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  • IEC-60068-2 Combined Test of Condensation and Temperature and Humidity IEC-60068-2 Combined Test of Condensation and Temperature and Humidity
    Oct 14, 2024
    IEC-60068-2 Combined Test of Condensation and Temperature and Humidity Difference of IEC60068-2 damp heat test specifications In the IEC60068-2 specification, there are a total of five kinds of humid heat tests, in addition to the common 85℃/85%R.H., 40℃/93%R.H. In addition to fixed-point high temperature and high humidity, there are two more special tests [IEC60068-2-30, IEC60068-2-38], these two are alternating wet and humid cycle and temperature and humidity combined cycle, so the test process will change temperature and humidity, and even multiple groups of program links and cycles, applied in IC semiconductors, parts, equipment, etc. To simulate the outdoor condensation phenomenon, evaluate the material's ability to prevent water and gas diffusion, and accelerate the product's tolerance to deterioration, the five specifications were organized into a comparison table of the differences in the wet and heat test specifications, and the test points were explained in detail for the wet and heat combined cycle test, and the test conditions and points of GJB in the wet and heat test were supplemented. IEC60068-2-30 alternating humid heat cycle test This test uses the test technique of maintaining humidity and temperature alternating to make moisture penetrate into the sample and cause condensation (condensation) on the surface of the product to be tested, so as to confirm the adaptability of the component, equipment or other products in use, transportation and storage under the combination of high humidity and temperature and humidity cyclic changes. This specification is also suitable for large test samples. If the equipment and the test process need to keep the power heating components for this test, the effect will be better than IEC60068-2-38, the high temperature used in this test has two (40 ° C, 55 ° C), the 40 ° C is to meet most of the world's high temperature environment, while 55 ° C meets all the world's high temperature environment, the test conditions are also divided into [cycle 1, cycle 2], In terms of severity, [Cycle 1] is higher than [Cycle 2]. Suitable for side products: components, equipment, various types of products to be tested Test environment: the combination of high humidity and temperature cyclic changes produces condensation, and three kinds of environments can be tested [use, storage, transportation ([packaging is optional)] Test stress: Breathing causes water vapor to invade Whether power is available: Yes Not suitable for: parts that are too light and too small Test process and post-test inspection and observation: check the electrical changes after moisture [do not take out the intermediate inspection] Test conditions: Humidity: 95%R.H.[Temperature change after high humidity maintenance](low temperature 25±3℃←→ high temperature 40℃ or 55℃) Rising and cooling rate: heating (0.14℃/min), cooling (0.08 ~ 0.16℃/min) Cycle 1: Where absorption and respiratory effects are important features, the test sample is more complex [humidity not less than 90%R.H.] Cycle 2: In the case of less obvious absorption and respiratory effects, the test sample is simpler [humidity is not less than 80%R.H.] IEC60068-2 damp heat test specification difference comparison table For component type parts products, a combination test method is used to accelerate the confirmation of the test sample's resistance to degradation under high temperature, high humidity and low temperature conditions. This test method is different from the product defects caused by respiration [dew, moisture absorption] of IEC60068-2-30. The severity of this test is higher than that of other humid heat cycle tests, because there are more temperature changes and [respiration] during the test, the cycle temperature range is larger [from 55℃ to 65℃], and the temperature change rate of the temperature cycle is faster [temperature rise: 0.14 ° C /min becomes 0.38 ° C /min, 0.08 ° C /min becomes 1.16 ° C /min], in addition, different from the general humid heat cycle, the low temperature cycle condition of -10 ° C is added to accelerate the breathing rate and make the water condensed in the gap of the substitute freeze, which is the characteristic of this test specification. The test process allows the power test and the applied load power test, but it can not affect the test conditions (temperature and humidity fluctuation, rising and cooling rate) because of the heating of the side product after power. Due to the change of temperature and humidity during the test process, there can not be condensation water droplets on the top of the test chamber to the side product. Suitable for side products: components, metal components sealing, lead end sealing Test environment: combination of high temperature, high humidity and low temperature conditions Test stress: accelerated breathing + frozen water Whether it can be powered on: it can be powered on and external electric load (it can not affect the conditions of the test chamber because of power heating) Not applicable: Can not replace moist heat and alternating humid heat, this test is used to produce defects different from respiration Test process and post-test inspection and observation: check the electrical changes after moisture [check under high humidity conditions and take out after test] Test conditions: damp heat cycle (25 please - 65 + 2 ℃ / 93 + / - 3% R.H.) please - low temperature cycle (25 please - 65 + 2 ℃ / 93 + 3% R.H. - - 10 + 2 ℃) X5cycle = 10 cycle Rising and cooling rate: heating (0.38℃/min), cooling (1.16 ℃/min) Heat and humidity cycle (25←→65±2℃/93±3%R.H.) Low temperature cycle (25←→65±2℃/93±3%R.H. →-10±2℃) GJB150-09 damp heat test Instructions: The wet and heat test of GJB150-09 is to confirm the ability of equipment to withstand the influence of hot and humid atmosphere, suitable for equipment stored and used in hot and humid environments, equipment prone to high humidity, or equipment that may have potential problems related to heat and humidity. Hot and humid locations can occur throughout the year in the tropics, seasonally in mid-latitudes, and in equipment subjected to combined pressure, temperature and humidity changes, with special emphasis on 60 ° C /95%R.H. This high temperature and humidity does not occur in nature, nor does it simulate the dampness and heat effect after solar radiation, but it can find the parts of the equipment with potential problems, but it cannot reproduce the complex temperature and humidity environment, evaluate the long-term effect, and can not reproduce the humidity impact related to the low humidity environment. Relevant equipment for condensation, wet freezing, wet heat combined cycle test: constant temperature and humidity test chamber
