What are the Reliability Tests for Light Emitting Diodes for Communication?
Failure determination of light emitting two tubes for communication:
Provide a fixed current to compare the optical output power, if the error is greater than 10%, the failure is determined.
Mechanical stability test:
Shock test: 5tims/axis, 1500G, 0.5ms Vibration test: 20G, 20 ~ 2000Hz, 4min/cycle, 4cycle/axis Liquid thermal shock test: 100℃(15sec)←→0℃(5sec)/5cycle
Durability test:
Accelerated aging test: 85℃/ power (maximum rated power)/5000 hours, 10000 hours
High temperature storage test: maximum rated storage temperature /2000 hours
Low temperature storage test: maximum rated storage temperature /2000 hours
Temperature cycle test: -40℃(30min)←85℃(30min), RAMP: 10/min, 500cycle
Moisture resistance test: 40℃/95%/56 days, 85℃/85%/2000 hours, sealing time
Communication diode element screening test:
Temperature screening test: 85℃/ power (maximum rated power)/96 hours screening failure determination: Compare the optical output power with the fixed current, and determine failure if the error is larger than 10%
Communication diode module screening test:
Step 1: Temperature cycle screening: -40℃(30min)←→85℃(30min), RAMP: 10/min, 20cycle, no power supply
Second: Temperature screening test: 85℃/ power (maximum rated power)/96 hours
Maintenance Method of High and Low Temperature Test Chamber
There are three common types of high and low temperature test chamber controllers: software failure, system failure and hardware failure.
1, Software failure:
Software failure mainly refers to the controller failure of the high and low temperature test chamber, including the internal parameters, the control point IS control and output signal of the solenoid valve on and off.
2, System failure:
System failure refers to the initial design problems of the refrigeration system, including the leakage of refrigerant caused by high and low temperature test chamber does not cool down, and refrigerant leakage is often due to transport and high and low temperature test chamber operation jitter or refrigeration copper pipe welding process is not fine and other reasons caused.
3, Hardware failure:
Hardware failure may lead to non-cooling hardware compressor, solenoid valve and other refrigeration components.
Then the user can listen and touch to roughly understand what is the hardware high and low temperature test chamber damage, if it is a compressor failure, the compressor sound will be abnormal or do not work does not start or the compressor itself temperature is much higher than usual temperature, and the solenoid valve failure and other refrigeration components failure users are not too good to master.
In addition, the damage of the controller and the damage of the electronic parts of the control refrigeration system may also cause the phenomenon of non-cooling and non-cooling of the high and low temperature test chamber.
Scientific principle of heating and cooling of high and low temperature test chamber:
The high and low temperature test chamber has the functions of heating, cooling, humidification and dehumidification, and can detect the product's high temperature resistance, low temperature resistance and humidity resistance. How is the temperature in the high and low temperature test chamber controlled?
The heating device is the key link to control whether the high and low temperature test chamber is heated up. The controller outputs voltage to the relay when it gets the heating instruction. The high and low temperature test chamber is about 3-12 volts of direct current added to the solid state relay. The AC end of the high and low temperature test chamber is equivalent to a wire connection, and the contactor is also drawn at the same time. Heat up the constant temperature and humidity test chamber.
Cooling is an important part of the high and low temperature test chamber, which directly affects the determination of a high and low temperature and performance, including compressor, condenser, throttling device, evaporator four major components, compressor is the heart of the refrigeration system, it inhales low temperature and low pressure gas, into high temperature and high pressure gas, through condensation into a liquid to release heat, through the fan to take away heat, Therefore, the test chamber is the reason of hot air, and then become low pressure liquid through throttling, and then become low temperature and low pressure gas through the evaporator back to the compressor, the refrigerant in the evaporator to absorb the heat of the high and low temperature chamber to complete the gasification process and absorb heat, to achieve the purpose of refrigeration, to complete the high and low temperature test chamber cooling process.
High and low temperature chamber temperature and cooling rate test procedure:
In the adjustable range of the temperature of the test chamber, the lowest nominal temperature was selected as the lowest cooling temperature, and the highest nominal temperature was selected as the highest heating temperature.
Open the cold source, so that the test chamber from room temperature to the lowest cooling temperature, stable for at least 3 hours, rise to the highest heating temperature, stable for at least 3 hours and then to the lowest cooling temperature, during the heating and cooling, record once a minute, until the end of the test process.
The principle of high and low temperature test chamber heating and cooling is so, the realization of its function is completed by the setting of the control system, understanding the principle of heating and cooling, in the use of high and low temperature test chamber must be more handy.
Operation Precautions of Constant Temperature and Humidity Test Chamber
1, In order to avoid machine failure in the constant temperature and humidity test chamber, please provide power supply within the rated voltage range.
2, In order to prevent electric shock or misoperation and failure, do not switch on the power supply before the installation and wiring is finished.
3, This product is a non-explosion-proof product, please do not use the constant temperature and humidity machine in the environment with flammable or explosive gas.
4, Please try not to open the test chamber door during the work of the instrument, open at high temperature may cause hot injury to the operator, open at low temperature may cause freezing injury to the staff, and may cause freezing of the evaporator, affecting the refrigeration effect. If you must open, please do some protective work,
5, It is prohibited to disassemble, process, transform or repair the constant temperature and humidity machine without permission, otherwise there will be abnormal action, electric shock or fire risk.
6, The chamber's ventilation holes should be kept unobstructed to avoid failure, abnormal operation, reduced life and fire.
7. If the machine is damaged or deformed when unpacking, please do not use it.
8, The machine installation and setting should be careful not to let dust, wire, iron filings or other things into, otherwise wrong action or failure will occur.
9, Wiring must be correct, must be grounded. Non-grounding may cause electric shock, misoperation accidents, abnormal display or large measurement errors.
