High Temperature Aging Cabinet
High temperature aging cabinet is a type of aging equipment used to remove early failure of non-conforming product parts.
Use of temperature aging cabinet, aging oven:
This test equipment is a test equipment for aviation, automobile, home appliances, scientific research and other fields, which is used to test and determine the parameters and performance of electrical, electronic and other products and materials after temperature environment changes in high temperature, low temperature, alternating between temperature and humidity or constant temperature and humidity.
The chamber of the test equipment is sprayed with steel plate after treatment, and the spray color is optional, generally beige. SUS304 mirror stainless steel is used in the inner room, with a large window tempered glass, real-time observation of internal aging products.
Features of temperature aging cabinet, aging oven:
1. PLC processing industry touch screen programming combination control, balanced temperature control system: aging specimen room temperature rise start the ventilation fan, balance the sample heat, aging cabinet is divided into product area and load area
2. PID+SSR temperature control system: according to the temperature change in the specimen box, the heat of the heating tube is automatically adjusted to achieve the temperature balance, so that the heating heat of the system is equal to its heat loss and achieve the temperature balance control, so it can run stably for a long time; The fluctuation of temperature control is less than ±0.5℃
3. The air transport system is composed of three-phase asynchronous electronic multi-wing wind wheel and wind drum. The wind pressure is large, the wind speed is uniform, and the uniformity of each temperature point is met
4. High precision PT100 platinum resistance for temperature acquisition, high accuracy for temperature acquisition
5. Load control, the load control system provides ON/OFF control and timing control two functional options to meet the different test requirements of the product
(1)ON/OFF function introduction: The switch time, stop time, and cycle times can be set, the test product can be switched according to the setting requirements of the system, the stop cycle control, the aging cycle number reaches the set value, the system will automatically sound and light prompt
(2) Timing control function: the system can set the running time of the test product. When the load starts, the product power supply starts timing. When the actual timing time reaches the time set by the system, the power supply to the product is stopped
6. System operation safety and stability: The use of PLC industrial touch screen control system, stable operation, strong anti-interference, convenient program change, simple line. Perfect alarm protection device (see protection mode), real-time monitoring of the operating status of the system, with the function of automatic maintenance of temperature data during operation, in order to query the temperature historical data when the product is aging, the data can be copied to the computer through the USB interface for analysis (format is EXCEL), with historical data curve display function, It intuitively reflects the temperature change in the product area during the product test, and its curve can be copied to the computer in BMP format through the USB interface, so as to facilitate the operator to make the test product report. The system has the function of fault query, the system will automatically record the alarm situation, when the equipment fails, the software will automatically pop up the alarm screen to remind the cause of the fault and its solution; Stop the power supply to the test product to ensure the safety of the test product and the equipment itself, and record the fault situation and occurrence time for future maintenance.
Thermal Cycling Test(TC) & Thermal Shock Test(TS)
Thermal Cycling Test(TC):
In the life cycle of the product, it may face various environmental conditions, which makes the product appear in the vulnerable part, resulting in product damage or failure, and then affect the reliability of the product.
A series of high and low temperature cycling tests are done on the temperature change at the temperature variation rate of 5~15 degrees per minute, which is not a real simulation of the actual situation. Its purpose is to apply stress to the test piece, accelerate the aging factor of the test piece, so that the test piece may cause damage to the system equipment and components under environmental factors, in order to determine whether the test piece is correctly designed or manufactured.
Common ones are:
Electrical function of the product
The lubricant deteriorates and loses lubrication
Loss of mechanical strength, resulting in cracks and cracks
The deterioration of the material causes chemical action
Scope of application:
Module/system product environment simulation test
Module/System Product Strife test
PCB/PCBA/ Solder Joint Accelerated Stress Test (ALT/AST)...
Thermal Shock Test(TS):
In the life cycle of the product, it may face various environmental conditions, which makes the product appear in the vulnerable part, resulting in product damage or failure, and then affect the reliability of the product.
