mismatched cell chips, single point open circuit failures, or uneven shadows (shaded portions). I
EEE1513-5.14 Outdoor exposure test (Outdoor exposure test)
Purpose: In order to preliminarily assess the capability of the module to withstand exposure to outdoor environments (including ultraviolet radiation), the reduced effectiveness of the product may not be detected by laboratory testing.
IEEE1513-5.15 Off-axis beam damage test
Purpose: To ensure that any part of the module is destroyed due to module deviation of the concentrated solar radiation beam.
Get A Quote
IPv6 network supported