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Cloud Computing - Heat Pipe Test

Cloud Computing - Heat Pipe Test

September 18, 2024

Heat Pipe Test

Description: Using capillary action and phase change, the heat transfer speed of the heat pipe can be hundreds of times that of copper and silver, which is commonly used in computer cooling or is not suitable for fan cooling electronic products.

Thermal duct reliability test conditions:

High temperature stress screening test :150℃/24 hours

Temperature cycle test :120'C(10min)--30℃C(10min), Ramp:0.5℃,10 cycles 125°C(60min)--40°C (60min) Ramp: 2.75°C,10 cycles

Temperature Cycling Test Chamber

Thermal shock test :

120°C(2min)-- 30°C(2min), 250 cycles

125°C(5min)-- 40'C(5min), 250 cycles

100°C(5min)-- 50°C(5min), 2000 cycles(200 cycle check once)

Thermal Shock Test Chamber

High temperature and high humidity test :

85°C/85%R.H./1000 hours

High Temperature and High Humidity Test Chamber

Accelerated aging test :

110°C/85%RH/264h

Accelerated Aging Chamber

 

Other heat pipe test items:

Salt spray test, vibration test, random vibration test, mechanical impact test, performance test

 

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