High and low temperature shock tests under extremely harsh conditions on rapid temperature changes at a temperature variability of 40 degrees per minute are not truly simulated. Its purpose is to apply severe stress to the test piece to accelerate the aging factor of the test piece, so that the test piece may cause potential damage to the system equipment and components under environmental factors, in order to determine whether the test piece is correctly designed or manufactured.
Common ones are:
Electrical function of the product
The product structure is damaged or the strength is reduced
Tin cracking of components
The deterioration of the material causes chemical action
Seal damage
Machine specifications:
Temperature range: -60 ° C to +150 ° C
Recovery time: < 5 minutes
Inside dimension: 370*350*330mm (D×W×H)
Scope of application:
PCB reliability acceleration test
Accelerated life test of vehicle electric module
LED parts accelerated test...
Effects of temperature changes on products:
The coating layer of components falls off, the potting materials and sealing compounds crack, even the sealing shell cracks, and the filling materials leak, which causes the electrical performance of components to decline.
Products composed of different materials, when the temperature changes, the product is not evenly heated, resulting in product deformation, sealing products cracking, glass or glassware and optics broken;
The large temperature difference makes the surface of the product condense or frost at low temperature, evaporates or melts at high temperature, and the result of such repeated action leads to and accelerates the corrosion of the product.
Environmental effects of temperature change:
Broken glass and optical equipment.
The movable part is stuck or loose.
Structure creates separation.
Electrical changes.
Electrical or mechanical failure due to rapid condensation or freezing.
Fracture in a granular or striated manner.
Different shrinkage or expansion characteristics of different materials.
The component is deformed or broken.
Cracks in surface coatings.
Air leak in the containment compartment.
Semiconductor Chip-Car Gauge Chip
A new energy vehicle is divided into several systems, MCU belongs to the body control and vehicle system, is one of the most important systems.
MCU chips are divided into 5 levels: consumer, industrial, vehicle gauge, QJ, GJ. Among them, the car gauge chip is the current vane product. So what does the car gauge chip mean? From the name, it can be seen that the car gauge chip is the chip used in the car. Different from ordinary consumer and industrial chips, the reliability and stability of the car gauge chip is extremely important, so as to ensure the safety of the car at work.
The certification standard of the car gauge level chip is AEC-Q100, which contains four temperature levels, the smaller the number, the higher the level, the higher the requirements for the chip.
It is precisely because the requirements of the car gauge chip are so high, it is necessary to carry out a strict Burn In test before the factory, BI test requires the use of professional BI oven, our BI oven can meet the BI test of today's car gauge chip.
Connect the EMS system, so that each batch of baked chips can be traced at any time. High temperature and low temperature vacuum anaerobic environment, real-time monitoring of baking curve to ensure baking safety and effect.
Vibrational Verification for Functionality(VVF)
In the vibration generated during transportation, freight boxes are susceptible to complex dynamic pressures, and the resonant response generated is violent, which may cause packaging or product failure. Identifying the critical frequency and the type of pressure on the package will minimize this failure. Vibration testing is the assessment of the vibration resistance of components, components and complete machines in the expected transport, installation and use environment.
Common vibration modes can be divided into sinusoidal vibration and random vibration. Sinusoidal vibration is a test method often used in the laboratory, which mainly simulates the vibration generated by rotation, pulsation and oscillation, as well as the resonance frequency analysis and resonance point residence verification of the product structure. It is divided into sweep frequency vibration and fixed frequency vibration, and its severity depends on the frequency range, amplitude value and test duration. Random vibration is used to simulate the overall structural seismic strength assessment of the product and the shipping environment in the packaged state, with the severity depending on the frequency range, GRMS, test duration and axial orientation.
Vibration can not only loosen the lamp components, so that the internal relative displacement, resulting in de-welding, poor contact, poor working performance, but also make the components produce noise, wear, physical failure and even component fatigue.