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  • AEC-Q100- Failure Mechanism Based on Integrated Circuit Stress Test Certification AEC-Q100- Failure Mechanism Based on Integrated Circuit Stress Test Certification
    Oct 12, 2024
    AEC-Q100- Failure Mechanism Based on Integrated Circuit Stress Test Certification With the progress of automotive electronic technology, there are many complicated data management control systems in today's cars, and through many independent circuits, to transmit the required signals between each module, the system inside the car is like the "master-slave architecture" of the computer network, in the main control unit and each peripheral module, automotive electronic parts are divided into three categories. Including IC, discrete semiconductor, passive components three categories, in order to ensure that these automotive electronic components meet the highest standards of automotive anquan, the American Automotive Electronics Association (AEC, The Automotive Electronics Council is a set of standards [AEC-Q100] designed for active parts [microcontrollers and integrated circuits...] and [[AEC-Q200] designed for passive components, which specifies the product quality and reliability that must be achieved for passive parts. Aec-q100 is the vehicle reliability test standard formulated by the AEC organization, which is an important entry for 3C and IC manufacturers into the international auto factory module, and also an important technology to improve the reliability quality of Taiwan IC. In addition, the international auto factory has passed the anquan standard (ISO-26262). AEC-Q100 is the basic requirement to pass this standard. List of automotive electronic parts required to pass AECQ-100: Automotive disposable memory, Power Supply step-down regulator, Automotive photocoupler, three-axis accelerometer sensor, video jiema device, rectifier, ambient light sensor, non-volatile ferroelectric memory, power management IC, embedded flash memory, DC/DC regulator, Vehicle gauge network communication device, LCD driver IC, Single power Supply differential Amplifier, Capacitive proximity switch Off, high brightness LED driver, asynchronous switcher, 600V IC, GPS IC, ADAS Advanced Driver Assistance System Chip, GNSS Receiver, GNSS front-end amplifier... Let's wait. AEC-Q100 Categories and Tests: Description: AEC-Q100 specification 7 major categories a total of 41 tests Group A- ACCELERATED ENVIRONMENT STRESS TESTS consists of 6 tests: PC, THB, HAST, AC, UHST, TH, TC, PTC, HTSL Group B- ACCELERATED LIFETIME SIMULATION TESTS consists of three tests: HTOL, ELFR, and EDR PACKAGE ASSEMBLY INTEGRITY TESTS consists of 6 tests: WBS, WBP, SD, PD, SBS, LI Group D- DIE FABRICATION RELIABILITY Test consists of 5 TESTS: EM, TDDB, HCI, NBTI, SM The group ELECTRICAL VERIFICATION TESTS consist of 11 tests, including TEST, FG, HBM/MM, CDM, LU, ED, CHAR, GL, EMC, SC and SER Cluster F-Defect SCREENING TESTS: 11 tests, including: PAT, SBA The CAVITY PACKAGE INTEGRITY TESTS consist of 8 tests, including: MS, VFV, CA, GFL, DROP, LT, DS, IWV Short description of test items: AC: Pressure cooker CA: constant acceleration CDM: electrostatic discharge charged device mode CHAR: indicates the feature description DROP: The package falls DS: chip shear test ED: Electrical distribution EDR: non-failure-prone storage durability, data retention, working life ELFR: Early life failure rate EM: electromigration EMC: Electromagnetic compatibility FG: fault level GFL: Coarse/fine air leakage test GL: Gate leakage caused by thermoelectric effect HBM: indicates the human mode of electrostatic discharge HTSL: High temperature storage life HTOL: High temperature working life HCL: hot carrier injection effect IWV: Internal hygroscopic test LI: Pin integrity LT: Cover plate torque test LU: Latching effect MM: indicates the mechanical mode of electrostatic discharge MS: Mechanical shock NBTI: rich bias temperature instability PAT: Process average test PC: Preprocessing PD: physical size PTC: power temperature cycle SBA: Statistical yield analysis SBS: tin ball shearing SC: Short circuit feature SD: weldability SER: Soft error rate SM: Stress migration TC: temperature cycle TDDB: Time through dielectric breakdown TEST: Function parameters before and after stress test TH: damp and heat without bias THB, HAST: Temperature, humidity or high accelerated stress tests with applied bias UHST: High acceleration stress test without bias VFV: random vibration WBS: welding wire cutting WBP: welding wire tension Temperature and humidity test conditions finishing: THB(temperature and humidity with applied bias, according to JESD22 A101) : 85℃/85%R.H./1000h/bias HAST(High Accelerated stress test according to JESD22 A110) : 130℃/85%R.H./96h/bias, 110℃/85%R.H./264h/bias AC pressure cooker, according to JEDS22-A102:121 ℃/100%R.H./96h UHST High acceleration stress test without bias, according to JEDS22-A118, equipment: HAST-S) : 110℃/85%R.H./264h TH no bias damp heat, according to JEDS22-A101, equipment: THS) : 85℃/85%R.H./1000h TC(temperature cycle, according to JEDS22-A104, equipment: TSK, TC) : Level 0: -50℃←→150℃/2000cycles Level 1: -50℃←→150℃/1000cycles Level 2: -50℃←→150℃/500cycles Level 3: -50℃←→125℃/500cycles Level 4: -10℃←→105℃/500cycles PTC(power temperature cycle, according to JEDS22-A105, equipment: TSK) : Level 0: -40℃←→150℃/1000cycles Level 1: -65℃←→125℃/1000cycles Level 2 to 4: -65℃←→105℃/500cycles HTSL(High temperature storage life, JEDS22-A103, device: OVEN) : Plastic package parts: Grade 0:150 ℃/2000h Grade 1:150 ℃/1000h Grade 2 to 4:125 ℃/1000h or 150℃/5000h Ceramic package parts: 200℃/72h HTOL(High temperature working life, JEDS22-A108, equipment: OVEN) : Grade 0:150 ℃/1000h Class 1:150℃/408h or 125℃/1000h Grade 2:125℃/408h or 105℃/1000h Grade 3:105℃/408h or 85℃/1000h Class 4:90℃/408h or 70℃/1000h   ELFR(Early Life failure Rate, AEC-Q100-008) : Devices that pass this stress test can be used for other stress tests, general data can be used, and tests before and after ELFR are performed under mild and high temperature conditions.
