Definition and Characteristics of UV Weathering Test Chamber
Uv weathering test chamber is a professional equipment used to simulate and evaluate the resistance of materials to ultraviolet radiation and corresponding climatic conditions. Its core function is to simulate the effect of ultraviolet light on materials in the natural environment through artificially controlled ultraviolet radiation, temperature and humidity changes, so as to conduct comprehensive and systematic tests on the durability, color stability and physical properties of materials. In recent years, with the development of science and technology and the continuous improvement of material performance requirements, the application of UV weathering test chambers has become more and more extensive, covering plastics, coatings, rubber, textiles and other fields.
The characteristics of the equipment are mainly reflected in its high efficiency and accuracy. First of all, the UV weathering test chamber uses a high-intensity ultraviolet lamp, which emits an ultraviolet spectrum close to sunlight, which can accurately simulate the lighting conditions in the real environment. Secondly, it has a real-time monitoring and control system, which can precisely regulate the internal temperature, humidity and UV intensity to ensure the stability of the test process and the reliability of the results. In addition, the internal material and structural design of the test chamber is also particularly important, which usually uses corrosion resistant and oxidation resistant materials to extend the service life of the equipment and improve the accuracy of the test.
In addition, the application of UV weathering test chamber is not only limited to the aging detection of materials, but also can predict and improve the performance of materials, making manufacturers more forward-looking and scientific in material selection and product design. The use of this equipment to a large extent reduces the quality problems caused by the lack of weather resistance of the product and improves the market competitiveness of the product. Therefore, in the material research and development, the UV weathering test chamber can be described as an indispensable auxiliary tool, which helps enterprises quickly detect and optimize material properties to meet the changing needs of the market.
In short, UV weathering test chamber, as an advanced testing technology, is leading the progress and innovation in the field of materials science. With the increasing demand for environmentally friendly materials and long-lasting products, the importance of such equipment will only become more prominent. Its scientific, reliable and efficient will help all walks of life to develop more high-quality products to cope with more unknown challenges in the future.
High and Low Temperature Test Standard of PC Plastic Material
1. High temperature test
After being placed at 80±2℃ for 4 hours and at normal temperature for 2 hours, the dimensions, insulation resistance, voltage resistance, key function, and loop resistance meet the normal requirements, and there are no abnormal phenomena such as deformation, warping, and degumming in appearance. The key convex point collapses at high temperature and the press force becomes smaller without assessment.
2. Low temperature test
After being placed at -30±2℃ for 4 hours and at normal temperature for 2 hours, the dimensions, insulation resistance, voltage resistance, key function, and loop resistance meet normal requirements, and there are no abnormal phenomena such as deformation, warping, and degumming in appearance.
3. Temperature cycle test
Put in 70±2℃ environment for 30 minutes, take out at room temperature for 5 minutes; Leave in -20±2℃ environment for 30 minutes, remove and leave at room temperature for 5 minutes. After such 5 cycles, the dimensions, insulation resistance, voltage resistance, key function, circuit resistance meet the normal requirements, and the appearance of no deformation, warping, degumming and other abnormal phenomena. The key convex point collapses at high temperature and the press force becomes smaller without assessment.
4. Heat resistance
After being placed in an environment with a temperature of 40±2℃ and a relative humidity of 93±2%rh for 48 hours, the dimensions, insulation resistance, voltage resistance, key function, and loop resistance meet normal requirements, and the appearance is not deformed, warped, or degumped. The key convex point collapses at high temperature and the press force becomes smaller without assessment.
National standard value for plastic testing:
Gb1033-86 Plastic density and relative density test method
Gbl636-79 Test method for apparent density of moulding plastics
GB/ T7155.1-87 Thermoplastic pipe and pipe fittings density determination part: polyethylene pipe and pipe fittings reference density determination
GB/ T7155.2-87 Thermoplastic pipes and fittings -- Determination of density -- Part L: Determination of density of polypropylene pipes and fittings
GB/T1039-92 General rules for testing mechanical properties of plastics
GB/ T14234-93 Surface roughness of plastic parts
Gb8807-88 plastic mirror gloss test method
Test method for tensile properties of GBL3022-9L plastic film
GB/ TL040-92 Test method for tensile properties of plastics
Test method for tensile properties of GB/ T8804.1-88 thermoplastic pipes polyvinyl chloride pipes
GB/ T8804.2-88 Test methods for tensile properties of thermoplastic pipes Polyethylene pipes
Hg2-163-65 plastic low temperature elongation test method
GB/ T5471-85 Method for preparing thermosetting molding specimens
HG/ T2-1122-77 thermoplastic sample preparation method
GB/ T9352-88 thermoplastic compression sample preparation
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LED Street Lamp Test Specification
LED street lights are currently one of the key implementation methods to save energy and reduce carbon, all countries in the world have been in full swing to replace the original traditional street lights with LED street lights, and the new street is directly limited to the use of LED street lights to save energy. At present, the world LED street lamp market size of about 80 million, LED lamp light source whether it is heat, service life, output spectrum, output illuminance, material characteristics, are different from traditional mercury lamp or high-pressure sodium lamp. The test conditions and test methods of LED street lights are different from traditional lamps. Lab Companion collected the reliability test methods related to LED street lights at present and provide you with reference to help you understanding the related tests about LED.
