Generic Reliability Assurance Requirements for Optoelectronic Devices Used in Telecommunications Equipment

Generic Reliability Assurance Requirements for Optoelectronic Devices Used in Telecommunications Equipment

Document Number GR-468
Issue Number 02
Issue Date Sep 2004
Replaces TR-NWT-000468 Issue01

ORDERING INFORMATION

ABSTRACT: Optoelectronic devices are the backbone of the optical fiber industry. These devices include lasers, light emitting diodes, photo detectors, and modulators, and are key components used in telecommunications equipment such as:

• Asynchronous and synchronous fiber optic terminal and add-drop multiplexers
• Digital cross-connect systems
• Optical amplifiers
• Universal or integrated digital cross-connect systems
• Fiber-In-The-Loop systems.
This NEBS (Network Equipment-Building System) document presents the Telcordia view of proposed generic reliability assurance practices for most optoelectronic devices used in telecommunications equipment.

GR-468 is the 

only

 industry-complete reference source on this topic, saving your company 

thousands of dollars

 in research and development costs. This document helps ensure the reliable operation of optoelectronic devices, and helps minimize your company's life-cycle cost. GR-468 can be drawn on to cover other active optoelectronic devices utilized in telecommunications equipment.

Major changes in Issue 2 include:
• Criteria related to qualification testing, reliability, or accelerated aging testing, and lot-to-lot controls has been consolidated to highlight commonalities and differences between the tests and procedures that apply to various devices and levels of devices.
• An expanded scope of the document, and revised definitions of device levels
• New material added on tunable lasers and optoelectronic receivers
• Removal of objectives that indicated specific performance parameters, and various tables that listed those parameters consolidated into a single table.
• A defined set of operational shock and vibration conditions.
When using GR-468, you may need to refer to 

GR-63

, 

GR-78

, 

GR-326

, 

GR-357

, 

GR-418

, 

GR-487

, GR-874, 

GR-909

, 

GR-1221

, GR-1252, 

GR-1312

, 

GR-2882

, 

SR-332

, 

TR-NWT-000870

, 

TR-NWT-000930

, 

GR-3160

 and/or various IEC, MIL-STD and ITA/EIA FOTP-series publications.

GR-468-CORE replaced TR-NWT-000468 and TA-NWT-000983. (Sometimes referenced as "Telcordia Technologies 983" on other external websites).

Issue 2 of GR-468, 

Generic Reliability Assurance Requirements for Optoelectronic Devices Used in Telecommunications Equipment

, replaces Issue 1.

Components of this product are:

Issue 2 Reliability Assurance for Optoelectronic Devices September 2004 Contents v GR-468-CORE Contents 1 Introduction 1.1Scope and Purpose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1 1.2Reliability Assurance - Overview and Philosophy . . . . . . . . . . . . . . . . 1–2 1.2.1Overview of Reliability Assurance . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2.2Reliability Assurance Generic Requirements Philosophy . . . . . . . . . 1–3 1.3Document History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4 1.3.1Changes Between Issues 1 and 2 of GR-468-CORE. . . . . . . . . . . . . 1–4 1.3.2Changes Between TR-NWT-000468/TA-NWT-000983 and GR-468-CORE, Issue1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–5 1.4Related Telcordia Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6 1.5Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–7 1.5.1Device Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–7 1.5.2Suppliers, Manufacturers, and Customers . . . . . . . . . . . . . . . . .1–11 1.5.3Operating Environments . . . . . . . . . . . . . . . . . . . . . . . . . . .1–11 1.5.3.1CO Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . .1–12 1.5.3.2UNC Environment . . . . . . . . . . . . . . . . . . . . . . . . . . .1–12 1.5.4Quality Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1–13 1.5.5Failure Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1–15 1.5.6Requirements Terminology. . . . . . . . . . . . . . . . . . . . . . . . . .1–15 1.6Requirement Labeling Conventions . . . . . . . . . . . . . . . . . . . . . . . .1–16 1.6.1Numbering of Objects . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1–16 1.6.2 Identification of Object Content . . . . . . . . . . . . . . . . . . . . . . .1–16 1.6.3Requirement Object Absolute Number Assignment . . . . . . . . . . . .1–17 2Reliability Assurance Processes 2.1Supplier Approval and Device Qualification . . . . . . . . . . . . . . . . . . . 2–1 2.1.1Specification and Control . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2 2.1.2Supplier Approval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2 2.1.3Common Process-Related Criteria for Device Qualification . . . . . . . 2–3 2.1.3.1Qualification Test Documentation . . . . . . . . . . . . . . . . . . 2–3 2.1.3.2Qualification of Devices by Similarity. . . . . . . . . . . . . . . . . 2–5 2.1.3.3Levels of Assembly for Qualification . . . . . . . . . . . . . . . . . 2–5 2.1.3.4Provisional Use of Devices . . . . . . . . . . . . . . . . . . . . . . . 2–6 2.1.3.5Use of Supplier-Provided Data. . . . . . . . . . . . . . . . . . . . . 2–8 2.1.3.6Treatment of Internally Manufactured Devices . . . . . . . . . . . 2–8 2.1.3.7Sampling for Qualification Tests . . . . . . . . . . . . . . . . . . . 2–9 2.1.3.7.1LTPD Sampling Plan . . . . . . . . . . . . . . . . . . . . . . . 2–9 2.1.3.7.2Use of Nonconforming Devices for Qualification . . . . . . .2–10 2.1.3.7.3Treatment of Low Volume Parts . . . . . . . . . . . . . . . .2–11 2.1.3.7.4Characterization Test Data for Additional Samples . . . . . .2–11 2.1.3.7.5Additional Considerations for Stress Tests . . . . . . . . . .2–11 2.1.3.8Device Codes that Fail Qualification . . . . . . . . . . . . . . . . .2–12 2.1.4Requalification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–13 Reliability Assurance for Optoelectronic Devices Issue 2 Contents September 2004 vi GR-468-CORE 2.2Lot-to-Lot Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–15 2.2.1Definition of a Lot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–15 2.2.2Purchase Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .2–16 2.2.3Sampling for Lot-to-Lot Controls. . . . . . . . . . . . . . . . . . . . . . .2–16 2.2.3.1AQL-Based Sampling . . . . . . . . . . . . . . . . . . . . . . . . . .2–17 2.2.3.2Treatment of Low Volume Parts . . . . . . . . . . . . . . . . . . . .2–17 2.2.4Source Inspection/Incoming Inspection. . . . . . . . . . . . . . . . . . .2–18 2.2.4.1Use of Supplier-Provided Data. . . . . . . . . . . . . . . . . . . . .2–18 2.2.4.2Treatment of Internally Manufactured Devices . . . . . . . . . . .2–19 2.2.4.3Controls for Devices Used in Purchased Modules . . . . . . . . . .2–19 2.2.5Lot-to-Lot Control Documentation. . . . . . . . . . . . . . . . . . . . . .2–19 2.2.6Lot-to-Lot Control Test Areas . . . . . . . . . . . . . . . . . . . . . . . .2–20 2.2.6.1Visual Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–20 2.2.6.2Electrical and Optical Testing . . . . . . . . . . . . . . . . . . . . .2–21 2.2.6.3Screening . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–21 2.2.7Data Recording and Retention . . . . . . . . . . . . . . . . . . . . . . . .2–22 2.2.8Summary of Supplier History Data . . . . . . . . . . . . . . . . . . . . .2–23 2.2.9Treatment of Defective Devices and Lots . . . . . . . . . . . . . . . . . .2–23 2.2.10Ship-to-Stock Programs . . . . . . . . . . . . . . . . . . . . . . . . . . .2–23 2.3Feedback and Corrective Action . . . . . . . . . . . . . . . . . . . . . . . . . .2–25 2.3.1Lot-to-Lot Control Data . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–26 2.3.2Circuit Pack Test and Burn-In . . . . . . . . . . . . . . . . . . . . . . . .2–26 2.3.3System-Level Test and Burn-In. . . . . . . . . . . . . . . . . . . . . . . .2–27 2.3.4Repair of Field Returns . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–27 2.3.5Unconfirmed Circuit Pack Failures . . . . . . . . . . . . . . . . . . . . .2–27 2.3.6Data Collection and Analysis . . . . . . . . . . . . . . . . . . . . . . . . .2–28 2.3.7Device Failure Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–28 2.4Device Storage and Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–29 2.4.1Nonconforming Material . . . . . . . . . . . . . . . . . . . . . . . . . . .2–29 2.4.2Material Review System . . . . . . . . . . . . . . . . . . . . . . . . . . .2–29 2.4.3Stockroom Inventory Practices . . . . . . . . . . . . . . . . . . . . . . .2–29 2.4.3.1FIFO Inventory Policy . . . . . . . . . . . . . . . . . . . . . . . . .2–29 2.4.3.2Reworked Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–30 2.4.4ESD Precautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–30 2.5Documentation and Test Data . . . . . . . . . . . . . . . . . . . . . . . . . . .2–31 2.5.1Availability of Documentation . . . . . . . . . . . . . . . . . . . . . . . .2–32 2.5.2Availability of Other Information . . . . . . . . . . . . . . . . . . . . . .2–32 2.6Availability of Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–33 2.7Environmental, Health, Safety, and Physical Design Considerations . . . . . .2–33 2.7.1Environmental Considerations . . . . . . . . . . . . . . . . . . . . . . . .2–33 2.7.2Health Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–33 2.7.3Safety Considerations - Flammability . . . . . . . . . . . . . . . . . . . .2–34 2.7.4Physical Design Considerations . . . . . . . . . . . . . . . . . . . . . . .2–34 2.7.4.1Hermeticity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–34 2.7.4.2Solder Flux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–35 2.7.4.3Allowable Terminal and Lead Finishes . . . . . . . . . . . . . . . .2–35 Issue 2 Reliability Assurance for Optoelectronic Devices September 2004 Contents vii GR-468-CORE 3Test Procedures 3.1General Test Procedure Criteria . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1 3.1.1Standardized Test Procedures . . . . . . . . . . . . . . . . . . . . . . . . 3–1 3.1.2Test Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2 3.1.3Establishment of Pass/Fail Criteria . . . . . . . . . . . . . . . . . . . . . 3–2 3.1.4Alternative Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . 3–2 3.1.4.1Calculation of Equivalent Test Conditions . . . . . . . . . . . . . . 3–3 3.1.4.2Activation Energies . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–4 3.1.4.3Additional Considerations Related to Multiple Failure Mechanisms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5 3.2Characterization Test Procedures . . . . . . . . . . . . . . . . . . . . . . . . . 3–6 3.2.1Spectral Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–6 3.2.1.1Spectral Characteristics for MLM Lasers . . . . . . . . . . . . . . . 3–7 3.2.1.2Spectral Characteristics for SLM Lasers . . . . . . . . . . . . . . . 