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  • Temperature Cycling Test Temperature Cycling Test
    Oct 12, 2024
    Temperature Cycling Test Temperature Cycling, in order to simulate the temperature conditions encountered by different electronic components in the actual use environment, changing the ambient temperature difference range and rapid rise and fall temperature change can provide a more stringent test environment, but it must be noted that additional effects may be caused to material testing. For the relevant international standard test conditions of temperature cycle test, there are two ways to set the temperature change. Macroshow Technology provides an intuitive setting interface, which is convenient for users to set according to the specification. You can choose the total Ramp time or set the rise and cooling rate with the temperature change rate per minute. List of international specifications for temperature cycling tests: Total Ramp time (min) : JESD22-A104, MIL-STD-8831, CR200315 Temperature variation per minute (℃/min) : IEC 60749, IPC-9701, Bellcore-GR-468, MIL-2164 Example: Lead-free solder joint reliability test Instructions: For the reliability test of lead-free solder joints, different test conditions will also be different in terms of the temperature change setting mode. For example, (JEDEC JESD22-A104) will specify the temperature change time with the total time [10min], while other conditions will specify the temperature change rate with [10℃/ min], such as from 100 ℃ to 0℃. With a temperature change of 10 degrees per minute, that is to say, the total temperature change time is 10 minutes. 100℃ [10min]←→0℃[10min], Ramp: 10℃/ min, 6500cycle -40℃[5min]←→125℃ [5min], Ramp: 10min, 200cycle check once, 2000cycle tensile test [JEDEC JESD22-A104] -40℃(15min)←→125℃(15min), Ramp: 15min, 2000cycle Example: LED Automotive lighting (High Power LED) The temperature cycle test condition of LED car lights is -40 ° C to 100 ° C for 30 minutes, the total temperature change time is 5 minutes, if converted into temperature change rate, it is 28 degrees per minute (28 ° C /min). Test conditions: -40℃(30min)←→100℃(30min), Ramp: 5min  
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  • Reliability Environmental Test Equipment Combined with Multi-track Temperature Control and Detection Applications Reliability Environmental Test Equipment Combined with Multi-track Temperature Control and Detection Applications
    Oct 12, 2024
    Reliability Environmental Test Equipment Combined with Multi-track Temperature Control and Detection Applications Environmental test equipment includes constant temperature and humidity test chamber, hot and cold shock test chamber, temperature cycle test chamber, no wind oven... These test equipment are all in the simulated environment of temperature, humidity impact on the product, to find out the design, production, storage, transportation, use process may appear product defects, previously only simulated test area air temperature, but in the new international standards and the new test conditions of the international factory, the beginning of the requirements based on the air temperature is not. It is the surface temperature of the test product. In addition, the surface temperature should also be measured and recorded synchronously during the test process for post-test analysis. The relevant environmental test equipment should be combined with surface temperature control and the application of surface temperature measurement is summarized as follows. Constant temperature and humidity test chamber test table temperature detection application: Description: Constant temperature and humidity test chamber in the test process, combined with multi-track temperature detection, high temperature and humidity, condensation (condensation), combined temperature and humidity, slow temperature cycle... During the test process, the sensor is affixed to the surface of the test product, which can be used to measure the surface temperature or internal temperature of the test product. Through this multi-track temperature detection module, the set conditions, actual temperature and humidity, the surface temperature of the test product, and the same measurement and record can be integrated into a synchronous curve file for subsequent storage and analysis. Thermal shock test chamber surface temperature control and detection applications: [dwell time based on surface temperature control], [temperature shock process surface temperature measurement record] Description: The 8-rail temperature sensor is attached to the surface of the test product and applied to the temperature shock process. The dwell time can be counted backward according to the arrival of the surface temperature. During the impact process, the setting conditions, the test temperature, the surface temperature of the test product, and the same measurement and record can be integrated into a synchronous curve. Temperature cycle test chamber surface temperature control and detection application: [Temperature cycle temperature variability and dwell time are controlled according to the test product surface temperature] Description: Temperature cycle test is different from temperature shock test. Temperature shock test uses the maximum energy of the system to carry out temperature changes between high and low temperatures, and its temperature change rate is as high as 30 ~ 40℃ /min. Temperature cycle test requires a process of high and low temperature changes, and its temperature variability can be set and controlled. However, the new specification and the test conditions of international manufacturers have begun to require that the temperature variability refers to the surface temperature of the test product, not the air temperature, and the current temperature cycle specification temperature variability control. According to the test product surface specifications are [JEDEC-22A-104F, IEC60749-25, IPC9701, ISO16750, AEC-Q100, LV124, GMW3172]... In addition, the residence time of high and low temperatures can also be based on the test surface, rather than the air temperature. Temperature cyclic stress screening test chamber surface temperature control and detection applications: Instructions: Temperature cycle stress screening testing machine, combined with multi-rail temperature measurement, in the temperature variability of stress screening, you can choose to use [air temperature] or [test product surface temperature] to control the temperature variability, in addition, in the high and low temperature resident process, the time reciprocal can also be controlled according to the surface of the test product. In accordance with the relevant specifications (GJB1032, IEST) and the requirements of international organizations, according to the definition of GJB1032 in the stress screening residence time and temperature measurement point, 1. The number of thermocouples fixed on the product shall not be less than 3, and the temperature measurement point of the cooling system shall not be less than 6, 2. Ensure that the temperature of 2/3 thermocouples on the product is set at ±10℃, in addition, according to the requirements of IEST(International Association for Environmental Science and Technology), the residence time should reach the temperature stabilization time plus 5min or performance test time. No air oven (natural convection test chamber) surface temperature detection application: Description: Through the combination of a windless oven (natural convection test chamber) and a multi-track temperature detection module, the temperature environment without fan (natural convection) is generated, and the relevant temperature detection test is integrated. This solution can be applied to the actual ambient temperature test of electronic products (such as: Cloud server, 5G, electric vehicle interior, indoor without air conditioning environment, solar inverter, large LCD TV, home Internet sharer, office 3C, laptop, desktop, game console....... Etc.).    