LED street lamp test specification abbreviation:
LED street lamp test standard specification, LED street lamp test method technical specification, LED street lamp standard and test method, night landscape engineering semiconductor lighting device components product technical specification, semiconductor lighting night landscape engineering construction quality acceptance technical specification, IEC 61347LED power supply safety regulation
LED street lamp test specification conditions:
CJJ45-2006 Urban road lighting design standard, UL1598 lamps safety standard, UL48 wire and cable safety standard, UL8750 light-emitting diode safety standard, CNS13089 light-emitting diode large lamp durability Test - pre-burning test - outdoor, Waterproof Test: IP65, American Standard for LED lamps, EN 60598-1, EN 60598-2 Street lamp test
LED large lamp quality certification test project:
Temperature cycle, temperature and humidity cycle, high temperature preservation, moisture resistance, vibration, shock, continuous power, salt water spray, acceleration, solder heat resistance, solder adhesion, terminal strength, natural drop, dust test
LED large lamp quality certification test conditions:
Temperature cycle: 125℃(30min)←R.T.(5min)→-65℃(30min)/5cycle
LED street lamp (light-emitting diode outdoor display with large lights) failure determination:
a. The axis light is lower than the residual rating of 50%
b. Forward voltage is greater than 20% of the rated value
c. Reverse current greater than 100% of the rated value
d. The half height wave length and half power Angle of the light exceed the limited maximum value or the limited minimum value meet the above conditions, and determine the failure of the LED street lamp
Note: The luminous efficiency of LED street lamp is recommended to be at least 45lm/W or above (the luminous efficiency of LED light source must be about 70 ~ 80lm/W)
High temperature storage: maximum storage temperature 1000 hours [special level 3000 hours]
Moisture resistance: 60℃/90%R.H./1000 hours [characteristic level 2000 hours]/ applying bias
Brine spray: 35℃/ concentration 5%/18 hours [24 hours special level]
Continuous power: maximum forward current 1000 hours
Natural fall: Fall height 75cm/ fall times 3 times/fall material smooth maple wood
Dust test: continuous 360 hours of 50℃ ring temperature test
Vibration: 100 ~ 2000Hz, 196m/s^2, 48 hours
Impact: Grade F[Acceleration 14700m/s^2, pulse amplitude 0.5ms, six directions, three times in each direction]
Equal acceleration: Acceleration is applied in all directions (class D: 196000 m/s^2) for 1 minute
Solder heat resistance: 260℃/10 seconds /1 time
Solder adhesion: 250℃/5 seconds
Terminal strength
LED large lamp batch quality test project:
Terminal strength, solder heat resistance, temperature cycle, moisture resistance, continuous power, high temperature storage
LED large lamp batch quality test conditions:
Moisture resistance: 60℃/90%R.H./168 hours (no failure)/500 hours (one failure allowed)[test number 10 / apply bias]
Continuous power on: maximum forward current /168 hours (no failure)/500 hours (one failure allowed)[test number 10]
High temperature storage: maximum storage temperature /168 hours (no failure)500 hours (one failure allowed)[test number 10]
Solder heat resistance: 260℃/10 seconds /1 time
Solder adhesion: 250℃/5 seconds
LED large lamp regular quality test project:
Vibration, shock, acceleration, moisture resistance, continuous power, high temperature preservation
Regular quality test conditions for LED large lights:
Moisture resistance: 60℃/90%R.H./1000 hours
Continuous power: maximum forward current /1000 hours
High temperature storage: Maximum storage temperature /1000 hours
Vibration: 100 ~ 2000Hz, 196m/s^2, 48 hours
Impact: Grade F[Acceleration 14700m/s^2, pulse amplitude 0.5ms, six directions, three times in each direction]
Equal acceleration: Acceleration is applied in all directions (class D: 196000 m/s^2) for 1 minute
LED large lamp screening test project:
Acceleration test, temperature cycle, high temperature preservation, pre-burning test
LED large light screening test conditions:
Constant acceleration test: Apply acceleration (grade D: 196000 m/s^2) in each direction for 1 minute
Temperature cycle: 85℃(30min)←R.T.(5min)→-40℃(30min)/5cycle
Pre-firing test: temperature (maximum rated temperature)/ current (maximum rated forward current)96 hours
High temperature storage: 85℃/72 ~ 1000 hours
LED lamp life test:
More than 1000 hours of Life Test (Life Test), light attenuation < 3% [withered light]
More than 15,000 hours of Life Test (Life Test), light attenuation < 8%
Test Specification of LCD Display
LCD Display, full name of Liquid Crystal Display, is a flat display technology. It mainly uses liquid crystal materials to control the transmission and blocking of light, so as to achieve the display of images. The structure of the LCD usually includes two parallel glass substrates, with a liquid crystal box in the middle, and the polarized light of each pixel is controlled by the rotation direction of the liquid crystal molecules through the voltage, so as to achieve the purpose of imaging. LCD displays are widely used in TV, computer monitors, mobile phones, tablet computers and other devices.
