Clean Hot Air Circulation Oven
Hot air circulation oven is a universal drying equipment with a long history, which has a wide range of application, uniform temperature, high thermal efficiency and simple operation. It is one of the necessary drying equipment for most pharmaceutical and related enterprises, and is also a popular drying equipment for users.
Based on years of actual production experience and existing production technology, combined with the current national pharmaceutical industry GMP requirements, our company designed the oven that is higher than the current national GMP standard requirements for the pharmaceutical industry - clean oven, its technical characteristics are described as follows:
1, Equipment materials: internal and external walls are SUS304 stainless steel, the internal cavity is full of welding, rounded transition, making the oven without wind phenomenon in the working state, and making the equipment easy to clean, no water seepage phenomenon in the heat preservation layer, to ensure that the cleanliness of the items dried each time. The external wall is made of brushed board making the outer surface of the oven is flat, smooth, beautiful, no visible concavity and convexity;
2, Circulating fan impeller, volute shell are made of stainless steel, to ensure clean circulating air; selection of large air volume, high air pressure centrifugal fan as a circulating fan for forced ventilation, which can speed up the drying speed of the material to ensure the uniformity of material drying.
3, The drying oven air inlet is divided into two levels of filtration, the new air inlet for the intermediate filter, making the new air up to 300,000, after heating each cycle of hot air with high-temperature high efficiency filter filtration, so that the hot air into the drying oven are more than 10,000 levels of cleanliness, to ensure that the drying process of cleanliness;
4, The system is equipped with all stainless steel moisture exhaust fan, and the system's PLC program module collects the humidity in the system for intelligent control: According to the signal provided by the humidity control instrument, the damper actuator of the humidification port is controlled by the damper. At the same time, the damper is controlled by the frequency converter to output the corresponding frequency according to the size of the humidity signal, and the reasonable air volume is discharged to achieve the best humidification effect and achieve reasonable humidification. The moisture outlet is equipped with a medium effect filter to ensure the cleanliness of the return air of the moisture outlet.
5, Oven heating form: steam or electric heating. The material is stainless steel. Its has good heat dissipation effect and sanitary conditions. The fluctuation range is about ±1℃;
6, The circulatory system stroke from both sides of the main machine into the same time, concentrated to the middle exhaust air, compared with the conventional design to reduce the temperature difference between the left and right sides of the oven; According to the guiding rules of the air volume and air pressure of the air inlet and air outlet, multiple groups of punching plates with different ratios are designed as the distribution device of the inward hot air to achieve a smaller temperature difference. Moreover, the fixing method of the air equalizing network board and the main engine adopts the quick fixing method, which can quickly clean the inlet and outlet air duct to ensure the cleanliness of the chamber;
7, The equipment is designed with 5 sewage outlets in the air inlet, skip and air outlet, which can ensure that all the sewage is discharged quickly after cleaning. The five sewage outlets are gathered into a main pipe for centralized discharge, reducing the total sewage outlet, so that the plant can open less floor drains;
8, The equipment in the inlet and outlet duct design can cover the entire system of 7 online cleaning ports, in normal circumstances to achieve fast and simple online cleaning function, can also be directly set up online cleaning device, in order to achieve the true meaning of CIP;
9, The oven track is convex splints, and the bottom plate is connected by round foot welding, and the drying car is equipped with inclined pedal, which makes the drying car easy to enter and exit; At the same time reduce the dead Angle without affecting the blowdown performance; Stainless steel square tube is used for the column and stainless steel Angle steel is used for the beam of the oven, and argon arc welding is adopted. Wheels with high temperature resistant nylon wheels, each dryer with 2 directional wheels, 2 steering wheels. The whole dryer has reasonable structure, high strength, beautiful and practical;
10, The equipment heating system (heater, high temperature and high efficiency filter) is concentrated in the closed stainless steel chamber, good insulation effect, high cleanliness, and high temperature and high efficiency filter for the drawer type fast loading structure, can be cleaned and replaced quickly; The connecting parts and the system are connected with the adjustable screw quick installation design, which is convenient for maintenance and overhaul;
11, The oven door lock adopts advanced adjustable elastic door lock, good locking performance, easy to operate. High temperature and non-toxic silicone rubber sealing ring is used between the door and the box, which has excellent sealing performance. The insulation layer of the oven adopts ultra-fine glass wool, which has good thermal insulation performance.