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  • Purpose of Temperature Shock Test Purpose of Temperature Shock Test
    Oct 11, 2024
    Purpose of Temperature Shock Test Reliability environmental test In addition to high Temperature, low temperature, high temperature and high humidity, temperature and humidity combined cycle, temperature Shock (cold and hot Shock) is also a common test project, temperature shock Testing (Thermal Shock Testing, Temperature Shock Testing, referred to as: TST), the purpose of the temperature shock test is to find out the design and process defects of the product through the severe temperature changes that exceed the natural environment [temperature variability greater than 20℃/min, and even up to 30 ~ 40℃/min], but there is often a situation where the temperature cycle is confused with the temperature shock. "Temperature cycle" means that in the process of high and low temperature change, the temperature change rate is specified and controlled; The temperature change rate of "temperature shock" (hot and cold shock) is not specified (Ramp Time), mainly requires Recovery Time, according to the IEC specification, there are three kinds of temperature cycle test methods [Na, Nb, NC]. Thermal shock is one of the three [Na] test items [rapid temperature change with specified conversion time; medium: air], the main parameters of temperature shock (thermal shock) are: High temperature and low temperature conditions, residence time, return time, number of cycles, in high and low temperature conditions and residence time the current new specification will be based on the surface temperature of the test product, rather than the air temperature in the test area of the test equipment. Thermal shock test chamber: It is used to test the material structure or composite material, in an instant under the continuous environment of extremely high temperature and extremely low temperature, the degree of tolerance, so as to test the chemical changes or physical damage caused by thermal expansion and contraction in the shortest time, the applicable objects include metal, plastic, rubber, electronic.... Such materials can be used as the basis or reference for the improvement of its products. The cold and thermal shock (temperature shock) test process can identify the following product defects: Different expansion coefficient caused by the stripping of the joint Water enters after cracking with different expansion coefficient Accelerated test for corrosion and short circuit caused by water infiltration According to the international standard IEC, the following conditions are common temperature changes: 1. When the equipment is transferred from a warm indoor environment to a cold outdoor environment, or vice versa 2. When the equipment is suddenly cooled by rain or cold water 3. Installed in the outside airborne equipment (such as: automobile, 5G, outdoor monitoring system, solar energy) 4. Under certain transport [car, ship, air] and storage conditions [non-air-conditioned warehouse] Temperature impact can be divided into two types of two-box impact and three-box impact: Instructions: Temperature impact is common [high temperature → low temperature, low temperature → high temperature] way, this way is also called [two-box impact], another so-called [three-box impact], the process is [high temperature → normal temperature → low temperature, low temperature → normal temperature → high temperature], inserted between the high temperature and low temperature, to avoid adding a buffer between the two extreme temperatures. If you look at the specifications and test conditions, there is usually a normal temperature condition, the high and low temperature will be extremely high and very low, in the military specifications and vehicle regulations will see that there is a normal temperature impact condition. IEC temperature shock test conditions: High temperature: 30, 40, 55, 70, 85, 100, 125, 155℃ Low temperature: 5, -5, -10, -25, -40, -55, -65℃ Residence time: 10min, 30min, 1hr, 2hr, 3hr(if not specified, 3hr) Temperature shock residence time description: The Dwell Time of temperature shock in addition to the requirements of the specification, some will depend on the weight of the test product and the surface temperature of the test product The specifications of the thermal shock residence time according to weight are: GJB360A-96-107, MIL-202F-107, EIAJ ED4701/100, JASO-D001... Let's wait. The thermal shock residence time is based on the surface temperature control specifications: MIL-STD-883K, MIL-STD-202H(air above the test object) MIL883K-2016 requirements for [temperature shock] specification: 1. After the air temperature reaches the set value, the surface of the test product needs to arrive within 16 minutes (residence time is not less than 10min). 2. High temperature and low temperature impact are more than the set value, but not more than 10℃. Follow-up action of IEC temperature shock test Reason: The IEC temperature test method is best considered as part of a series of tests, because some failures may not be immediately apparent after the test method is completed. Follow-up test items: IEC60068-2-17 Tightness test IEC60068-2-6 Sinusoidal vibration IEC60068-2-78 Steady Humid heat IEC60068-2-30 Hot and humid temperature cycle Tin whisker (whisker) temperature impact test conditions finishing: 1. - 55 (+ 0 / -) 10 ℃ please - 85 (+ / - 0) 10 ℃, 20 min / 1 cycle (500 cycle check again) 1000 cycles, 1500 cycles, 2000 cycles, 3000 cycles 2. 85(±5)℃←→-40(+5/-15)℃, 20min/1cycle, 500cycles 3.-35±5℃←→125±5℃, dwell for 7min, 500±4cycles 4. - 55 (+ 0 / -) 10 ℃ please - 80 (+ / - 0) 10 ℃, 7 min reside, 20 min / 1 cycle, 1000 cycles Thermal shock testing machine product features: Defrosting frequency: defrosting every 600cycles [Test condition: +150℃ ~ -55℃] Load adjustment function: The system can automatically adjust according to the load of the product to be tested, without manual setting High weight load: Before the equipment leaves the factory, use aluminum IC(7.5Kg) for load simulation to confirm that the equipment can meet the demand Temperature shock Sensor location: The air outlet and return air outlet in the test area can be selected or both can be installed, which conforms to the MIL-STD test specification. In addition to meeting the requirements of the specification, it is also closer to the impact effect of the test product during the test, reducing the test uncertainty and distribution uniformity.