At present, the common liquid crystal display devices are Twisted Nematic (TN), Super Twisted Nematic (Super Twisted Nematic), STN), DSTN(Double layer TN) and color Thin Film Transistors (TFT). The first three kinds of manufacturing basic principles are the same, become passive matrix liquid crystal, and TFT is more complex, because of the retention of memory, and called active matrix liquid crystal.
Due to liquid crystal display has the advantages of small space, thin panel thickness, light weight, flat right-angle display, low power consumption, no electromagnetic radiation, no thermal radiation, it gradually replaces the traditional CRT image tube monitor.
LCD displays basically have four display modes: reflection, reflection transmission conversion, projection, transmission.
(1) The reflection type liquid crystal display itself does not emit light, through the light source in the space into the LCD panel, and then by its reflective plate will reflect the light to the eyes of people;
(2) The reflection transmission conversion type can be used as a reflection type when the light source in the space is sufficient, and the light source in the space is used as lighting when the light is not enough;
(3) Projection type is to use the principle of similar movie playback, the use of projected light department to project the image displayed by the liquid crystal display to the remote larger screen;
(4) The transmission type liquid crystal display completely uses the hidden light source as lighting.
Relevant Test Conditions:
Item
Temperature
Time
Other
High temperature storage
60℃,30%RH
120 hours
Note 1
Low temperature storage
-20℃
120 hours
Note 1
High temperature and high humidity
40℃,95%RH (non-invasive)
120 hours
Note 1
High-temperature operation
40℃,30%RH.
120 hours
Standard voltage
Temperature shock
-20℃(30min)↓25℃(10min)↓20℃(30min)↓25℃(10min)
10cycle
Note 1
Mechanical vibration
—
—
Frequency: 5-500hz, acceleration: 1.0g, amplitude: 1.0mm, duration: 15mins, twice in X,Y,Z direction.
Item
Temperature
Time
Other
Note 1: The tested module should be placed at normal (15 ~ 35℃,45 ~ 65%RH) for one hour before testing
Specification for Ground Solar Radiation Simulation Test
The purpose of this test method is to determine the physical and chemical effects of components and equipment exposed to solar radiation on the Earth surface (e.g. The main characteristics of the simulated environment in this experiment are the solar spectral energy distribution and intensity of received energy under the control of temperature and humidity in the test environment. There are three procedures in the test mode (Procedure A: thermal effect evaluation, procedure B: degradation effect evaluation, procedure C: photochemical effect evaluation).
Applicable products:
Electronic products that will be used outside the home for a long time, such as: laptops, mobile phones, MP3&MP4, GPS, automotive electronics, digital cameras, PDAs, low-cost laptops, easy to carry laptops, video cameras, Bluebud headphones
Test requirements:
1. Spectral energy distribution shall meet the requirements of the specification
2. Illuminance: 1.120KW/m^2 (±10%)=[300-400um, 63 w/m2][The total global radiation of the earth's surface from the sun and the sky vertical is 1.120KW/m^2]
3. Temperature and humidity 40℃(±2)/93%(±3)R.H.
4. This test needs to control the humidity environment
5. During irradiation, the temperature in the box rises to the specified temperature (40℃, 55℃) at a linear rate.
6. The temperature in the box should start to rise 2 hours before irradiation
7. The temperature in the dark chamber should be decreased linearly and maintained at 25℃
8. Temperature error: ±2℃
9. The temperature measurement point in the box is taken from the test distance of 1m from the specimen or half of the box wall distance (the smaller one)
Spectral energy distribution and tolerance error range of Xenon lamp (according to the requirements of the International Illuminance Commission CIE)
The xenon lamp weather testing machine is not lit, but the spectrum output by its xenon lamp must be output in accordance with the requirements of the International Illuminance Commission CIE. Therefore, the equipment manufacturer of the weather testing machine must have the equipment (spectrometer) and technical capability to verify the xenon lamp spectrum (provide xenon lamp verification report).
Test procedure evaluation description:
According to IEC68-2-5&IEC-68-2-9, there are three kinds of test methods for light resistance test, which can be divided into program A: thermal effect, B: degradation effect, C: photochemistry. Among these three methods, procedure A is the most severe test method, which will be detailed in the following article.