12, All the round flanges in the system are connected by quick-opening clamp, and the method is designed by quick-mounting butterfly screws, which facilitates the disassembly and cleaning of the pipeline;
13, There are two quick verification ports on the equipment host, which is convenient to verify the temperature and humidity during the working process.
Burn-in Chamber
A burn-in chamber is an environmental oven used to evaluates the reliability of multiple semiconductor devices and performs large capacity screenings for premature failure (infant mortality). These environmental chambers are designed for static and dynamic burn-in of integrated circuits (ICs) and other electronic devices such as laser diodes.
Selecting Chamber Size
The chamber size depends on the size of the burn-in board, the number of products in each burn-in board, and the number of batches required per day to meet production requirements. If the interior space is too small, insufficient space between parts results in poor performance. If it is too large, space, time and energy are wasted.
Companies that are purchasing a new burn-in set-up should work with the vendor to ensure the heat source has enough steady-state and maximum capacity to match the load for the DUT.
When using forced recirculating airflow, parts benefit from spacing, but the oven can be loaded more densely vertically because airflow is distributed along the entire side wall. Parts should be kept 2-3 inches (5.1 – 7.6cm) from the oven walls.
Burn-in Chamber Design Specs
Temperature Range
Depending on the requirements of the Device Under Test (DUT) select a chamber that has a dynamic range such as 15°C above ambient to 300°C (572°F)
Temperature Accuracy
It is important that the temperature does not fluctuate. Uniformity is the maximum difference between the highest and lowest temperatures in a chamber at a specified setting. A specification of at least 1% setpoint for uniformity and 1.0°C control accuracy is acceptable in most semiconductor burn-in applications.
Resolution
A high-temperature resolution of 0.1°C will provide the best control to meet burn-in requirements
Environmental Savings
Consider a burn-in chamber that has a refrigerant that has a zero ozone layer depletion coefficient. Burn-in chambers with refrigeration are related to chambers operating in temperatures below 0 degrees Celsius down to – 55°C.
Chamber configuration
The chamber can be designed with card cages, card-slots, and access doors to simplify connecting DUT boards and driver boards with ATE stations.
Chamber Air Flow
In most cases a forced convection oven with recirculating airflow will provide the best distribution of heat and significantly speeds the time-to-temperature and heat transfer to parts. Temperature uniformity and performance depends on a fan design that directs air to all areas of the chamber.
The chamber can be design with a horizontal or vertical airflow. It is important to know the direction of inserting the DUT based on the airflow of the chamber.
Custom ATE Wiring
When it comes to measuring over hundreds of devices, inserting wires through an aperture or test hole may not be practical. Custom wiring connectors can be mounted directly to the oven to facilitate the electrical monitoring of the device with an ATE.
How A Burn-in Oven Controls Temperature
The burn-in oven uses a temperature controller executing a standard PID (proportional, integral, derivative) algorithm. The controller senses the actual temperature value versus the desired setpoint value, and issues corrective signals to the heater calling for application ranging anywhere from no heat to full heat. A fan is also used to equalize the temperature through the chamber.
The most common sensor used for accurate temperature control of the environmental oven is a Resistance Temperature Detector (RTD) which a platinum-based unit typically referred to as a PT100.
Sizing The Chamber
If you are using an existing oven, basic thermal modelling based on factors such as the oven’s thermal capacity and losses, heat-source output, and DUT mass will allow you to verify that the oven and heat source are sufficient to reach desired temperature with a thermal time constant short enough for tight loop response under the controller’s direction.
Burn-in Board for Reliability Testing
Semiconductor equipment that test and screen out early failures during the “infant mortality” stage are put on a board known as “Burn-in Board”. On a burn-in board, there are multiple sockets to place the semiconductor device (ie. laser diode or photodiode). The number of devices which are placed on a board can consist of low batches of 64 to over 1000 devices at the same time.
These burn-in boards are then inserted into the burn-in oven which can be controlled by an ATE (Automatic Test Equipment) that supplies the mandatory voltages towards the samples while maintaining the desired oven temperature. The electrical bias applied may either be static or dynamic.