To this end, Lab Companion launched a professional "LED lamp vibration test" business to simulate the vibration or mechanical shock that may occur in the actual transportation, installation and use environment of the lamp, evaluate the vibration resistance of the LED lamp and the stability of its related performance indicators, and find the weak link that may cause damage or failure. Improve the overall reliability of LED products and improve the failure status of the industry due to transportation or other mechanical shocks.
Service customers: LED lighting factory, lighting agents, lighting dealers, decoration companies
Test method:
1, the LED lamp sample packaging placed on the vibration test bench;
2, the vibration speed of the vibration tester is set to 300 RPM, the amplitude is set to 2.54 cm, start the vibration meter;
3, the lamp according to the above method in the upper and lower, left and right, front and back three directions respectively test for 30 minutes.
Results evaluation: After the vibration test, the lamp can not occur parts falling off, structural damage, lighting and other abnormal phenomena.
Double 85 Constant Temperature And Humidity Reliability Environmental Test (THB)
First, high temperature and humidity test
WHTOL (Wet High Temperature Operating Life) is a common environmental stress acceleration test, usually 85℃ and 85% relative humidity, which is generally carried out in accordance with the standard IEC 60068-2-67-2019. The test conditions are shown in the chart.
Second, the test principle
"Double 85 test" is one of the reliability environmental tests, mainly used for constant temperature and humidity box, that is, the temperature of the box is set to 85℃, the relative humidity is set to 85%RH conditions, to accelerate the aging of the test product. Although the test process is simple, the test is an important method to evaluate many characteristics of the test product, so it has become an indispensable reliability environmental test condition in various industries.
After aging the product under the condition of 85℃/85%RH, compare the performance changes of the product before and after aging, such as the photoelectric performance parameters of the lamp, the mechanical properties of the material, yellow index, etc., the smaller the difference, the better, so as to test the heat and moisture resistance of the product.
The product may have thermal failure when working in a continuous high temperature environment, and some moisture sensitive devices will fail in a high humidity environment. The dual 85 test can test the thermal stress generated by the product under high humidity and its ability to resist long-term moisture penetration. For example, the frequent failure of various products in the humid weather period in the south is mainly due to the poor temperature and humidity resistance of the products.
3. Experimental factors
In the LED lighting industry, many manufacturers have used the double 85 test results as an important means to judge the quality of lamps. Various possible reasons why LED lamps fail the dual 85 test are:
1. Lamp power supply: poor heat resistance of shell, danger of short circuit in circuit, failure of protection mechanism, etc.
2. Lamp structure: unreasonable design of heat dissipation body, installation problems, materials are not resistant to high temperature.
3. Lamp light source: poor moisture resistance, packaging adhesive aging, high temperature resistance.
If you encounter a special use environment, such as the working environment temperature is severe, you need to test its high and low temperature resistance, the test method can refer to the high and low temperature test project.
4. Serve customers
01. Customer group
LED lighting factory, LED power plant, LED packaging factory
02. Means of detection
Constant temperature and humidity test chamber
03. Reference standards
Constant temperature and humidity tests for electrical and electronic products -- Environmental testing -- Part 2: Test methods -- Test Cab: Constant temperature and humidity test GB/T 2423.3-2006.
04. Service content
4.1 Refer to the standard, conduct double 85 test on the product, and provide the third party's test results report.
4.2 Provide the analysis and improvement plan of the product through the double 85 test.
Reliability Test
AEC-Q102 Test Certification Fixed Damp Heat with Humidity Cycling (FMG), LED lamp reliability test method (GB/T 33721-2017), Component screening Ammonia test CAF test, Flame retardant grade Cyclic corrosion test (CCT), Mechanical shock test, High pressure cooker test (PCT), Highly Accelerated Stress Testing (HAST), High and low temperature and humidity test (THB), Hydrogen sulfide test (H2S), Liquid tank thermal shock test (TMSK), Component humidity sensitive grade test (MSL), Screening for high reliability use Hot flash test + acoustic sweep screening for high reliability use (MSL+SAT), LED luminaires reliability test scheme, Vibration test (VVF), Temperature cycle/thermal shock test (TC/TS), LED red Ink test UV aging test, LED light source anti-vulcanization test, Double 85 constant temperature and humidity reliability environmental test (THB), Salt spray test check.