Three test procedures: Procedure A: thermal effect (most severe natural conditions), B: degradation effect (22.4KWh/m2 per day), C: photochemistry
Program A: Thermal effect
Test conditions: 8 hours of exposure, 16 hours of darkness, a total of 24 hours per cycle, three cycles were required, and the total exposure of each cycle was 8.96KWh/m2
Procedure A test precautions:
Instructions: In the test process of program A, the xenon lamp is not lit immediately at the beginning of the test, according to the requirements of the code, it must be lit after 2 hours of the test, closed at 10 hours, and the total irradiation time of a cycle is 8 hours. During the lighting process, the temperature in the furnace rises linearly from 25℃ to 40℃(satisfying most environments in the world) or 55℃(satisfying all environments in the world), and decreases linearly at 10 hours to 25℃ for 4 hours, with a linear slope (RAMP) of 10 hours.
Test procedure B: Degradation effect
Test conditions: Temperature and humidity in the first four hours of the test was (93%), irradiation for 20 hours, darkness for 4 hours, a total of 24 hours per cycle Total exposure for each cycle was 22.4KWh/m2 cycles: 3(3 days: commonly used), 10(10 days), 56(56 days)
Procedure B test precautions:
Instructions: Procedure B test is the only test condition for humidity control during light resistance test in IEC68-2-5 specification. The specification requires that the temperature and humidity conditions are (40±2℃/93±3%) within four hours from the beginning of the test [supplementary description in IEC68-2-9] humidity environment, which should be paid attention to when conducting the test. At the beginning of the program B test, the temperature was raised from 25℃ linear slope (RAMP: 2 hours) to 40℃ or 55℃, maintained for 18 hours, and then the linear cooling (RAMP: 2 hours) returned to 25℃ for 2 hours to complete a cycle of experiments. Remarks: IEC68-2-9 = Solar Radiation Test Guidelines
Test procedure C: Photochemistry (Continuous Irradiation)
Test conditions: 40℃ or 55℃, continuous irradiation (depending on the time required)
Procedure C test precautions:
Note: After the linear temperature rise (RAMP: 2 hours) from 25℃ to 40℃ or 55℃, the continuous irradiation test was carried out at a fixed temperature before the end of the test. The irradiation time was determined according to the characteristics of the product to be tested in the test, which was not clearly specified in the specification.
Bellcore GR78-CORE Test Specification
Bellcore GR78-CORE is one of the specifications used in the early surface insulation resistance measurement (such as IPC-650). The relevant precautions in this test are organized for the reference of the personnel who need to carry out this test, and can also provide a preliminary understanding of this specification.
Test purpose:
Surface Insulation resistance testing
1. Constant temperature and humidity test chamber: the minimum test conditions are 35°C±2°C/85%R.H, 85 ±2°C/85%R.H.
2. Ion migration measurement system: Allowing the insulation resistance of the test circuit (pattern) to be measured under these conditions, a power supply will be able to provide 10 Vdc / 100μA.
Test procedure:
a. The object to be measured is tested after 24 hours at 23℃(73.4℉)/50%R.H. condition.
b. Place limited Test patterns on an appropriate rack and keep the test circuits at least 0.5 inches apart, keep air flow and the rack in the furnace until the end of the experiment.
c. Place the shelf in the center of the constant temperature and humidity machine, align and parallel the test board with the air flow in the chamber, and lead the line to the outside of the chamber, so that the wiring is far away from the test circuit.
d. Close the furnace door and set the condition to 35 ±2°C, at least 85%R.H. and allow the furnace to spend several hours stabilizing
e. After 4 days, the insulation resistance will be measured and the measured value will be recorded periodically between 1 and 2,2 and 3,3 and 4, 4 and 5 using an applied voltage of 45 ~ 100 Vdc. Under the test conditions, the test is sent out the measured voltage to the circuit after 1 minute. 2 and 4 are periodically at an identical potential. And 5 periodically at opposite potentials.
f. This condition only applies to transparent or translucent materials, such as solder masks and conformal coatings.
g. As for multilayer printed circuit boards required for insulation resistance testing, the only normal procedure will be used for insulation resistance testing circuit products. Extra cleaning procedures are prohibited.
Method of conformity determination:
1. After the electron migration test is completed, the test sample is removed from the test furnace, illuminated from the back and tested at 10 x magnification, and will not be found to reduce the electron migration (filamental growth) phenomenon by more than 20% between the conductors.
2. adhesives will not be used as a basis for republication when determining compliance with the 2.6.11 test method of IPC-TM-650[8] to examine appearance and surface item by item.