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  • VMR- plate Temperature Cycle Transient Break Test VMR- plate Temperature Cycle Transient Break Test
    Oct 11, 2024
    VMR- plate Temperature Cycle Transient Break Test Temperature cycle test is one of the most commonly used methods for reliability and life test of lead-free welding materials and SMD parts. It evaluates the adhesive parts and solder joints on the surface of SMD, and causes plastic deformation and mechanical fatigue of solder joints materials under the fatigue effect of cold and hot temperature cycle with controlled temperature variability, so as to understand the potential hazards and failure factors of solder joints and SMD. The Daisy chain diagram is connected between the parts and the solder joints. The test process detects the on-off and on-off between the lines, parts and solder joints through the high-speed instantaneous break measuring system, which meets the demand for the reliability test of electrical connections to evaluate whether the solder joints, tin balls and parts fail. This test is not really simulated. Its purpose is to apply severe stress and accelerate the aging factor on the object to be tested to confirm whether the product is designed or manufactured correctly, and then evaluate the thermal fatigue life of the component solder joints. The reliability test of the electrical high-speed instantaneous break connection has become a key link to ensure the normal operation of the electronic system and avoid the failure of the electrical connection caused by the failure of the immature system. The resistance changes over a short period of time were observed under accelerated temperature changes and vibration tests. Purpose: 1. Ensure that products designed, manufactured and assembled meet predetermined requirements 2. Relaxation of solder joint creep stress and SMD fracture failure caused by thermal expansion difference 3. The maximum test temperature of the temperature cycle should be 25℃ lower than the Tg temperature of the PCB material, so as to avoid more than one damage mechanism of the substitute test product 4. Temperature variability at 20℃/min is a temperature cycle, and temperature variability above 20℃/min is a temperature shock 5. The welding joint dynamic measurement interval does not exceed 1min 6. The high temperature and low temperature residence time for failure determination needs to be measured in 5 strokes Requirements: 1. The total temperature time of the test product is within the range of the rated maximum temperature and the minimum temperature, and the length of the residence time is very important for the accelerated test, because the residence time is not enough during the accelerated test, which will make the creep process incomplete 2. The resident temperature must be higher than Tmax temperature and lower than Tmin temperature Refer to the list of specifications: IPC-9701, IPC650-2.6.26, IPC-SM-785, IPCD-279, J-STD-001, J-STD-002, J-STD-003, JESD22-A104, JESD22-B111, JESD22-B113, JESD22-B117 , SJR-01
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  • Industrial Computer Reliability Testing Industrial Computer Reliability Testing
    Oct 11, 2024
    Industrial Computer Reliability Testing Industrial computers can be divided into three categories according to their application attributes: (1) Board class: includes Single Board Computer (SBC), Embedded board (Embedded Board), Black Plane, PC/104 module. (2) Subsystem class: includes single-board computers, boards, chassis, power supplies and other peripherals combined into operational subsystems, such as industrial servers and workstations. (3) System integration solutions: refers to a set of systems developed for a professional field, including the required software and hardware and surrounding, such as automatic teller machines (ATMs). The application of industrial computers widely covers ATM, POS, medical electronic equipment, game machines, gambling equipment, etc. The multi-field industry makes industrial computers must be able to withstand the use of sunlight, high and low temperature, wet and other environments, so the relevant reliability test is the focus of various manufacturers in the research and development test. Common reliability tests for industrial computers: (1) Wide temperature test According to the actual application environment can be divided into four categories: 1. Outdoor: especially for the extreme low temperature or high temperature areas, such as northern Europe and desert countries, the temperature range can be from -50 to 70°C; 2. Enclosed space: for example, where heat sources are generated, such as next to a boiler, the high temperature range is about 70°C; 3. Mobile equipment: such as vehicle equipment, the high temperature can be up to 90°C according to the car area; 4. Special harsh environment: such as aerospace equipment, military, oil drilling equipment. (2) Aging stress test The temperature range is from -40°C to 85°C, and the temperature variation rate is 10 °C per minute for cyclic testing (3) No wind high temperature test At present, in order to prevent dust, industrial computers are planned to be closed and fanless in the mechanism design, so more and more manufacturers begin to pay attention to high temperature testing in a windless environment to ensure that high temperatures will not collapse Note: For complete industrial computer test conditions, please consult LAB COMPANION  
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  • Accelerated Test of Die Casting at High Temperature and High Humidity Accelerated Test of Die Casting at High Temperature and High Humidity
    Oct 11, 2024