Burn-in Oven
Burn-in is an electrical stress test that employs voltage and temperature to accelerate the electrical failure of a device. Burn-in essentially simulates the operating life of the device, since the electrical excitation applied during burn-in may mirror the worst-case bias that the device will be subjected to in the course of its useable life. Depending on the burn-in duration used, the reliability information obtained may pertain to the device's early life or its wear-out. Burn-in may be used as a reliability monitor or as a production screen to weed out potential infant mortalities from the lot.
Burn-in is usually done at 125 deg C, with electrical excitation applied to the samples. The burn-in process is facilitated by using burn-in boards (see Fig. 1) where the samples are loaded. These burn-in boards are then inserted into the burn-in oven (see Fig. 2), which supplies the necessary voltages to the samples while maintaining the oven temperature at 125 deg C. The electrical bias applied may either be static or dynamic, depending on the failure mechanism being accelerated.
Figure 1. Photo of Bare and Socket-populated Burn-in Boards
The operating life cycle distribution of a population of devices may be modeled as a bath tub curve, if the failures are plotted on the y-axis against the operating life in the x-axis. The bath tub curve shows that the highest failure rates experienced by a population of devices occur during the early stage of the life cycle, or early life, and during the wear-out period of the life cycle. Between the early life and wear-out stages is a long period wherein the devices fail very sparingly.
Figure 2. Burn-in ovens
Early life failure (ELF) monitor burn-in, as the name implies, is performed to screen out potential early life failures. It is conducted for a duration of 168 hours or less, and normally for only 48 hours. Electrical failures after ELF monitor burn-in are known as early life failures or infant mortality, which means that these units will fail prematurely if they were used in their normal operation.
High Temperature Operating Life (HTOL) Test is the opposite of ELF monitor burn-in, testing the reliability of the samples in their wear-out phase. HTOL is conducted for a duration of 1000 hours, with intermediate read points at 168 H and 500 H.
Although the electrical excitation applied to the samples are often defined in terms of voltages, failure mechanisms accelerated by current (such as electromigration) and electric fields (such as dielectric rupture) are understandably accelerated by burn-in as well.
High Temperature Furnace Inspection Index
What is the high temperature furnace test standard? What metrics are tested? How long is the detection cycle? Which items are tested?
Test items (reference) :
Temperature uniformity test, system accuracy test, temperature, system accuracy, temperature uniformity, high temperature furnace verification and calibration, high temperature furnace (tube furnace) verification and calibration, box resistance furnace (high temperature furnace, heat treatment furnace) verification and calibration, high temperature furnace (box resistance furnace, dry furnace, heat treatment furnace) verification and calibration, silica
List of testing standards:
1, NCS/ CJ M61; SAE AMS 2750; JJF1376 High temperature furnace calibration specification NCS/ CJ M61, high temperature furnace calibration method SAE AMS 2750E, box type resistance furnace calibration specification JJF1376
2, AMS 2750F High temperature measurement AMS 2750F
3, GB 25576-2010 Food safety national standard Food additive silica (high temperature furnace method)
4, JJF 1184 thermocouple verification furnace temperature field test technical specification
5, AMS 2750E high temperature measurement AMS 2750E
6, AMS 2750F high temperature determination method 3.5
7, AMS 2750G high temperature measurement AMS 2750G
8, AMS 2750E high temperature determination method 1
9. JJF 1376; AMS 2750; JJG 276 Calibration specification for box type resistance furnace JJF 1376, high temperature measurement method AMS 2750E, high temperature creep, durable strength testing machine verification regulation JJG 276
10, JJF 1376 box type resistance furnace calibration specification
11, GB/T 9452-2012 heat treatment furnace effective heating zone determination method 1
12. SAE AMS 2750 high-temperature calibration method F
Lab Companion-Rapid Temperature Cycling Test Chamber
Introduction of Lab Companion
With over 20 years of experience, Lab Companion is a world class manufacturer of environmental chambers and an accomplished supplier of turn-key test systems and equipment. All our chambers build on Lab Companion’s reputation for long life and exceptional reliability.