Reasons why insulation resistance does not meet the requirements:
1. Contaminants weld the cells like wires on the insulating surface of the substrate, or are dropped by the water of the test furnace (chamber)
2. Incompletely etched patterns will reduce the insulation distance between conductors by more than permitted design requirements
3. Chafes, breaks, or significantly damages the insulation between conductors
AEC-Q200 Passive Component Stress Test Certification Specification for Automotive Industry
In recent years, with the progress of multi-functional in-vehicle applications, and in the process of popularization of hybrid vehicles and electric vehicles, new uses led by power monitoring functions are also expanding, miniaturization of vehicle parts and high reliability requirements under high temperature environmental conditions (-40 ~ +125℃, -55℃ ~ +175℃) are increasing. A car is composed of many parts. Though these parts are large and small, they are closely related to the life safety of car driving, so every part is required to achieve the highest quality and reliability, even the ideal state of zero defects. In the automotive industry, The importance of quality control of auto parts is often over the functionality of parts, which is different from the needs of consumer electronics for the general people's livelihood, that is to say, for auto parts, the most important driving force of the product is often not [the latest technology], but [quality safety]. In order to achieve the improvement of quality requirements, it is necessary to rely on strict control procedures to check, the current automotive industry for parts qualification and quality system standards is AEC(Automotive Electronics Committee). The active parts designed for the standard [AEC-Q100]. The passive components designed for [AEC-Q200]. It regulates the product quality and reliability that must be achieved for passive parts.
Classification of passive components for automotive applications:
Automotive grade electronic components (compliant with AEC-Q200), commercial electronic components, power transmission components, safety control components, comfort components, communication components, audio components
Parts summary according to AEC-Q200 standard:
Quartz oscillator: Application range [tire pressure monitoring systems (TPMS), navigation, anti-lock brakes (ABS), airbags and proximity sensors In-vehicle multimedia, in-vehicle entertainment systems, backup camera lenses]
Automotive thick film chip resistors: Application [automotive heating and cooling systems, air conditioning, infotainment systems, automatic navigation, lighting, door and window remote control devices]
Automotive sandwich metal oxide varistors: Application [Surge protection of motor components, surge absorption of components, semiconductor overvoltage protection]
Low and high temperature surface mount solid molded chip tantalum capacitors: Application [fuel quality sensors, transmissions, throttle valves, drive control systems]
Resistance: SMD resistor, film resistor, thermistor, varistor, automotive vulcanization resistance, automotive precision film wafer resistance array, variable resistance
Capacitors: SMD capacitors, ceramic capacitors, aluminum electrolytic capacitors, film capacitors, variable capacitors
Inductance: Reinforced inductance, inductor
Other: LED thin film alumina ceramic cooling substrate, ultrasonic components, overcurrent protection SMD, overtemperature protection SMD, ceramic resonator, automotive PolyDiode semiconductor ceramic electronic protection components, network chips, transformers, network components, EMI interference suppressors, EMI interference filters, self-recovery fuses
Passive device stress test grade and minimum temperature range and typical application cases:
Class
Temperature range
Passive device type
Typical application case
Minimum
Maximum
0
-50 ℃
150℃
Flat core ceramic resistor, X8R ceramic capacitor
For all cars
1
-40 ° C
125 ° C
Network capacitors, resistors, inductors, transformers, thermistors, resonators, quartz oscillators, adjustable resistors, ceramic capacitors, tantalum capacitors
For most engines
2
-40 ℃
105℃
Aluminum electrolytic capacitor
Cockpit high temperature point
3
-40 ℃
85℃
Thin capacitors, ferrites, network low-pass filters, network resistors, adjustable capacitors
Most of the cockpit area
4
0 ° C
70 ° C
Non-automotive
Note: Certification for applications in higher grade environments: Temperature grades must have a product life worst-case and application design, i.e. at least one batch of each test must be validated for applications in higher grade environments.
Number of certification tests required:
High temperature storage, high temperature working life, temperature cycle, humidity resistance, high humidity: 77 thermal shock: 30
Number of certification tests Note:
This is a destructive test and the component cannot be reused for other certification tests or production
JEDEC, a standardization organization in the semiconductor industry, develops industrial standards in solid state electronics (semiconductor, memory), established for more than 50 years, is a global organization. The standards it has formulated are many industries take over and adopt. It's technical data are open and free of charge, only some of the data need to be charged. So you can go to the official website to register and download, the content contains the definition of professional terms, product specifications, test methods, reliability test requirements... It covers a wide range of topics.
JEP122G-2011 Failure mechanism and model of semiconductor components
Accelerated life tests are used to identify potential semiconductor failure causes in advance and estimate possible failure rates. The relevant activation energy and acceleration factor formulas are provided in this section for estimation and failure rate statistics under accelerated life tests.
Recommended equipment: high and low temperature test chamber, hot and cold shock test chamber, highly accelerated life test chamber, SIR Surface insulation resistance measurement system
JEP150.01-2013 Stress test drive failure mechanism associated with assembly of solid state surface mount components
GBA and LCC are attached to the PCB, using a more commonly used set of accelerated reliability tests to evaluate the heat dissipation of the production process and product, to identify potential failure mechanisms, or any reason that may cause error failure.