    Accelerated Test of Die Casting at High Temperature and High Humidity Die casting is a precision casting method, the principle is to melt the better metal [zinc, tin, lead, copper, magnesium, aluminum]... Six kinds of alloy melting, with rapid high pressure mechanical properties into the metal mold, the use of steel mold low temperature rapid solidification molding casting method, die casting is a pressure casting parts, can be manufactured into auto parts, locomotive parts, LED lamps and LED street lights, consumer electronics parts, cameras, mobile phones, communications... In order to confirm whether the die-casting parts can be satisfied with the outdoor environment for a long time and whether there will be related defects, relevant tests need to be carried out through the HAST highly accelerated life testing machine. Common defects in die casting: cold insulation, cracks, holes List of common specifications for die casting: ASTM B85: Standard for pressed Film Casting of aluminum alloys ASTM B86: Zinc and zinc aluminum alloys ASTM B176: Copper Alloy die castings ASTM B894: Zinc-Copper-Aluminum Alloy die casting ASTM E155: Standard Reference Radiographs for the inspection of Aluminum & Magnesium castings ASTM B94: Magnesium Alloy mold standard GB5680: high manganese steel casting GB9438: Aluminum alloy casting GB15114: Aluminum alloy die casting QC273: Technical specifications for automotive zinc alloy aluminum alloy copper alloy die casting parts YL-J021201: die casting of aluminum alloy cover plate for machine cooler Die casting test items: metallographic test, mechanical ability, bending test, hardness test, impact test, tensile test, high temperature and high humidity, chemical composition, non-damage inspection (X-ray, fluorescence), residual element analysis, surface defects, dimensional tolerance, microstructure, weight tolerance, air tightness test Die casting Performance test - high temperature and high humidity accelerated test: PCT condition: 120℃/100%R.H. HAST condition: 130℃/85%R.H. Common missing after high temperature and high humidity accelerated test of die casting: Die casting in the manufacturing process, if the cleaning is not true, resulting in residual release agent, cutting fluid, saponification fluid on the surface... Such corrosive substances, or other pollutants, under certain temperature and humidity conditions, it is easy to accelerate oxidation or mold, die-casting test product surface with a layer of white powder or yellow, black are oxidation phenomenon.    
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  • EC-85EXT, Superior constant temperature bath (800L) Specifications EC-85EXT, Superior constant temperature bath (800L) Specifications
    Nov 13, 2014
    EC-85EXT, Superior constant temperature bath (800L)Specifications Project Type Series EXT Function Temperature occurs in a way Dry ball method Temperature range -70 ~ + 150 ℃ Temperature variation amplitude Below the + 100℃ ± 0.3 ℃ Above the + 101℃ ± 0.5 ℃ Temperature distribution Below the + 100℃ ± 0. 7 ℃ Above the + 101℃ ± 1.0 ℃ The temperature drops the time +125 ~-55 ℃ Within 36 minutes (10℃ / minute mean temperature change) Temperature rise time -55 ~+125 ℃ Within 36 minutes (10℃ / minute mean temperature change) The internal volume of the uterus was tested 800L Test room inch method (width, depth and height) 1000mm × 800mm × 1000mm Product inch method (width, depth and height) 1470mm × 2240mm × 2000mm Make the material  External outfit  Test room control panel machine room Cold interductile steel plate is dark gray Inside Stainless steel plate (SUS304,2B polished) Broken heat material Test room Hard synthetic resin glass wool door Hard synthetic resin foam cotton, glass cotton Project Type Series EXT Cooling dehumidifying device  Cooling-down method Mechanical section shrinkage and freezing mode and binary freezing mode  Cooling medium Single segment side R404A Binary high temperature / low temperature side R404A / R23 Cooling and dehumidifier Multi-channel mixed heat sink type The condenser (water-cooled) Calorifier Form Nickel-chromium heat-resistant alloy heater Blower Form Stir fan  Controllerl The temperature is set -72.0 ~ +152.0 ℃ Time setting Fanny 0 ~ 999 Time 59 minutes (programmed type)0 ~ 20000 Time 59 minutes (value) Set decomposition energy   Temperature  0.1 ℃ ,Time of 1 minute Indicate accuracy Temperature ± 0.8℃ (typ.), time ± 100 PPM Vacation type Value or program Stage number 20-stage / 1 program The number of procedures The maximum number of incoming force (RAM) programs is 32 programs The maximum number of internal ROM programs is 13 programs Round-trip number Maximum of 98 or unlimited Number of round-trip repeats Maximum 3 time Displace the end Pt 100Ω ( at 0 ℃ ),grade ( JIS C 1604-1997 ) Control action When splitting the PID action Endovirus function Early delivery function, standby function, setting value maintenance function, power outage protection function, Power action selection function, maintenance function, transportation round-trip function, Time delivery function, time signal output function, overrising and overcooling prevention function, Abnormal representation function, external alarm output function, setting paradigm representation function, Transport type selection function, the calculation time represents the function, the slot lamp lamp function Project Type Series EXT Control panel Equipment machine LCD operating panel (type contact panel), Represents lamp (power, transport, abnormal), test power supply terminal, external alarm terminal, Time signal output terminal, power cord connector  Protective device Refrigerating cycle Overload protection device, high blocking device Calorifier Temperature over-rise protection device, temperature fuse Blower Overload protection device Control panel Leakage breaker for power supply, fuse (heater,), Fuse (for operating loop), temperature rise protection device (for testing), Temperature rise overcooling prevention device (test material, in microcomputer) Pay belongs to the product Test material shed shed by * 8 Stainless steel shed (2), shed receiving (4) Fuse Operating loop Protection Fuses (2) Operating specification (1 )  Else Bolus (Cable hole: 1) Equipment products Adventitia Hard borosilicate glass270mm× 190mm 1   Cable hole Bore size 50mm 1   The trough inside the lamp AC100V 15W White hot ball 1   Wheel   6   Horizontal adjustment   6   Electrovirus characteristics Source  * 5.1 AC Three-phase  380V  50Hz Maximum load current 60 A Capacity of the leakage breaker for the power supply 80A Sensory current  30mA Power distribution thickness 60mm2 Rubber insulation hose Coarseness of grounding wire 14mm2  Cooling water * 5.3 Water yield 5000 L /h (When the cooling water inlet temperature is 32℃) Water pressure 0.1 ~ 0.5MPa Side pipe diameter of the device PT1 1/4  Tubing  drain-pipe   * 5.4 PT1/2 Product weight 700kg  