With a scope of design, manufacture and service, Lab Companion has established a quality management system that complies with the International Quality System Standard ISO 9001:2008. Lab Companion’s equipment calibration program is accredited to the International Standard ISO 17025 and the American National Standard ANSI/NCSL-Z-540-1 by A2LA. A2LA is a full member and signatory of the International Laboratory Accreditation Cooperation (ILAC), the Asia Pacific Laboratory Accreditation (APLAC) and the European Cooperation for Accreditation (EA).
Lab Companion’s SE-Series Environmental Test Chambers offer a significantly enhanced airflow system, which provides better gradients and improved product temperature change rates. These chambers utilize Thermotron’s flagship 8800 Programmer/Controller featuring a high resolution 12.1” flat panel display with touch screen user interface, expanded capabilities to graph, data log, edit, access on-screen help, and long term hard drive data storage.
Not only do we offer the highest quality products, we also provide ongoing support designed to keep you up and running long after the initial sale. We provide factory direct local service with an extensive inventory of the parts you might need.
Performance
Temperature range: -70°C to +180°C
Performance: With 23 Kg aluminum load (IEC60068-3-5), the rising rate from +85°C to -40°C is 15℃/min; the cooling rate from -40°C to +85°C is15℃/min too.
Temperature control：± 1°C Dry bulb temperatures from control point after stabilization at the control sensor
Performance is based on an ambient condition of 75°F (23.9°C) and 50% RH
Cooling/Heating Performance based on measurement at the control sensor in the supply air stream
Constructure
Interior
Nonmagnetic Series 300 stainless steel with a high nickel content
Internal seams heliarc welded for hermetic sealing of the liner
Corners and seams designed to allow for expansion and contraction under the temperature extremes encountered
Condensate drain located in the liner floor and under the conditioning plenum
Chamber base is fully welded
“Ultra-Lite” non-settling fiberglass insulation
One adjustable interior stainless steel shelf is standard
Exterior
Die-formed treated sheet steel
Metal access covers provided for easy opening doors to electrical components
Finish water-based, air dry lacquer, sprayed over a cleaned and primed surface
Easy lift-off hinged access doors for servicing the refrigeration system
One 12.5 cm diameter access port with interior weld and removable insulating plug mounted in right hand side wall accessories on hinged door for easy access
Features
Chamber Operation clearly displays helpful run-time information
Graphing Screen offers expanded capabilities, enhanced programming and reporting
System Status displays crucial refrigeration system parameters
Program Entry makes it easy to load, view and edit profiles
Set Up quick-step wizards make profile entry easy
Pop-up Refrigeration Charts for handy reference
Therm-Alarm® provides over & under temperature alarm protection
Activity Log Screen provides comprehensive equipment history
Web Server allows internet access to equipment via Ethernet
User-Friendly Pop-up Key Pad makes data entry quick and easy
Includes:
- Four USB Ports-two External & two Internal
- Ethernet
- RS-232
Technical specifications
1-4 independently programmable channels
Measuring Accuracy: 0.25% of span typical
Selectable °C or °F temperature scale
12.1” (30 cm) color flat panel touch screen display
Resolution: 0.1°C, 0.1%RH, 0.01 for other linear applications