Usually the semiconductor components (ie. Laser Diodes) are pushed beyond what they will have to go through in normal use. This ensures that the manufacturer can be confident that they have a robust laser diode or photo diode device and that the component can meet reliability and qualification standards.
Burn-in Board material options:
IS410
IS410 is a high-performance FR-4 epoxy laminate and prepreg system designed to support the printed circuit board industry’s requirements for higher levels of reliability and the trend to use lead free solder.
370HR
370HR laminates and prepregs are made using a patented high performance 180°C Tg FR-4 multifunctional epoxy resin system that is designed for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.
BT Epoxy
BT epoxy is widely chosen for its outstanding thermal, mechanical, and electrical properties. This laminate is suitable for lead-free PCB assembly. It is primarily used for multilayer board applications. It features excellent electro migration, insulation resistance, and high thermal resistance. It also maintains bond strength at high temperature.
Polymide
BT epoxy is widely chosen for its outstanding thermal, mechanical, and electrical properties. This laminate is suitable for lead-free PCB assembly. It is primarily used for multilayer board applications. It features excellent electro migration, insulation resistance, and high thermal resistance. It also maintains bond strength at high temperature.
Nelco 4000-13
Nelco® N4000-13 series is an enhanced epoxy resin system engineered to provide both outstanding thermal and high signal speed / low signal loss properties. N4000-13 SI® is excellent for applications that require optimum signal integrity and precise impedance control, while maintaining high reliability through CAF 2 and thermal resistance.
Burn-in Board Thickness:
0.062” – 0.125” (1.57 mm – 3.17 mm)
Burn-in Board Applications:
During the burn-in process extreme temperatures often ranging from 125°C – 250°C or even 300°C are applied so the materials used need to be extremely durable. IS410 is used for burn-in board applications up to 155°C and typically a polyimide for applications up to 250°C.
Burn-in boards can be used in environmental testing conditions such as:
HAST (Highly Accelerated Temperature and Humidity Stress)
LTOL (Low Temperature Operating Life)
HTOL (High Temperature Operating Life)
Burn-in Board Design Requirements:
One of the most important considerations is selecting the highest possible reliability and quality for the Burn in Board and the test socket. You don’t want your Burn in board or socket to fail before the device under test. Therefore, all active/passive components and connectors should comply with high-temperature requirements, and all materials and components should meet high-temperature and aging requirements.
High Temperature Aging Cabinet
High temperature aging cabinet is a type of aging equipment used to remove early failure of non-conforming product parts.
Use of temperature aging cabinet, aging oven:
This test equipment is a test equipment for aviation, automobile, home appliances, scientific research and other fields, which is used to test and determine the parameters and performance of electrical, electronic and other products and materials after temperature environment changes in high temperature, low temperature, alternating between temperature and humidity or constant temperature and humidity.
The chamber of the test equipment is sprayed with steel plate after treatment, and the spray color is optional, generally beige. SUS304 mirror stainless steel is used in the inner room, with a large window tempered glass, real-time observation of internal aging products.
Features of temperature aging cabinet, aging oven:
1. PLC processing industry touch screen programming combination control, balanced temperature control system: aging specimen room temperature rise start the ventilation fan, balance the sample heat, aging cabinet is divided into product area and load area
2. PID+SSR temperature control system: according to the temperature change in the specimen box, the heat of the heating tube is automatically adjusted to achieve the temperature balance, so that the heating heat of the system is equal to its heat loss and achieve the temperature balance control, so it can run stably for a long time; The fluctuation of temperature control is less than ±0.5℃
3. The air transport system is composed of three-phase asynchronous electronic multi-wing wind wheel and wind drum. The wind pressure is large, the wind speed is uniform, and the uniformity of each temperature point is met
4. High precision PT100 platinum resistance for temperature acquisition, high accuracy for temperature acquisition
5. Load control, the load control system provides ON/OFF control and timing control two functional options to meet the different test requirements of the product
(1)ON/OFF function introduction: The switch time, stop time, and cycle times can be set, the test product can be switched according to the setting requirements of the system, the stop cycle control, the aging cycle number reaches the set value, the system will automatically sound and light prompt
(2) Timing control function: the system can set the running time of the test product. When the load starts, the product power supply starts timing. When the actual timing time reaches the time set by the system, the power supply to the product is stopped
6. System operation safety and stability: The use of PLC industrial touch screen control system, stable operation, strong anti-interference, convenient program change, simple line. Perfect alarm protection device (see protection mode), real-time monitoring of the operating status of the system, with the function of automatic maintenance of temperature data during operation, in order to query the temperature historical data when the product is aging, the data can be copied to the computer through the USB interface for analysis (format is EXCEL), with historical data curve display function, It intuitively reflects the temperature change in the product area during the product test, and its curve can be copied to the computer in BMP format through the USB interface, so as to facilitate the operator to make the test product report. The system has the function of fault query, the system will automatically record the alarm situation, when the equipment fails, the software will automatically pop up the alarm screen to remind the cause of the fault and its solution; Stop the power supply to the test product to ensure the safety of the test product and the equipment itself, and record the fault situation and occurrence time for future maintenance.