10, Regularly check the terminal screws and fixed frame, please do not use in the case of loose.
11, During the operation of the instrument, the power input terminal cover must be installed on the terminal board to prevent electric shock.
12, The instrument in operation, modify the setting, signal output, start, stop and other operations, should be fully considered before the safety, wrong operation will cause damage to the working equipment or failure.
13, Please use a dry cloth to wipe the instrument, do not use alcohol, gasoline or other organic solvents, do not splash water on the instrument, if the instrument is immersed in water, please stop use immediately, otherwise there is the risk of leakage, electric shock or fire.
14, The internal parts of the instrument have a certain life period, in order to continue to use the instrument safely, please carry out regular maintenance and maintenance. When scrapping this product, please treat it as industrial waste.
15, Before starting to check whether the power supply is stable.
High and Low Temperature Test Chamber Requirements Specified in the Standard
The test chamber requirements formulated according to relevant standards should meet the following two points:
1. The temperature and humidity in the high and low temperature test chamber are monitored by the sensor installed in the working space. For the test of the heat dissipation test sample, the installation position of the sensor is formulated in the GB/T2421-1999 standard.
2, The temperature and relative humidity of the working space are required to be constant within the nominal value and its specified tolerance range, and the influence of the test sample should also be considered during the test.
Heat dissipation test sample test:
The volume of the high and low temperature test chamber should be at least 5 times the total volume of the test sample, the distance between the test sample and the internal wall of the test chamber should be selected according to the provisions of GB/T2423.2-2001 Appendix A (standard appendix), the wind speed in the chamber should not exceed 1M/S, and the structure of the mounting frame or support frame of the test chamber sample should simulate the real conditions in use as much as possible. Or otherwise, the effect of the sample mounting rack on the exchange of heat and moisture between the test sample and the surrounding space should be reduced to a minimum, and the relevant specifications may also specify dedicated mounting racks.
Test severity level:
The severity grade of the test chamber consists of the test temperature, relative humidity and test time, and is specified by the relevant specifications. The combination of temperature and relative humidity can be selected from the following values:
a, 30℃±2℃ 93%±3%
b, 30℃±2℃ 85%±3%
c, 40℃±2℃ 93%±3%
d, 40℃±2℃ 85%±3%
During the test, the test chamber shall be at the temperature and humidity of the laboratory, and the test sample at the ambient temperature of the laboratory shall be placed in the normal position or other specified position in the laboratory in an unpacked, unenergized, "ready for use" state, under certain circumstances (e.g. The relevant specifications may allow the test sample to be directly sent into the test chamber under the treated test conditions, but the test sample must be prevented from producing condensation, the temperature in the test chamber should be adjusted to a predetermined severity level, the time should ensure that the test sample reaches temperature stability, the test time should be calculated from the specified conditions, if the relevant specifications require, the test sample can be energized or worked in the conditional test phase, and the relevant specifications should specify the working conditions and working time or cycle of the test sample during the test. At the end of the conditional test, the test sample should still be left in the test chamber and the chamber should be adjusted to the standard atmospheric conditions of the test. The relative humidity should be reduced first, and the time should not exceed 2 hours. The temperature change rate in the test chamber should not exceed 1℃/min on average within 5min, and the relative humidity during temperature regulation should not exceed 75%. After the conditional test, the test sample should enter the recovery procedure.
New Energy Environment Test Solution
The problem of new energy reliability is still difficult, and the integrated detection system of electrical stress and environmental stress will provide the best means for research and development and manufacturing.
Industry
Test object
Use
Technology
Solution
New Energy
Battery (secondary battery)
Inspect
Charge and discharge test
High and low temperature (&humidity) test chamber
Rapid temperature (&humidity)change test chamber
Evaluate
Characteristic test
Rapid temperature (&humidity)change test chamber
Fuel cell
/
Temperature resistance
Small ultra-low temperature test chamber
High and low temperature (&humidity) test chamber
Rapid temperature (&humidity)change test chamber
Industrial Computer Reliability Testing
Industrial computers can be divided into three categories according to their application attributes:
(1) Board class: includes Single Board Computer (SBC), Embedded board (Embedded Board), Black Plane, PC/104 module. (2) Subsystem class: includes single-board computers, boards, chassis, power supplies and other peripherals combined into operational subsystems, such as industrial servers and workstations. (3) System integration solutions: refers to a set of systems developed for a professional field, including the required software and hardware and surrounding, such as automatic teller machines (ATMs). The application of industrial computers widely covers ATM, POS, medical electronic equipment, game machines, gambling equipment, etc. The multi-field industry makes industrial computers must be able to withstand the use of sunlight, high and low temperature, wet and other environments, so the relevant reliability test is the focus of various manufacturers in the research and development test.
Common reliability tests for industrial computers:
(1) Wide temperature test
According to the actual application environment can be divided into four categories: 1. Outdoor: especially for the extreme low temperature or high temperature areas, such as northern Europe and desert countries, the temperature range can be from -50 to 70°C; 2. Enclosed space: for example, where heat sources are generated, such as next to a boiler, the high temperature range is about 70°C; 3. Mobile equipment: such as vehicle equipment, the high temperature can be up to 90°C according to the car area; 4. Special harsh environment: such as aerospace equipment, military, oil drilling equipment.
(2) Aging stress test
The temperature range is from -40°C to 85°C, and the temperature variation rate is 10 °C per minute for cyclic testing
(3) No wind high temperature test
At present, in order to prevent dust, industrial computers are planned to be closed and fanless in the mechanism design, so more and more manufacturers begin to pay attention to high temperature testing in a windless environment to ensure that high temperatures will not collapse
Note: For complete industrial computer test conditions, please consult LAB COMPANION
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