Real time clock included
Sample Rate: Process variable sampled every 0.1 seconds
Proportional Band: Programmable 1.0° to 300°
Control Method: Digital
Intervals: Unlimited
Interval Resolution: 1 sec to 99 hrs,59 min with 1 second resolution
- RS-232
- 10+ Years Data Storage
- Product Temperature Control
- Event Relay Board
Operating Modes: Automatic or Manual
Program Storage: Unlimited
Program Loops:
- Up to 64 loops per program
Loops can be repeated up to 9,999 times program
- Up to 64 nested loops are allowed per
The Relationship Between the Altitude of the Standard Atmosphere and Air Temperature and Pressure
The standard atmosphere referred to here refers to the "1964, ICAO Standard atmosphere" adopted by the International Civil Aviation Organization. Below an altitude of 32 km, it is the same as "1976, U.S. standard atmosphere". Changes in air temperature near the surface (below 32 km) are:
Ground: The air temperature is 15.0℃, the air pressure P=1013.25mb= 0.101325MPa
Temperature change rate from ground to elevation 11 km: -6.5 ℃/ km
On the 11km interface:
The air temperature is -56.5 ℃ and the air pressure P=226.32mb
Temperature change rate at elevations of 11-20 km: 0.0℃/ km
Temperature change rate at altitude 20-32 km: +1.0/ km
The following table lists the temperature and pressure values of the standard atmosphere at different altitudes. In the table, "gpm" is the altitude meter, and its negative sign represents the altitude
Gpm
Temperature℃
Atmospheric pressure(mb)
Gpm
Temperature℃
Atmospheric pressure(mb)
Gpm
Temperature℃
Atmospheric pressure(mb)
-400
17.6
1062.2
4800
-16.2
554.8
10000
-50.0
264.4
-200
16.3
1037.5
5000
-17.5
540.2
10200
-51.3
256.4
0
15.0
1013.3
5200
-18.8
525.9
10400
-52.6
248.6
200
13.7
989.5
5400
-20.1
511.9
10600
-53.9
241.0
400
12.4
966.1
5600
-21.4
498.3
10800
-55.2
233.6
600
11.1
943.2
5800
-22.7
484.9
11000
-56.5
226.3
800
9.8
920.8
6000
-24.0
471.8
11500
-56.5
209.2
1000
8.5
898.7
6200
-25.3
459.0
12000
-56.5
193.3
1200
7.2
877.2
6400
-26.6
446.5
12500
-56.5
178.7
1400
5.9
856.0
6600
-27.9
434.3
13000
-56.5
165.1
1600
4.6
835.2
6800
-29.2
422.3
13500
-56.5
152.6
1800
3.3
814.9
7000
-30.5
410.6
14000
-56.5
141.0
2000
2.0
795.0
7200
-31.8
399.2
14500
-56.5
130.3
2200
0.7
775.4
7400
-33.1
388.0
15000
-56.5
120.5
2400
-0.6
756.3
7600
-34.4
377.1
15500
-56.5
111.3
2600
-1.9
737.5
7800
-35.7
366.4
16000
-56.5
102.9
2800
-3.2
719.1
8000
-37.0
356.0
17000
-56.5
87.9
3000
-4.5
701.1
8200
-38.3
345.8
18000
-56.5
75.0
3200
-5.8
683.4
8400
-39.6
335.9
19000
-56.5
64.1
3400
-7.1
666.2
8600
-40.9
326.2
20000
-56.5
54.7
3600
-8.4
649.2
8800
-42.2
316.7
22000
-54.5
40.0
3800
-9.7
632.6
9000
-43.5
307.4
24000
-52.5
29.3
4000
-11.0
616.4
9200
-44.8
298.4
26000
-50.5
21.5
4200
-12.3
600.5
9400
-46.1
289.6
28000
-48.5
15.9
4400
-13.6
584.9
9600
-47.4
281.0
30000
-46.5
11.7
4600
-14.9
569.7
9800
-48.7
272.6
32000
-44.5
8.7
Unit conversion relation
1mbar=100Pa=0.1KPa=0.0001 Mpa
1ft=0.3048m=304.8mm
55000ft*0.3048=16764m
Lab Companion focused on the production of reliability environmental test equipment for 19 years, successfully helped 18,000 enterprises to test the reliability and environmental performance of products and materials.
The main products are: high temperature test chamber, high and low temperature and humidity test chamber, walk-in environmental test chamber, rapid temperature cycling test chamber, thermal shock test chamber, high and low temperature low pressure test chamber, vibration of the comprehensive chamber and other test equipment manufacturing solutions to help enterprises R & D bigger and stronger!