Semiconductor Chip-Car Gauge Chip
A new energy vehicle is divided into several systems, MCU belongs to the body control and vehicle system, is one of the most important systems.
MCU chips are divided into 5 levels: consumer, industrial, vehicle gauge, QJ, GJ. Among them, the car gauge chip is the current vane product. So what does the car gauge chip mean? From the name, it can be seen that the car gauge chip is the chip used in the car. Different from ordinary consumer and industrial chips, the reliability and stability of the car gauge chip is extremely important, so as to ensure the safety of the car at work.
The certification standard of the car gauge level chip is AEC-Q100, which contains four temperature levels, the smaller the number, the higher the level, the higher the requirements for the chip.
It is precisely because the requirements of the car gauge chip are so high, it is necessary to carry out a strict Burn In test before the factory, BI test requires the use of professional BI oven, our BI oven can meet the BI test of today's car gauge chip.
Connect the EMS system, so that each batch of baked chips can be traced at any time. High temperature and low temperature vacuum anaerobic environment, real-time monitoring of baking curve to ensure baking safety and effect.
Burn-in Oven
Burn-in is an electrical stress test that employs voltage and temperature to accelerate the electrical failure of a device. Burn-in essentially simulates the operating life of the device, since the electrical excitation applied during burn-in may mirror the worst-case bias that the device will be subjected to in the course of its useable life. Depending on the burn-in duration used, the reliability information obtained may pertain to the device's early life or its wear-out. Burn-in may be used as a reliability monitor or as a production screen to weed out potential infant mortalities from the lot.
Burn-in is usually done at 125 deg C, with electrical excitation applied to the samples. The burn-in process is facilitated by using burn-in boards (see Fig. 1) where the samples are loaded. These burn-in boards are then inserted into the burn-in oven (see Fig. 2), which supplies the necessary voltages to the samples while maintaining the oven temperature at 125 deg C. The electrical bias applied may either be static or dynamic, depending on the failure mechanism being accelerated.
Figure 1. Photo of Bare and Socket-populated Burn-in Boards
The operating life cycle distribution of a population of devices may be modeled as a bath tub curve, if the failures are plotted on the y-axis against the operating life in the x-axis. The bath tub curve shows that the highest failure rates experienced by a population of devices occur during the early stage of the life cycle, or early life, and during the wear-out period of the life cycle. Between the early life and wear-out stages is a long period wherein the devices fail very sparingly.
Figure 2. Burn-in ovens
Early life failure (ELF) monitor burn-in, as the name implies, is performed to screen out potential early life failures. It is conducted for a duration of 168 hours or less, and normally for only 48 hours. Electrical failures after ELF monitor burn-in are known as early life failures or infant mortality, which means that these units will fail prematurely if they were used in their normal operation.
High Temperature Operating Life (HTOL) Test is the opposite of ELF monitor burn-in, testing the reliability of the samples in their wear-out phase. HTOL is conducted for a duration of 1000 hours, with intermediate read points at 168 H and 500 H.
Although the electrical excitation applied to the samples are often defined in terms of voltages, failure mechanisms accelerated by current (such as electromigration) and electric fields (such as dielectric rupture) are understandably accelerated by burn-in as well.
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