Recommended equipment: high and low temperature test chamber, hot and cold shock test chamber, highly accelerated life test chamber
JESD22-A100E-2020 Cycle temperature and humidity bias surface condensation life test
Test the reliability of non-sealed solid state devices in humid environments through temperature cycling + humidity + current bias. This test specification adopts the method of [temperature cycling + humidity + current bias] to accelerate the penetration of water molecules through the external protective material (sealant) and the interface protective layer between the metal conductor. Such a test will cause condensation on the surface. It can be used to confirm the corrosion and migration phenomenon of the surface of the product to be tested.
Recommended equipment: high and low temperature test chamber
JESD22-A101D.01-2021 Steady-state temperature and humidity bias life test
This standard defines the methods and conditions for performing temperature-humidity life tests under applied bias to assess the reliability of non-airtight packaged solid-state devices (e.g., sealed IC devices) in humid environments.
High temperature and humidity conditions are used to accelerate moisture penetration through external protective materials (sealants or seals) or along the interface between external protective coatings and conductors and other through parts.
Recommended equipment: high and low temperature test chamber
JESD22-A102E-2015 package IC unbiased PCT test
To evaluate the integrity of non-airtight packaged devices against water vapor in a condensed or saturated water vapor environment, the sample is placed in a condensed, high-humidity environment under high pressure to allow water vapor to enter the package, exposing weaknesses in the package, such as delamination and metallization layer corrosion. This test is used to evaluate new package structures or updates of materials and designs in the package body. It should be noted that there will be some internal or external failure mechanisms in this test that do not match the actual application situation. Since absorbed water vapor reduces the glass transition temperature of most polymer materials, an unreal failure mode may occur when the temperature is higher than the glass transition temperature.
Recommended equipment: Highly accelerated life test chamber
JESD22-A104F-2020 Temperature cycle
The temperature cycle (TCT) test is the reliability test of the IC part subjected to extremely high temperature and extremely low temperature, back and forth temperature conversion between the test, the IC part is repeatedly exposed to these conditions, after the specified number of cycles, the process is required to specify its temperature change rate (℃/min), in addition to confirm whether the temperature is effectively penetrated into the test product.
Recommended equipment: thermal shock test chamber
JESD22-A105D-2020 Power and temperature cycle
This test is applicable to semiconductor components affected by temperature. In the process, the test power supply needs to be turned on or off under the specified high and low temperature difference conditions. The temperature cycle and power supply test are to confirm the bearing capacity of the components, and the purpose is to simulate the worst situation that will be encountered in practice.
Recommended equipment: thermal shock test chamber
JESD22-A106B.01-2016 Temperature shock
This temperature shock test is carried out to determine the resistance and impact of semiconductor components to sudden exposure to extreme high and low temperature conditions. The temperature change rate of this test is too fast to simulate the real actual use. The purpose is to apply more severe stress on semiconductor components, accelerate the damage of their vulnerable points, and find out the possible potential damage.
Recommended equipment: thermal shock test chamber
JESD22-A110E-2015 HAST highly accelerated life test with bias
According to JESD22-A110 specifications, both THB and BHAST are used to test components at high temperature and humidity, and the test process needs to be biased to accelerate the corrosion of components. The difference between BHAST and THB is that they can effectively shorten the test time required for the original THB test
Recommended equipment: Highly accelerated life test chamber
JESD22A113I plastic surface mount device prior to reliability testing
For non-enclosed SMD parts, pre-treatment can simulate the reliability problems that may occur during the assembly of the circuit board due to the damage caused by packaging moisture, and identify potential defects in the reflow assembly of SMD and PCB through the test conditions of this specification.
Recommended equipment: high and low temperature test chamber, hot and cold shock test chamber
JESD22-A118B-2015 Unbiased high-speed accelerated life test
To evaluate the resistance of non-airtight package components to moisture under non-biased conditions, confirm their moisture resistance, robustness and accelerated corrosion and aging, which can be used as a test similar to JESD22-A101 but at a higher temperature. This test is a highly accelerated life test using non-condensation temperature and humidity conditions. This test must be able to control the rising and cooling rate in the pressure cooker and the humidity during cooling
Recommended equipment: Highly accelerated life test chamber
JESD22-A119A-2015 Low temperature storage life test
In the case of no bias, by simulating the low temperature environment to assess the ability of the product to withstand and resist low temperature for a long time, the test process does not apply bias, and the electrical test can be carried out after the test is returned to normal temperature
Recommended equipment: high and low temperature test chamber
JESD22-A122A-2016 Power cycle test
Provides standards and methods for solid-state component package power cycle testing, through biased switching cycles that cause uneven temperature distribution inside the package (PCB, connector, radiator), and simulates standby sleep mode and full load operation, as well as life cycle testing for associated links in solid-state component packages, This test complements and augments the results of the JESD22-A104 or JESD22-A105 tests, which cannot simulate harsh environments such as engine rooms or aircraft and space shuttles.