If you need to know more about the products of the environmental test chamber, you can search the official website of "Lab Companion", feel free to contact us for consultation, we can provide you with one-on-one professional technical advice and guidance.
ESS Environmental Stress Screening Test Chamber
The full horizontal air supply system from right to left with large air volume is adopted, so that all specimen cars and specimens on the test are charged and divided, and the heat exchange is completed evenly and quickly.
◆ The utilization rate of test space is as high as 90%
◆ The special design of "uniform horizontal air flow system" of ESS equipment is the patent of Ring measurement.
Patent number: 6272767
◆ Equipped with air volume regulation system
◆ Unique turbine circulator (air volume can reach 3000~ 8000CFM)
◆ Floor type structure, convenient loading and unloading of tested products
◆ According to the special structure of the tested product, the box suitable for installation is used
◆ The control system and refrigeration system can be separated from the box, which is easy to plan or do noise reduction in the laboratory
◆ Adopt cold balance temperature control, more energy saving
◆ Equipment adopts the world's top brand Sporlan refrigeration valve with high reliability and long life
◆ The refrigeration system of the equipment adopts thickened copper pipe
◆ All the strong electric parts are made of high temperature resistant wires, which has higher safety
Reliability Testing Acceleration Testing
Most semiconductor devices have lifetimes that extend over many years at normal use. However, we cannot wait years to study a device; we have to increase the applied stress. Applied stresses enhance or accelerate potential fail mechanisms, help identify the root cause, and help labcompanion take actions to prevent the failure mode.
In semiconductor devices, some common accelerants are temperature, humidity, voltage, and current. In most cases, the accelerated testing does not change the physics of the failure, but it does shift the time for observation. The shift between accelerated and use condition is known as ‘derating.’
Highly accelerated testing is a key part of JEDEC based qualification tests. The tests below reflect highly accelerated conditions based on JEDEC spec JESD47. If the product passes these tests, the devices are acceptable for most use cases.
Temperature Cycle
Per the JESD22-A104 standard, temperature cycling (TC) subjects the units to extreme high and low temperatures transitions between the two. The test is performed by cycling the unit's exposure to these conditions for a predetermined number of cycles.
High Temperature Operating Life (HTOL)
HTOL is used to determine the reliability of a device at high temperature while under operating conditions. The test is usually run over an extended period of time according to the JESD22-A108 standard.
Temperature Humidity Bias/Biased Highly Accelerated Stress Test (BHAST)
According to the JESD22-A110 standard, THB and BHAST subject a device to high temperature and high humidity conditions while under a voltage bias with the goal of accelerating corrosion within the device. THB and BHAST serve the same purpose, but BHAST conditions and testing procedures enable the reliability team to test much faster than THB.
Autoclave/Unbiased HAST
Autoclave and Unbiased HAST determine the reliability of a device under high temperature and high humidity conditions. Like THB and BHAST, it is performed to accelerate corrosion. Unlike those tests, however, the units are not stressed under a bias.
High Temperature Storage
HTS (also called Bake or HTSL) serves to determine long-term reliability of a device under high temperatures. Unlike HTOL, the device is not under operating conditions for the duration of the test.
Electrostatic Discharge (ESD)
Static charge is an unbalanced electrical charge at rest. Typically, it is created by insulator surfaces rubbing together or pulling apart; one surface gains electrons, while the other surface loses electrons. The result is an unbalanced electrical condition known as static charge.
When a static charge moves from one surface to another, it becomes Electrostatic Discharge (ESD) and moves between the two surfaces in a form of a miniature lightning bolt.
When a static charge moves, it becomes a current that can damage or destroy gate oxide, metal layers, and junctions.
JEDEC tests ESD in two different ways:
1. Human Body Mode (HBM)
A component level stress developed to simulate the action of a human body discharging accumulated static charge through a device to ground.
2. Charged Device Model (CDM)
A component level stress that simulates charging and discharging events that occur in production equipment and processes, per the JEDEC JESD22-C101 specification.
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