3–9 3.2.1.2.1Considerations for Continuous Wave Lasers. . . . . . . . . .3–10 3.2.1.2.2Considerations for WDM Lasers. . . . . . . . . . . . . . . . .3–11 3.2.1.2.3Considerations for Tunable Lasers . . . . . . . . . . . . . . .3–12 3.2.1.2.4Considerations for High Bit-Rate Applications . . . . . . . .3–12 3.2.1.3Spectral Characteristics for LEDs . . . . . . . . . . . . . . . . . . .3–13 3.2.2Output Power/Drive Current Characteristics . . . . . . . . . . . . . . . .3–14 3.2.2.1General Output Power and L-I Curve Measurement Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–14 3.2.2.2Laser Threshold Current . . . . . . . . . . . . . . . . . . . . . . . .3–16 3.2.2.3Laser Threshold Current Temperature Sensitivity. . . . . . . . . .3–16 3.2.2.4Output Power Levels at Particular Current Levels. . . . . . . . . .3–17 3.2.2.4.1Laser Output Power at the Threshold Current . . . . . . . . .3–17 3.2.2.4.2LED Output Power . . . . . . . . . . . . . . . . . . . . . . . .3–17 3.2.2.5Linearity of the Laser L-I Curve . . . . . . . . . . . . . . . . . . . .3–17 3.2.2.5.1Overall Linearity . . . . . . . . . . . . . . . . . . . . . . . . .3–18 3.2.2.5.2Kinks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–18 3.2.2.5.3Saturation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–19 3.2.2.6Laser Slope Efficiency . . . . . . . . . . . . . . . . . . . . . . . . .3–19 3.2.2.7Relative Intensity Noise . . . . . . . . . . . . . . . . . . . . . . . .3–20 3.2.2.8EELED Superluminescence . . . . . . . . . . . . . . . . . . . . . .3–20 3.2.2.9EELED Lasing Threshold. . . . . . . . . . . . . . . . . . . . . . . .3–20 3.2.3Laser Voltage-Current Curve . . . . . . . . . . . . . . . . . . . . . . . . .3–20 3.2.4Modulated Output Characteristics . . . . . . . . . . . . . . . . . . . . . .3–21 3.2.4.1Modulated Signal Shape . . . . . . . . . . . . . . . . . . . . . . . .3–21 3.2.4.1.1Eye Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–21 3.2.4.1.2Rise and Fall Times . . . . . . . . . . . . . . . . . . . . . . . .3–23 3.2.4.2Extinction Ratio and Modulation Depth . . . . . . . . . . . . . . .3–24 3.2.4.3Turn-On Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–25 3.2.4.4Cutoff Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–25 3.2.5Tunable Laser Characteristics . . . . . . . . . . . . . . . . . . . . . . . .3–26 3.2.6Optical Output Fields and Component Alignment . . . . . . . . . . . . .3–26 3.2.6.1Far-Field Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–26 Reliability Assurance for Optoelectronic Devices Issue 2 Contents September 2004 viii GR-468-CORE 3.2.6.2Coupling Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . .3–27 3.2.6.3Front-To-Rear Tracking Ratio Deviation . . . . . . . . . . . . . . .3–27 3.2.6.4Front-To-Rear Tracking Error . . . . . . . . . . . . . . . . . . . . .3–28 3.2.6.5Polarization Extinction Ratio . . . . . . . . . . . . . . . . . . . . .3–28 3.2.7Modulator Optical and Electrical Characteristics . . . . . . . . . . . . .3–29 3.2.7.1EA Modulator Characterization . . . . . . . . . . . . . . . . . . . .3–29 3.2.7.2External Modulator Characterization . . . . . . . . . . . . . . . . .3–30 3.2.8Photodetector Characteristics . . . . . . . . . . . . . . . . . . . . . . . .3–31 3.2.8.1Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–31 3.2.8.2Spatial Homogeneity . . . . . . . . . . . . . . . . . . . . . . . . . .3–32 3.2.8.3Linearity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–33 3.2.8.4Monitor Photodetector Photocurrent . . . . . . . . . . . . . . . . .3–34 3.2.8.5Dark Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–34 3.2.8.6Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–35 3.2.8.7Cutoff Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–35 3.2.8.8Breakdown Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . .3–35 3.2.8.9Excess Noise Factor . . . . . . . . . . . . . . . . . . . . . . . . . .3–35 3.2.9Receiver Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .3–36 3.2.9.1Received Optical Power Levels . . . . . . . . . . . . . . . . . . . .3–36 3.2.9.2Tolerance to Incoming Signal Degradations . . . . . . . . . . . . .3–37 3.2.10Physical Characteristics of Devices . . . . . . . . . . . . . . . . . . . .3–37 3.2.10.1 Internal Moisture and Hermeticity . . . . . . . . . . . . . . . . . .3–37 3.2.10.1.1 Internal Moisture . . . . . . . . . . . . . . . . . . . . . . . .3–38 3.2.10.1.2Hermeticity. . . . . . . . . . . . . . . . . . . . . . . . . . . .3–38 3.2.10.2ESD Tests. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–39 3.2.10.2.1ESD Threshold Testing of Modules . . . . . . . . . . . . . .3–39 3.2.10.2.2ESD Susceptibility Testing of Integrated Modules . . . . . .3–40 3.2.10.3Flammability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–40 3.2.10.4Die Shear Strength. . . . . . . . . . . . . . . . . . . . . . . . . . .3–41 3.2.10.5Solderability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–41 3.2.10.6Wire Bond Strength . . . . . . . . . . . . . . . . . . . . . . . . . .3–41 3.3Stress Test Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–42 3.3.1Mechanical Integrity Tests . . . . . . . . . . . . . . . . . . . . . . . . . .3–42 3.3.1.1Mechanical Shock and Vibration Tests . . . . . . . . . . . . . . . .3–42 3.3.1.1.1Mechanical Shock . . . . . . . . . . . . . . . . . . . . . . . .3–42 3.3.1.1.2Vibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–43 3.3.1.2Thermal Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–43 3.3.1.3Fiber Integrity Tests . . . . . . . . . . . . . . . . . . . . . . . . . .3–44 3.3.1.3.1Twist Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–45 3.3.1.3.2Side Pull Test . . . . . . . . . . . . . . . . . . . . . . . . . . .3–45 3.3.1.3.3Cable Retention Test . . . . . . . . . . . . . . . . . . . . . . .3–45 3.3.1.4Connectorized and Receptacle Device Durability Tests. . . . . . .3–46 3.3.1.4.1Mating Durability Test . . . . . . . . . . . . . . . . . . . . . .3–46 3.3.1.4.2Wiggle Test . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–46 3.3.1.4.3Pull Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–47 3.3.2Non-Powered Environmental Stress Tests . . . . . . . . . . . . . . . . .3–47 3.3.2.1Storage Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–47 Issue 2 Reliability Assurance for Optoelectronic Devices September 2004 Contents ix GR-468-CORE 3.3.2.2Temperature Cycling . . . . . . . . . . . . . . . . . . . . . . . . . .3–48 3.3.2.3Damp Heat Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–48 3.3.3Powered Environmental Stress Tests . . . . . . . . . . . . . . . . . . . .3–49 3.3.3.1High-Temperature Operations . . . . . . . . . . . . . . . . . . . . .3–49 3.3.3.1.1Test Time and Temperature Considerations . . . . . . . . . .3–50 3.3.3.1.2Other Test Condition Considerations . . . . . . . . . . . . . .3–51 3.3.3.1.3Applicability of the High-Temperature Operations Test . . .3–52 3.3.3.2Cyclic Moisture Resistance . . . . . . . . . . . . . . . . . . . . . .3–53 3.3.3.3Damp Heat (Powered Tests for Non-Hermetic Devices) . . . . . .3–54 3.4Accelerated Aging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–54 3.4.1High-Temperature Accelerated Aging . . . . . . . . . . . . . . . . . . . .3–55 3.4.1.1Testing at Constant Temperature . . . . . . . . . . . . . . . . . . .3–55 3.4.1.2Alternative (Variable Temperature) Tests . . . . . . . . . . . . . .3–56 3.4.1.3Additional Considerations for Lasers . . . . . . . . . . . . . . . . .3–56 3.4.1.4Additional Considerations for Photodiodes . . . . . . . . . . . . .3–57 3.4.1.5Additional Considerations for External Modulators . . . . . . . . .3–57 3.4.2Temperature Cycling . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–57 3.4.3Damp Heat for Non-Hermetic Modules . . . . . . . . . . . . . . . . . . .3–57 3.4.4Failure Rates and Reliability Calculations . . . . . . . . . . . . . . . . .3–58 3.4.4.1Failure Rates. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–58 3.4.4.2Analysis of Gradual Degradations . . . . . . . . . . . . . . . . . . .3–58 3.4.4.3Reliability Calculations . . . . . . . . . . . . . . . . . . . . . . . . .3–60 3.4.4.4Reporting of Results . . . . . . . . . . . . . . . . . . . . . . . . . .3–60 4Qualification of Optoelectronic Devices 4.1Characterization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2 4.1.1Characterization Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2 4.1.2Characterization Test Pass/Fail Criteria. . . . . . . . . . . . . . . . . . . 4–9 4.2Stress Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–9 4.2.1Mechanical Integrity and Environmental Stress Tests . . . . . . . . . . . 4–9 4.2.2Stress Test Pass/Fail Determination. . . . . . . . . . . . . . . . . . . . .4–15 4.3Considerations for the Qualification of Pump Laser Modules. . . . . . . . . .4–16 4.4Considerations for the Qualification of Integrated Modules. . . . . . . . . . .4–17 4.4.1Sample Size and Level of Assembly Considerations . . . . . . . . . . . .4–17 4.4.2Operational Shock and Vibration Tests . . . . . . . . . . . . . . . . . . .4–18 5Optoelectronic Device Reliability Testing 5.1Accelerated Aging Tests. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1 5.2Accelerated Aging End-of-Life Thresholds and Failures . . . . . . . . . . . . . 5–4 6Lot-To-Lot Controls for Optoelectronic Devices 6.1Visual Inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1 6.2Electrical and Optical Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1 6.3Screening . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1 6.3.1Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1 Reliability Assurance for Optoelectronic Devices Issue 2 Contents September 2004 x GR-468-CORE 6.3.2Screening Pass/Fail Criteria . . . . . . . . . . . . . . . . . . . . . . . . . 6–2 7Qualification and Lot-to-Lot Controls for Other Component Parts 7.1Thermoelectric Coolers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1 7.1.1TEC-Specific Test Information. . . . . . . . . . . . . . . . . . . . . . . . 7–2 7.1.1.1Thermoelectric Cooler and Temperature Sensor Checks . . . . . . 7–2 7.1.1.2Power Cycle Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–2 7.1.2TEC Qualification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–2 7.1.3TEC Lot-to-Lot Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–4 7.2Temperature Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–4 7.3Optical Isolators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–4 7.4Fiber Pigtails and Optical Connectors . . . . . . . . . . . . . . . . . . . . . . . 7–4 7.5General Electrical/Electronic Components . . . . . . . . . . . . . . . . . . . . 7–5 7.6Hybrids . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–5 Appendix A:Sampling Plan Tables Appendix B:References Appendix C:Symbols, Units, Abbreviations, and Acronyms Requirement-Object Index GR-468-CORE Issue 2 September 2004 Reliability Assurance for Optoelectronic Devices List of Figures List of Figures Figure 1-1 Figure 1-2 Figure 1-3 Figure 3-1 Figure 3-2 Figure 3-3 Figure 3-4 Figure 3-5 Figure 3-6 Figure 3-7 Figure 3-8 Figure 3-9 Elements of a Comprehensive Reliability Assurance Program . . . 1–3 Examples of Optoelectronic Device Module Designs . . . . . . . . 1–10 Schematic of a Common Laser Module Design . . . . . . . . . . . 1–11 Example for Two Failure Mechanisms with Different Activation Energies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–6 Example of an MLM Laser Optical Spectrum . . . . . . . . . . . . 3–9 Example of L-I and dL/dI Curves With a Kink . . . . . . . . . . . . 3–19 Example Mask for High Bit-Rate Signal Eye Pattern Test . . . . . 3–22 Rise and Fall Time Definitions . . . . . . . . . . . . . . . . . . . . . 3–23 Measurement of Turn-On Delay . . . . . . . . . . . . . . . . . . . . 3–25 Laser Far Field Pattern Measurement . . . . . . . . . . . . . . . . . 3–27 Example of Spatial Homogeneity Test Results . . . . . . . . . . . . 3–33 Example of Photodetector Linearity Test Results . . . . . . . . . . 3–34 xi GR-468-CORE Reliability Assurance for Optoelectronic Devices List of Tables Issue 2 September 2004 List of Tables Table 1-1 Table 2-1 Table 3-1 Table 3-2 Table 4-1 Table 4-2 Table 4-3 Table 4-4 Table 4-5 Table 4-6 Table 5-1 Table 7-1 Table A-1 Table A-2 Table A-3 Table A-4 Definition of Quality Levels . . . . . . . . . . . . . . . . . . . . . . 1–14 Provisional Use of Devices in Qualification . . . . . . . . . . . . . 2–7 Assumed Activation Energies . . . . . . . . . . . . . . . . . . . . . 3–5 Sample Format for Reporting Failure Rate Information . . . . . . 3–61 Typical Performance Parameters for Optoelectronic Device Characterization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–3 Physical Characteristics of Devices . . . . . . . . . . . . . . . . . . 4–8 Mechanical Integrity Tests . . . . . . . . . . . . . . . . . . . . . . . 4–10 Non-Powered Environmental Stress Tests . . . . . . . . . . . . . . 4–12 Powered Environmental Stress Tests . . . . . . . . . . . . . . . . . 4–13 Operational Shock and Vibration Conditions for Integrated Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–18 Accelerated Aging Tests . . . . . . . . . . . . . . . . . . . . . . . . 5–2 Physical Characteristics and Stress Tests for TECs . . . . . . . . . 7–3 LTPD Sampling Plan1 . . . . . . . . . . . . . . . . . . . . . . . . . . A–1 Sample Size Code Letters 1 (General Inspection Levels) . . . . . . A–2 Single Sampling Plan for Normal Inspection (Master Table) . . . . A–2 Double Sampling Plan for Normal Inspection (Master Table) . . . A–3 xii