Recommended equipment: thermal shock test chamber
JESD94B-2015 Application-Specific qualifications use knowledge-based testing methods
Testing devices with correlated reliability testing techniques provides a scalable approach to other failure mechanisms and test environments, and life estimates using correlated life models
Recommended equipment: high and low temperature test chamber, hot and cold shock test chamber, highly accelerated life test chamber
With the progress of society, the public's awareness of energy conservation, environmental protection and carbon reduction is increasing, the improvement of battery life, convenient stores to provide battery replacement services and the establishment of charging columns and other favorable conditions, which has prompted the public to accept the purchase of electric locomotives. The general definition of electric locomotives is: Extreme speed of less than 50km/h, on the slope, the maximum slope of the general urban road is about 5 ~ 60 degrees, the underground parking lot is about 120 degrees to the ground, the mountain slope is about 8 ~ 90 degrees, in the case of slope 80 degrees, more than 10 kilometers per hour for the basic needs of electric locomotives. Electric locomotive power system composition is mainly: Power system controller, motor controller, permanent magnet synchronous motor & DC brushless motor, DC power converter, battery management system, car charger, rechargeable battery, etc., Many manufacturers now introduce permanent magnet synchronous motor & DC brushless motor, with low speed and high torque, carbon brush free maintenance, far endurance and other advantages. Both the electric locomotive and the power motor system must meet the Ministry of Transportation light bicycle standards, or relevant regulatory requirements.
Electric locomotive complete vehicle reference specification:
CNS3103 machine bicycle running test method general
CNS3107 machine bicycle acceleration test method
Gb17761-1999 General technical conditions for electric bicycles
JIS-D1034-1999 Test method for braking of motor bicycles
GB3565-2005 Safety requirements for bicycles
Electric locomotive motor or brushless DC motor citation specification:
CNS14386-9 Electric motor bicycle-Test method for power output of motor and controller connection for vehicles
GB/T 21418-2008 Permanent magnet brushless motor system general technical conditions
IEC60034-1 Rating and Performance of rotating motors (GB755)
GJB 1863-1994_ General Specification for brushless DC motors
GJB 5248-2004 General specification for brushless DC motor drivers
GJB 783-1989 micromotor industry standard drive specification
QB/T 2946-2008 Electric bicycle motor and controller
QMG-J52.040-2008 Brushless DC motor
SJ 20344-2002 General specification for brushless DC torque motors
Environmental tests are mainly based on specifications:
IEC60068-2, GJB150
Applicable test equipment:
1.High and low temperature test chamber
2. High and low temperature humidity test chamber
3. Industrial Oven
4. Rapid temperature cycle test chamber
Temperature Cycle Test Specification
Instructions
In order to simulating the temperature conditions encountered by different electronic components in the actual use environment, Temperature Cycling changes the ambient temperature difference range and rapid rise and fall temperature change to provide a more stringent test environment. However, it must be noted that additional effects may be caused to material testing. For the relevant international standard test conditions of temperature cycle test, there are two ways to set the temperature change. First, Lab Companion provides an intuitive setting interface, which is convenient for users to set according to the specification. Second, you can choose the total Ramp time or set the rising and cooling rate with the temperature change rate per minute.
List of International Specifications for Temperature Cycling Tests:
Total Ramp time (min) : JESD22-A104, MIL-STD-8831, CR200315
Temperature variation per minute (℃/min) IEC60749, IPC-9701, Brllcore-GR-468, MIL-2164
Example: Lead-free Solder Joint Reliability Test
Note: In terms of the reliability test of lead-free technetium-free points, different test conditions will be different for the temperature change setting, such as (JEDECJESD22-A104) will specify the temperature change time with the total time [10min], while other conditions will specify the temperature change rate with [10° C/min], such as from 100 °C to 0°C. With a temperature change of 10 degrees per minute, that is to say, the total temperature change time is 10 minutes.
100℃ [10min]←→0℃[10min], Ramp: 10℃/min,6500 cycle
-40℃[5min]←→125℃[5min],Ramp: 10min,
200 cycle check once, 2000 cycle tensile test [JEDEC JESD22-A104]
-40°C(15min)←→125°C(15min), Ramp:15min, 2000 cycle
Example: LED Automotive lighting (High Power LED)
The temperature cycle experimental conditions of LED car lights are -40 °C to 100 °C for 30 minutes, the total temperature change time is 5 minutes, if converted to temperature change rate, it is 28 degrees per minute (28 ° C /min).