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  • Inverter- Reliability Test Inverter- Reliability Test
    Oct 11, 2024
    Inverter- Reliability Test Inverter- reliability test also known as voltage converter, its function is to convert DC low voltage into AC high voltage, some electronic equipment must be driven by AC power, but we provide is DC power, at this time you must use the Inverter, direct current into alternating current to drive the electronic parts. Inverter- reliability test also known as voltage converter, its function is to convert DC low voltage into AC high voltage, some electronic equipment must be driven by AC power, but we provide is DC power, at this time you must use the Inverter, direct current into alternating current to drive the electronic parts. Relevant test conditions: Item temperature time other Initial test at normal temperature 25 ℃ TIME≥2 hours - Low temperature initial test 0 ℃ or -5 °C TIME≥2 hours - High temperature initial test 60℃ TIME≥2 hours - High temperature and high humidity test 40℃/95%RH 240 hours - High temperature storage test 70℃ TIME≥96 hours or 240 hours - Low temperature storage test -1 -20°C TIME≥96 hours - Low temperature storage test -2 -40℃ 240 hours - High temperature and high humidity storage test 40℃/90%RH TIME≥96 hours - Temperature cycle test -20℃~ 70℃ 5 cycle Room temperature ↓-20 ℃(4 hours)↓ Room temperature (90%RH.4 hours)↓70°C(4 hours)↓ Room temperature (4 hours) High temperature load test 55 ℃ equivalent load, 1,000 hours - Life test 40°C MTBF≥40000 hours - on/off test (power cycle) - - 1min:on, 1min:off, 5,000 cycles using equivalent load Vibration test - - Acceleration 3q, frequency 10~55HZ, X, Y, Z three directions 10 minutes each, a total of 30 minutes Impact test - - Acceleration of 80g, 10 ms each time, Three times in X, Y, Z directions Note 1: The tested module should be placed at normal (15~35° C,45~65%RH) for one hour before testing Applicable equipment: 1. High and low temperature test chamber 2. High temperature and high humidity test chamber 3. Rapid temperature cycle test chamber                
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  • EC-85MHPM-W, High load corresponding constant temperature and humidity tank (800L) EC-85MHPM-W, High load corresponding constant temperature and humidity tank (800L)
    Nov 13, 2014
    EC-85MHPM-W, High load corresponding constant temperature and humidity tank (800L) Project Type Series MHPM-W Function Temperature and humidity mode The way of wet ball Temperature range -40 ~ + 100 ℃ Humidity range 20 ~ 98%RH (According to the anaphase 3 items) Changes in temperature and humidity ± 0.3 ℃ / ±2.5%RH Temperature and humidity distribution ± 0.5 ℃ / ±5.0%RH The temperature drops the time +20 ~ -40 ℃ Within 75 minutes Temperature rise time -40 ~ + 100 ℃ Within 50 minutes The internal volume of the uterus was tested 800 L Test room inch method (width, depth and height) 1000mm × 800mm × 1000mm Product inch method (width, depth and height) 1400mm × 1190mm × 1795mm Make the material External outfit Test room control panel machine room Cold steel plate, cold steel plate beige (Color table 2.5Y8 / 2) Inside Stainless steel plate (SUS304,2B polished) Broken heat material Test room Hard synthetic resin ― Door Hard synthetic resin foam cotton, glass cotton Project Type Series MHPM-W Cooling removal, wet device  Cooling-down method Mechanical section shrinkage mode  Cooling medium R404A The oneself can shrink machine Output (number of staff) 1.5kW (1) Cooling and dehumidifier Multi-channel mixed heat sink type The condenser Multi-channel mixed radiator sink (air cooling) Calorifier Form Nickel-chromium heat-resistant alloy heater Volume 3.5kW   Humidifier Form Steam generation Volume 1.8Kw×2 Blower Form Multi-channel mixed radiator sink (air cooling) Motor capacity 40W Feed water unit The water supply cylinder Water supply method Water quality Pure water * Automatic water supply ("Please refer to the automatic water supply.") Volume  Gravity type Moisturizing disk  Gravity type Controller Temperature setting range -42.0 ~ + 102.0 ℃ Humidity setting range 0 ~ 98%RH (Dry Bulb Temperature 10 ~ 85 ℃ ) Time set range 0 ~ 999Time of 59 min(Program setting type) 0 ~ 20000 Time of 59 min(The value type) Set decomposition energy Temperature 0.1℃, humidity 1% RH for 1 min Indicate accuracy Temperature ± 0.8℃ (tp.), humidity ± 1% RH (tp.), time ± 100 PPM Vacation type Value or program Stage number 20-stage / 1 program The number of procedures The maximum number of incoming force (RAM) programs is 32 programs The maximum number of internal ROM programs is 13 programs Round-trip number  98 times maximum or unlimited Number of round-trip repeats Maximum 3 heavy Displace the end Pt 100Ω ( at 0 ℃ ), grade B( JIS C 1604-1997 ) Control action When splitting the PID action Internal function Early delivery function, standby function, setting value maintenance function, power outage protection function, Power action selection function, maintenance function, transportation round-trip function, Time delivery function, time signal output function, overrising and overcooling prevention function, Abnormal representation function, external alarm output function, setting paradigm representation function, Transport type selection function, the calculation time represents the function, the slot lamp lamp function Project Type Series MHPM-W Control panel Equipment machine LCD operating panel (type contact panel), Represents lamp (power, transport, abnormal), test power supply terminal, external alarm terminal, Time signal output terminal, power cord connector  Protective device Refrigerating cycle Overload protection device, high blocking device Calorifier Temperature over-rise protection device, temperature fuse Humidifier Air burning prevention device, humidifying disc water level regulator Blower Overload protection device Control panel Leakage breaker for power supply, fuse (for heater, humidifier), Fuse (for operating loop), temperature rise protection device (for testing), Temperature rise overcooling prevention device (test material, in microcomputer) Offproducts (sets) House receiver (4), house board (2), wet ball wick (15), operation manual (1) Equipment products Adventitia Hard borosilicate glass  800mm× 800mm 2 Cable hole Bore size 50mm 1 The trough inside the lamp AC100V 15W White hot ball 2 Wheel   4 Horizontal adjustment   4 Electrovirus characteristics Source  AC   three-phase 380V 50Hz Maximum load current 25A Capacity of the leakage breaker for the power supply 50A Sensory current 30mA Power distribution thickness 14mm2 Rubber insulation hose Coarseness of grounding wire 5.5mm2 Tubing Drain-pipe PT1/2 Product quality 550kg