Test conditions: -40℃ (30min) ←→100℃ (30min), Ramp: 5min
Instructions:
Early temperature cycle tests only look at the air temperature of the test furnace. At present, according to the requirements of relevant international norms, the temperature variability of the temperature cycle test refers not to the air temperature but the surface temperature of the product to be tested (such as the air temperature variability of the test furnace is 15°C/min, but the actual temperature variability measured on the surface of the product to be tested may only be 10~11°C/min), and the temperature variability that will rise and cool down also needs symmetry, repeatability (the rise and cooling waveform of each cycle is the same), and linear (the temperature change and cooling speed of different loads is the same). In addition, lead-free solder joints and part life assessment in advanced semiconductor manufacturing processes also have many requirements for temperature cycle testing and temperature shock, so its importance can be seen (such as: JEDEC-22A-104F-2020, IPC9701A-2006, MIL-883K-2016). The relevant international specifications for electric vehicles and automotive electronics, their main test are also based on the temperature cycle test of the surface of the product (such as :S016750, AEC-0100, LV124, GMW3172).
Specification for the product to be tested surface temperature cycle control requirements:
1. The smaller the difference between the sample surface temperature and the air temperature, the better.
2. Temperature cycle rise and fall must be over temperature (exceed the set value, but not exceed the upper limit required by the specification).
3. The surface of the sample is immersed in the shortest time. Time (soaking time is different from residence time).
Thermal stress testing machine (TSC)of LAB COMPANION in the temperature cycle test of the product to be tested surface temperature control features:
1. You can choose [air temperature] or [temperature control of the product to be tested] to meet the requirements of different specifications.
2. The temperature change rate can be selected [equal temperature] or [average temperature], which meets the requirements of different specifications.
3. The deviation of temperature variability between heating and cooling can be set separately.
4. Overtemperature deviation can be set to meet the requirements of the specification.
5.[temperature cycle] and [temperature shock] can be selected table temperature control.
IPC requirements for temperature cycle test of products:
PCB requirements: The maximum temperature of the temperature cycle should be 25°C lower than the glass transfer point temperature (Tg) value of the PCB board.
PCBA requirements: The temperature variability is 15°C/min.
Requirements for solder:
1. When the temperature cycle is below -20 °C, above 110 °C, or contains the above two conditions at the same time, more than one damage mechanism may occur to the solder lead welding connection. These mechanisms tend to accelerate each other, leading to early failure.
2. In the process of slow temperature change, the difference between the sample temperature and the air temperature in the test area should be within a few degrees.
Requirements for vehicle regulations: According to AECQ-104, TC3(40°C←→+125°C) or TC4(-55°C←→+125°C) is used in accordance with the environment of the engine room of the car.
Bellcore GR78-CORE is one of the specifications used in early surface insulation resistance measurement (such as IPC-650). The relevant precautions in this test are organized for reference of personnel who need to carry out this test, and we can also have a preliminary understanding of this specification.
Test purpose:
Surface Insulation Resistance Testing
1. Constant temperature and humidity test chamber: the minimum test conditions are 35°C±2°C/85%R.H., 85 ±2°C/85% R.H.
2. Ion migration measurement system: Allowing insulation resistance of the test circuit to be measured under these conditions, a power supply will be able to provide 10 Vdc / 100μA.
Test procedure:
a. The test object is tested after 24 hours at 23°C (73.4° F)/50%R.H. environment
b. Place limited Test patterns on an appropriate rack and keep the test circuits at least 0.5 inches apart, without obstructing air flow, and the rack in the furnace until the end of the experiment.
c. Place the shelf in the center of the constant temperature and humidity test chamber, align and parallel the test board with the air flow in the chamber, and lead the line to outside of the chamber, so that the wiring is far away from the test circuit.
d. Close the furnace door and set the condition to 35 ±2°C, at least 85%R.H. and allow the furnace to spend several hours stabilizing
e. After 4 days, the insulation resistance will be measured and the measured value will be recorded periodically between 1 and 2,2 and 3,3 and 4, 4 and 5 using an applied voltage of 45 ~ 100 Vdc. Under the test conditions, the test is sent out the measured voltage to the circuit after 1 minute. 2 and 4 are periodically at an identical potential. And 5 periodically at opposite potentials.
f. This condition only applies to transparent or translucent materials, such as solder masks and conformal coatings.
g. As for multilayer printed circuit boards required for insulation resistance testing, the only normal procedure will be used for insulation resistance testing circuit products. Extra cleaning procedures are not allowed.
Related test chamber： temperature and humidity chamber
Method of conformity determination:
1. After the electron migration test is completed, the test sample is removed from the test furnace, illuminated from the back and tested at 10 x magnification, and will not be found to reduce the electron migration (filamental growth) phenomenon by more than 20% between the conductors.
2. adhesives will not be used as a basis for republication when determining compliance with the 2.6.11 test method of IPC-TM-650[8] to examine appearance and surface item by item.
Insulation resistance does not meet the requirements of the reasons:
1. Contaminants weld the cells like wires on insulating surface of substrate, or are dropped by water of test furnace (chamber)
2. Incompletely etched circuits will reduce insulation distance between conductors by more than permitted design requirements
3. Chafes, breaks, or significantly damages the insulation between conductors
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