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  • Comprehensive test box Comprehensive test box
    Oct 10, 2024
    Comprehensive test box Equipment features: Can be connected to a vertical vibration table or to both vertical and horizontal vibration tables simultaneously; You can choose functions such as device lifting and device translation; High strength and high reliability structural design - ensuring the high reliability of the equipment; The studio material is SUS304 stainless steel - with strong corrosion resistance, cold and hot fatigue function, and long service life; High density polyurethane foam insulation material - ensuring minimal heat loss; Surface spraying treatment - ensuring the long-lasting anti-corrosion function and appearance life of the equipment; High strength heat-resistant silicone rubber sealing strip - ensures high sealing performance of equipment doors; Multiple optional functions (such as test holes, recorders, water purification systems, etc.) ensure that users have multiple functions and testing needs; Large area electric anti frost observation window and concealed lighting - can provide good observation effect; Environmentally friendly refrigerants - ensure that equipment better meets your environmental protection requirements; Customizable size/usage indicators/various optional functions according to user requirements Temperature control Can achieve temperature constant control and program control; The full process data recorder (optional function) can achieve full process recording and traceability of the experimental process; Each motor is equipped with overcurrent (overheating) protection/heater short-circuit protection to ensure high reliability of air flow and heating during equipment operation; USB interface and Ethernet communication function enable the device's communication and software expansion functions to meet various customer needs; Adopting the internationally popular cooling control mode, the compressor cooling power can be automatically adjusted from 0% to 100%, reducing energy consumption by 30% compared to the traditional heating balance temperature control mode; The key components of refrigeration and electrical control are all made of internationally renowned brand products, which improves and ensures the overall quality of the equipment; The equipment meets the following standards GB/T 10592-2008 Technical Conditions for High and Low Temperature Test Chambers GB/T 10586-2006 Technical Conditions for Damp Heat Test Chamber GB/T 2423.1-2008 Environmental Testing for Electric and Electronic Products - Part 2: Test Methods - Test A: Low Temperature GB/T 2423.2-2008 Environmental Testing for Electric and Electronic Products - Part 2: Test Methods - Test B: High Temperature GB/T 2423.3-2006 Environmental Testing for Electric and Electronic Products - Part 2: Test Methods - Test Cab: Constant Damp Heat Test GB/T 2423.4-2008 Environmental Testing for Electric and Electronic Products - Part 2: Test Methods - Test Db: Alternating Damp Heat (12h+12h Cycle) GB/T 2423.22-2008 Environmental testing for electrical and electronic products - Part 2: Test methods - Test N: Temperature changes GB/T 5170.1-2008 General Principles for Inspection Methods of Environmental Testing Equipment for Electrical and Electronic Products GJB 150.3A-2009 Military Equipment Laboratory Environmental Test Methods Part 3: High Temperature Test GJB 150.4A-2009 Military Equipment Laboratory Environmental Test Methods Part 4: Low Temperature Test GJB 150.9A-2009 Military Equipment Laboratory Environmental Test Methods Part 9: Damp Heat Test Choosing different vibration table bodies can meet different vibration standard test methods (e.g. GB/T 2423.35-2005, GB/T 2423.36-2005, etc.). Three comprehensive test chambers; Temperature, humidity, and vibration three comprehensive test chamber; Technical specifications for temperature/humidity/vibration/three comprehensive testing equipment. model THV-500 THV-1000 THV-1500 inside dimension D 700 900 1250 W 800 1150 1150 H 900 1100 1100 Size of connecting the vibration table(mm) Horizontal stand ≤400*400 Vertical platform≤Φ400 Horizontal stand ≤600*600 Vertical platform≤Φ600 Single vertical platform≤Φ630mm Horizontal stand ≤900*900 Vertical platform≤Φ900 Motor cover height(mm) 235 Source AC380V.50HZ Three-phase four-wire system + grounding wire Standard layout One product manual, one test report, one quality certificate and quality guarantee, 2 panels, 2 strips, one blind board, one set of interface board, one set of silicone rubber soft plug Structure Hull Surspray of cold rolled steel plate (ivory white)  Inner tank Stainless steel sheet and plate Heat insulating material Polyurethane foaming Refrigeration Refrigeration method Refrigeration mode of stacked compressor (water cooled) Refrigerator German valley wheel semi-closed compressor Observation window (mm)    400*500  Instrument connection (mm) One on the left and right sidesΦ100 Controller Color LCD display touch screen Recording device Temperature and humidity recorder (optional)  Communication interface The RS485 interface. The RS232 interface. Upper position computer operation software (optional)
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